TWI408461B - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
TWI408461B
TWI408461B TW099115786A TW99115786A TWI408461B TW I408461 B TWI408461 B TW I408461B TW 099115786 A TW099115786 A TW 099115786A TW 99115786 A TW99115786 A TW 99115786A TW I408461 B TWI408461 B TW I408461B
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TW
Taiwan
Prior art keywords
opening
backlight module
heat
light
light guide
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TW099115786A
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Chinese (zh)
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TW201142429A (en
Inventor
Hsin Tse Tsai
Chiao Chih Yang
Po Chun Huang
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Young Lighting Technology Corp
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Priority to TW099115786A priority Critical patent/TWI408461B/en
Priority to US13/040,271 priority patent/US8708540B2/en
Publication of TW201142429A publication Critical patent/TW201142429A/en
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Publication of TWI408461B publication Critical patent/TWI408461B/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

A backlight module includes a back plate, a light guide plate, a heat insulation layer, a heat dissipation member, and a light source device. The back plate has a first surface, a second surface opposite to the first surface, and an opening passing through the back plate. The light guide plate is disposed on the first surface, the heat insulation layer is disposed on the second surface, and the heat dissipation member is disposed on the heat insulation layer. The light source device is connected to the heat dissipation member and protrudes from the first surface to face the light guide plate through the opening.

Description

背光模組Backlight module

本發明是有關於一種光學裝置，且特別是有關於一種背光模組。The present invention relates to an optical device, and more particularly to a backlight module.

隨著電子產業日益發達，平面顯示器已逐漸將陰極射線管顯示器淘汰而成為目前的主流。在平面顯示器中，又以液晶顯示器的技術較為純熟且普及化。然而，由於液晶顯示器的液晶顯示面板本身無法發光，故在液晶顯示面板下方設置有背光模組以提供光源，進而達到顯示的功能。With the development of the electronics industry, flat panel displays have gradually eliminated the cathode ray tube display and become the current mainstream. In the flat panel display, the technology of the liquid crystal display is more sophisticated and popular. However, since the liquid crystal display panel of the liquid crystal display itself cannot emit light, a backlight module is disposed under the liquid crystal display panel to provide a light source, thereby achieving the display function.

在背光模組中，由多個發光二極體所組成之發光條會組裝於背板上，而發光二極體發光時會透過背板進行散熱。如此會導致背板較接近發光二極體的部分具有較高的溫度，且背板較遠離發光二極體的部分具有較低的溫度，使得背板因溫度分佈不均而彎曲變形，而讓發光二極體的光線進入導光板的角度產生偏差。台灣專利公告號M286937、M351369、及台灣專利公開號200628918揭露了與光源裝置相關的技術。In the backlight module, a light-emitting strip composed of a plurality of light-emitting diodes is assembled on the back plate, and the light-emitting diodes radiate heat through the back plate when the light-emitting diodes emit light. This causes the backing plate to have a higher temperature near the portion of the light emitting diode, and the backing plate has a lower temperature than the portion farther away from the light emitting diode, so that the backing plate is bent and deformed due to uneven temperature distribution, and The angle at which the light of the light-emitting diode enters the light guide plate is deviated. The technology related to the light source device is disclosed in Taiwan Patent Publication No. M286937, M351369, and Taiwan Patent Publication No. 200628918.

本發明提出一種背光模組，可降低其背板因溫度分佈不均而彎曲變形的程度。The invention provides a backlight module, which can reduce the degree of bending deformation of the back plate due to uneven temperature distribution.

本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

為達上述之一或部份或全部目的或是其他目的，本發明之一實施例提供一種背光模組，包括背板、導光板、絕熱層、散熱件及光源裝置。背板具有第一表面、相對於第一表面的第二表面及貫穿背板的開口。導光板配置於第一表面上；絕熱層配置於第二表面上；散熱件配置於絕熱層上。光源裝置連接於散熱件並透過開口從第一表面突伸出而面對導光板。To achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a backlight module including a back plate, a light guide plate, a heat insulating layer, a heat sink, and a light source device. The backing plate has a first surface, a second surface opposite the first surface, and an opening through the backing plate. The light guide plate is disposed on the first surface; the heat insulation layer is disposed on the second surface; and the heat dissipation member is disposed on the heat insulation layer. The light source device is coupled to the heat sink and protrudes from the first surface through the opening to face the light guide plate.

