JPS509757A - - Google Patents

Info

Publication number: JPS509757A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP6143673A

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-06-02

Filing date

1973-06-02

Publication date

1975-01-31

1973-06-02 Application filed filed Critical

1973-06-02 Priority to JP6143673A priority Critical patent/JPS509757A/ja

1975-01-31 Publication of JPS509757A publication Critical patent/JPS509757A/ja

Status Pending legal-status Critical Current

Links

Landscapes

Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

JP6143673A 1973-06-02 1973-06-02 Pending JPS509757A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP6143673A JPS509757A (en)	1973-06-02	1973-06-02

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP6143673A JPS509757A (en)	1973-06-02	1973-06-02

Publications (1)

Publication Number	Publication Date
JPS509757A true JPS509757A (en)	1975-01-31

Family

ID=13171002

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP6143673A Pending JPS509757A (en)	1973-06-02	1973-06-02

Country Status (1)

Country	Link
JP (1)	JPS509757A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02146791A (en) *	1988-11-28	1990-06-05	Mitsubishi Mining & Cement Co Ltd	Hermetic package structure having multi-layered wiring circuit for hybrid integrated circuit and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3549784A (en) *	1968-02-01	1970-12-22	American Lava Corp	Ceramic-metallic composite substrate

1973
- 1973-06-02 JP JP6143673A patent/JPS509757A/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3549784A (en) *	1968-02-01	1970-12-22	American Lava Corp	Ceramic-metallic composite substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02146791A (en) *	1988-11-28	1990-06-05	Mitsubishi Mining & Cement Co Ltd	Hermetic package structure having multi-layered wiring circuit for hybrid integrated circuit and manufacture thereof

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