基於上述，本發明的上述實施例中具有至少以下其中一個優點，光源裝置並非直接連接於背板，而是連接於配置在絕緣層上的散熱件。絕熱層可避免光源裝置發光時產生的熱傳導至背板。藉此，可降低背板因溫度分佈不均而彎曲變形的程度，進而使光源裝置的光線進入導光板的角度不會因背板彎曲變形而有所偏差。Based on the above, the above embodiment of the present invention has at least one of the following advantages, and the light source device is not directly connected to the backing plate but is connected to the heat dissipating member disposed on the insulating layer. The heat insulating layer can prevent heat generated when the light source device emits light to be transmitted to the backing plate. Thereby, the degree of bending deformation of the back sheet due to uneven temperature distribution can be reduced, and the angle at which the light of the light source device enters the light guide plate is not deviated by the bending deformation of the back sheet.

為讓本發明之上述特徵和優點能更明顯易懂，下文特舉多個實施例，並配合所附圖式，作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之多個實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而非用來限制本發明。The foregoing and other objects, features, and advantages of the invention will be apparent from the Detailed Description The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

圖1為本發明一實施例之背光模組的局部剖視圖。圖2為圖1之背板的俯視圖。請參考圖1及圖2，本實施例的背光模組100包括背板110、導光板120、絕熱層130、散熱件142、光源裝置144及反射片150。背板110具有第一表面112、相對於第一表面112的第二表面114及貫穿背板110的開口116。導光板120配置於第一表面112上；絕熱層130配置於第二表面114上；散熱件142配置於絕熱層130上。反射片150配置於導光板120及背板110之間。1 is a partial cross-sectional view of a backlight module in accordance with an embodiment of the present invention. 2 is a top plan view of the backing plate of FIG. 1. Referring to FIG. 1 and FIG. 2 , the backlight module 100 of the present embodiment includes a back plate 110 , a light guide plate 120 , a heat insulating layer 130 , a heat sink 142 , a light source device 144 , and a reflective sheet 150 . The backing plate 110 has a first surface 112, a second surface 114 relative to the first surface 112, and an opening 116 extending through the backing plate 110. The light guide plate 120 is disposed on the first surface 112; the heat insulation layer 130 is disposed on the second surface 114; and the heat dissipation member 142 is disposed on the heat insulation layer 130. The reflection sheet 150 is disposed between the light guide plate 120 and the back plate 110.

光源裝置144連接於散熱件142並透過開口116從第一表面112突伸出而面對導光板120。藉此配置方式，隔絕於光源裝置144及背板110之間的絕熱層130可避免光源裝置144發光時產生的熱傳導至背板110，以降低背板110因溫度分佈不均而彎曲變形的程度，進而使光源裝置144的光線進入導光板120的角度不會因背板110彎曲變形而有所偏差。光源裝置144發光時產生的熱則可透過散熱件142傳遞至外界。The light source device 144 is connected to the heat sink 142 and protrudes from the first surface 112 through the opening 116 to face the light guide plate 120. In this way, the heat insulating layer 130 between the light source device 144 and the backing plate 110 can prevent heat generated when the light source device 144 emits light to be transmitted to the back plate 110, so as to reduce the degree of bending deformation of the back plate 110 due to uneven temperature distribution. Further, the angle at which the light of the light source device 144 enters the light guide plate 120 is not deviated by the bending deformation of the back plate 110. The heat generated when the light source device 144 emits light can be transmitted to the outside through the heat sink 142.

請參考圖1，詳細而言，本實施例的絕熱層130包括兩絕熱片132，兩絕熱片132貼附於第二表面114而位於開口116兩側，其中絕熱片132的材質例如為彈性材料，以藉其彈性變形特性填滿於背板110與散熱件142之間的間隙，避免外界灰塵進入背光模組100內部。此外，本實施例的光源裝置144包括基板144a及發光二極體元件144b，其中發光二極體元件144b例如為側光型發光二極體 元件(side view LED)。基板144a連接於散熱件142且對位於開口116。發光二極體元件144b配置於基板144a上且透過開口116從第一表面112突伸出而面對導光板120，以使發光二極體元件144b發出的光線能夠進入導光板120。Please refer to FIG. 1 . In detail, the heat insulating layer 130 of the present embodiment includes two heat insulating sheets 132 . The two heat insulating sheets 132 are attached to the second surface 114 and are located at two sides of the opening 116 . The material of the heat insulating sheet 132 is, for example, an elastic material. The gap between the back plate 110 and the heat sink 142 is filled by the elastic deformation characteristic to prevent external dust from entering the backlight module 100. In addition, the light source device 144 of the present embodiment includes a substrate 144a and a light emitting diode element 144b, wherein the light emitting diode element 144b is, for example, a side light type light emitting diode. Side view LED. The substrate 144a is coupled to the heat sink 142 and is located opposite the opening 116. The light emitting diode element 144b is disposed on the substrate 144a and protrudes from the first surface 112 through the opening 116 to face the light guide plate 120, so that the light emitted by the light emitting diode element 144b can enter the light guide plate 120.

然本發明不以此為限，亦可將正光型發光二極體元件(top view LED)應用於本發明。圖3為本發明另一實施例之背光模組的局部剖視圖，在圖3的實施例中，散熱件242包含第一散熱板242a及第二散熱板242b，光源裝置244則包括基板244a、發光二極體元件244b。發光二極體元件244b例如為正光型發光二極體元件。第二散熱板242b一體成形地連接於第一散熱板242a並透過開口216從背板210的第一表面212突伸出。基板244a連接於第二散熱板242b。發光二極體元件244b配置於基板244a上且面對導光板220，以使發光二極體元件244b發出的光線能夠進入導光板220。However, the present invention is not limited thereto, and a front view LED may be applied to the present invention. 3 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention. In the embodiment of FIG. 3, the heat sink 242 includes a first heat dissipation plate 242a and a second heat dissipation plate 242b, and the light source device 244 includes a substrate 244a and emits light. Diode element 244b. The light emitting diode element 244b is, for example, a positive light type light emitting diode element. The second heat dissipation plate 242b is integrally formed to be coupled to the first heat dissipation plate 242a and protrudes from the first surface 212 of the back plate 210 through the opening 216. The substrate 244a is connected to the second heat dissipation plate 242b. The light emitting diode element 244b is disposed on the substrate 244a and faces the light guide plate 220 such that light emitted from the light emitting diode element 244b can enter the light guide plate 220.

圖4為本發明另一實施例之背板的俯視圖。請參考圖4，相較於圖2之背板110的開口116為單一連續的開口，以暴露多個發光二極體元件144b，圖4之背板310是藉由多個開口316分別暴露多個發光二極體元件344b。本發明不對開口116(316)的型式加以限制，其可為任意適當之形狀或數量。4 is a top plan view of a backing plate according to another embodiment of the present invention. Referring to FIG. 4, the opening 116 of the backplane 110 of FIG. 2 is a single continuous opening to expose the plurality of LED components 144b. The backplane 310 of FIG. 4 is exposed by the plurality of openings 316 respectively. Light emitting diode elements 344b. The present invention does not limit the type of opening 116 (316), which can be any suitable shape or number.

更詳細而言，在圖1的實施例中，散熱件142具有開孔142a，絕熱層130具有對位於開孔142a的開孔130a，且背光模組100更包括鎖固件160。鎖固件160透過開孔142a及開孔130a將散熱件142鎖固於背板110上，進而將與散熱件142連結的光源裝置144鎖固於背板110上。值得注意的是，由於散熱件142、光源裝置144與背板110為彼此獨立的結構，且散熱件142與背板110以鎖固的方式相互組裝，因此有利於量產組裝且可提升維修上的方便性。此外，更可藉由其它方式進行鎖固，以下藉由圖式對此加以舉例說明。In more detail, in the embodiment of FIG. 1, the heat sink 142 has an opening 142a, the heat insulating layer 130 has an opening 130a opposite to the opening 142a, and the backlight module 100 further includes a locking member 160. The heat sink 142 is fixed to the back plate 110 through the opening 142a and the opening 130a, and the light source device 144 coupled to the heat sink 142 is locked to the back plate 110. It is to be noted that, since the heat dissipating member 142, the light source device 144 and the backing plate 110 are independent structures, and the heat dissipating member 142 and the backing plate 110 are assembled to each other in a locking manner, it is advantageous for mass production assembly and can improve maintenance. Convenience. In addition, the locking can be performed by other means, which will be exemplified by the following figures.

圖5為本發明另一實施例之背光模組的局部剖視圖。請參考圖5，在本實施例的背光模組400中包含背板410、導光板420、絕熱層430、散熱件442、光源裝置444。散熱件442具有開孔442a，絕熱層430具有對位於開孔442a的開孔430a，背板410具有對位於開孔430a的開孔410a。鎖固件460透過開孔442a、開孔430a及開孔410a將散熱件442鎖固於導光板420，進而將連接於散熱件442上的光源裝置444鎖固於導光板420上。FIG. 5 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention. Referring to FIG. 5 , the backlight module 400 of the present embodiment includes a back plate 410 , a light guide plate 420 , a heat insulating layer 430 , a heat sink 442 , and a light source device 444 . The heat sink 442 has an opening 442a, and the heat insulating layer 430 has an opening 430a opposite to the opening 442a, and the backing plate 410 has an opening 410a opposite to the opening 430a. The fastener 460 locks the heat sink 442 to the light guide plate 420 through the opening 442a, the opening 430a and the opening 410a, and then locks the light source device 444 connected to the heat sink 442 to the light guide plate 420.

在本實施例中，可將開孔410a的孔徑D1及開孔430a的孔徑D2設計為大於鎖固件460的外徑D3，且將背板410的開口416的寬度W2設計為大於光源裝置444的基板444a的寬度W1。藉由此設計方式，散熱件442以及連接於散熱件442上的光源裝置444，可隨著導光板420的受熱變形而沿方向V相對背板410平移，使發光二極體元件444b不會因導光板420的受熱變形而遭受擠壓。因此，發光二極體元件444b與導光板420之間可以不必預留供導光板420受熱變形的間隙，而可提高發光二極體元件444b與導光板420之間的耦合效率。In the present embodiment, the aperture D1 of the opening 410a and the aperture D2 of the opening 430a can be designed to be larger than the outer diameter D3 of the locking member 460, and the width W2 of the opening 416 of the backing plate 410 can be designed to be larger than that of the light source device 444. The width W1 of the substrate 444a. In this way, the heat sink 442 and the light source device 444 connected to the heat sink 442 can be translated in the direction V relative to the back plate 410 along with the heat deformation of the light guide plate 420, so that the light emitting diode element 444b is not caused by The light guide plate 420 is subjected to heat deformation and is subjected to extrusion. Therefore, it is not necessary to reserve a gap between the light-emitting diode element 444b and the light guide plate 420 for thermally deforming the light guide plate 420, and the coupling efficiency between the light-emitting diode element 444b and the light guide plate 420 can be improved.

圖6為本發明另一實施例之背光模組的局部剖視圖。相較於圖5的鎖固件460具有通孔420a，而鎖固件460鎖入通孔420a，圖6的導光板520則具有盲孔520a，而鎖固件560鎖入盲孔520a，本發明不對此加以限制。FIG. 6 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention. The lock 460 of FIG. 5 has a through hole 420a, and the lock 460 is locked into the through hole 420a. The light guide plate 520 of FIG. 6 has a blind hole 520a, and the lock 560 is locked into the blind hole 520a. Limit it.

綜上所述，在本發明的上述的至少一實施例中具有至少以下其中一個優點，光源裝置並非直接連接於背板，而是連接於散熱件上，並且散熱件與背板之間具有絕熱層，絕熱層可避免光源裝置發光時產生的熱傳導至背板。藉此，可降低背板因溫度分佈不均而彎曲變形的程度，進而使光源裝置的光線進入導光板的角度不會因背板彎曲變形而有所偏差。此外，於本發明之至少一實施例中，由於散熱件與背板為彼此獨立的結構並以鎖固的方式相互組裝，因此有利於量產組裝且可提升維修上的方便性。In summary, in at least one embodiment of the present invention, at least one of the following advantages, the light source device is not directly connected to the back plate, but is connected to the heat sink, and the heat sink is insulated from the back plate. The layer and the heat insulating layer can prevent heat generated when the light source device emits light to be transmitted to the back plate. Thereby, the degree of bending deformation of the back sheet due to uneven temperature distribution can be reduced, and the angle at which the light of the light source device enters the light guide plate is not deviated by the bending deformation of the back sheet. In addition, in at least one embodiment of the present invention, since the heat dissipating member and the backing plate are independent of each other and are assembled to each other in a locking manner, mass production assembly is facilitated and the convenience in maintenance can be improved.

再者，於本發明之至少一實施例中將散熱件與導光板相互固定，並且散熱件、光源裝置可相對背板移動，以使連接於散熱件上的光源裝置可隨著導光板的受熱變形而相對背板平移，讓發光二極體元件不會因導光板的受熱變形而遭受擠壓。因此，發光二極體元件與導光板之間可以不必預留供導光板受熱變形的間隙，而可提高發光二極體元件與導光板之間的耦合效率。另外，絕熱層的材質可選用具有彈性的材料，以使絕熱層藉其彈性變形特性填滿於背板與散熱件之間的間隙，避免外界灰塵進入背光模組內部。Furthermore, in at least one embodiment of the present invention, the heat dissipating member and the light guide plate are fixed to each other, and the heat dissipating member and the light source device are movable relative to the back plate, so that the light source device connected to the heat dissipating member can be heated with the light guide plate. The deformation is translated relative to the back plate, so that the light emitting diode element is not squeezed by the heat deformation of the light guide plate. Therefore, it is not necessary to reserve a gap between the light-emitting diode element and the light guide plate for heat deformation of the light guide plate, and the coupling efficiency between the light-emitting diode element and the light guide plate can be improved. In addition, the material of the heat insulating layer may be made of a material having elasticity, so that the heat insulating layer fills the gap between the back plate and the heat dissipating member by its elastic deformation property, and the outside dust is prevented from entering the inside of the backlight module.

惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。另外，本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外，摘要部分和標題僅是用來輔助專利文件搜尋之用，並非用來限制本發明之權利範圍。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

100、200、400．．．背光模組100, 200, 400. . . Backlight module

110、210、310、410．．．背板110, 210, 310, 410. . . Backplane

112．．．第一表面112. . . First surface

114．．．第二表面114. . . Second surface

116、216、316、416．．．開口116, 216, 316, 416. . . Opening

120、220、420、520．．．導光板120, 220, 420, 520. . . Light guide

130．．．絕熱層130. . . Insulation layer

130a、142a、410a、430a、442a．．．開孔130a, 142a, 410a, 430a, 442a. . . Opening

132．．．絕熱片132. . . Insulation film

144、244、444．．．光源裝置144, 244, 444. . . Light source device

142、242、442．．．散熱件142, 242, 442. . . Heat sink

242a．．．第一散熱板242a. . . First heat sink

242b．．．第二散熱板242b. . . Second heat sink

144a、244a、444a．．．基板144a, 244a, 444a. . . Substrate

144b、244b、344b、444b．．．發光二極體元件144b, 244b, 344b, 444b. . . Light-emitting diode component

150．．．反射片150. . . A reflective sheet

160、460、560．．．鎖固件160, 460, 560. . . Lock firmware

420a．．．通孔420a. . . Through hole

520a．．．盲孔520a. . . Blind hole

D1、D2．．．孔徑D1, D2. . . Aperture

D3．．．外徑D3. . . Outer diameter

V．．．方向V. . . direction

W1、W2．．．寬度W1, W2. . . width

圖1為本發明一實施例之背光模組的局部剖視圖。1 is a partial cross-sectional view of a backlight module in accordance with an embodiment of the present invention.

圖2為圖1之背板的俯視圖。2 is a top plan view of the backing plate of FIG. 1.

圖3為本發明另一實施例之背光模組的局部剖視圖。3 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention.

圖4為本發明另一實施例之背板的俯視圖。4 is a top plan view of a backing plate according to another embodiment of the present invention.

圖5為本發明另一實施例之背光模組的局部剖視圖。FIG. 5 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention.

圖6為本發明另一實施例之背光模組的局部剖視圖。FIG. 6 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention.

100．．．背光模組100. . . Backlight module

110．．．背板110. . . Backplane

112．．．第一表面112. . . First surface

114．．．第二表面114. . . Second surface

116．．．開口116. . . Opening

120．．．導光板120. . . Light guide

130．．．絕熱層130. . . Insulation layer

130a、142a．．．開孔130a, 142a. . . Opening

132．．．絕熱片132. . . Insulation film

142．．．散熱件142. . . Heat sink

144．．．光源裝置144. . . Light source device

144a．．．基板144a. . . Substrate

144b．．．發光二極體元件144b. . . Light-emitting diode component

150．．．反射片150. . . A reflective sheet

160．．．鎖固件160. . . Lock firmware

Claims (12)

一種背光模組，包括：一背板，具有一第一表面、相對於該第一表面的一第二表面及貫穿該背板的一開口；一導光板，配置於該第一表面上；一絕熱層，配置於該第二表面上；一散熱件，配置於該絕熱層下；以及一光源裝置，包括連接於該散熱件的一基板與配置於該基板上的一發光二極體元件，其中該發光二極體元件透過該開口從該第一表面突伸出而面對該導光板。 A backlight module, comprising: a first surface, a second surface opposite to the first surface; and an opening extending through the back surface; a light guide plate disposed on the first surface; a heat dissipating layer disposed on the second surface; a heat dissipating member disposed under the heat insulating layer; and a light source device including a substrate connected to the heat dissipating member and a light emitting diode element disposed on the substrate The light emitting diode element protrudes from the first surface through the opening to face the light guide plate. 如申請專利範圍第1項所述之背光模組，其中該絕熱層的材質為彈性材料。 The backlight module of claim 1, wherein the heat insulating layer is made of an elastic material. 如申請專利範圍第1項所述之背光模組，其中該基板對位於該開口。 The backlight module of claim 1, wherein the substrate pair is located at the opening. 如申請專利範圍第1項所述之背光模組，其中該散熱件包含一第一散熱板及一第二散熱板，該第二散熱板透過該開口從該第一表面突伸出，該基板連接於該第二散熱板。 The backlight module of claim 1, wherein the heat sink comprises a first heat sink and a second heat sink, and the second heat sink protrudes from the first surface through the opening, the substrate Connected to the second heat sink. 如申請專利範圍第4項所述之背光模組，其中該第一散熱板及該第二散熱板一體成形。 The backlight module of claim 4, wherein the first heat dissipation plate and the second heat dissipation plate are integrally formed. 如申請專利範圍第1項所述之背光模組，其中該絕熱層包括兩個絕熱片，該兩個絕熱片貼附於該第二表面而位於該開口的兩側。 The backlight module of claim 1, wherein the heat insulating layer comprises two heat insulating sheets attached to the second surface and located at two sides of the opening. 如申請專利範圍第1項所述之背光模組，其中該散 熱件具有一第一開孔，該絕熱層具有對位於該第一開孔的一第二開孔，且該背光模組更包括：一鎖固件，透過該第一開孔及該第二開孔將該散熱件鎖固於該背板上。 The backlight module of claim 1, wherein the The heat insulating member has a first opening, the heat insulating layer has a second opening opposite to the first opening, and the backlight module further includes: a locking member, the first opening and the second opening The hole locks the heat sink to the back plate. 如申請專利範圍第1項所述之背光模組，其中該散熱件具有一第一開孔，該絕熱層具有對位於該第一開孔的一第二開孔，該背板具有對位於該第二開孔的一第三開孔，且該背光模組更包括：一鎖固件，透過該第一開孔、該第二開孔及該第三開孔將該散熱件鎖固於該導光板上。 The backlight module of claim 1, wherein the heat sink has a first opening, the heat insulating layer has a second opening opposite to the first opening, and the back plate has a pair a third opening of the second opening, and the backlight module further includes: a locking member, the heat sink is locked to the guiding portion through the first opening, the second opening and the third opening On the light board. 如申請專利範圍第8項所述之背光模組，其中該第二開孔的一孔徑大於該鎖固件的一外徑，該第三開孔的一孔徑大於該鎖固件的該外徑，且該開口的一寬度大於該光源裝置的一寬度。 The backlight module of claim 8, wherein an aperture of the second opening is larger than an outer diameter of the locking member, a diameter of the third opening is larger than the outer diameter of the locking member, and A width of the opening is greater than a width of the light source device. 如申請專利範圍第8項所述之背光模組，其中該導光板具有一通孔，該鎖固件鎖入該通孔。 The backlight module of claim 8, wherein the light guide plate has a through hole, and the lock is locked into the through hole. 如申請專利範圍第8項所述之背光模組，其中該導光板具有一盲孔，該鎖固件鎖入該盲孔。 The backlight module of claim 8, wherein the light guide plate has a blind hole, and the lock is locked into the blind hole. 如申請專利範圍第1項所述之背光模組，更包括一反射片，配置於該導光板及該背板之間。 The backlight module of claim 1, further comprising a reflective sheet disposed between the light guide plate and the back plate.
TW099115786A 2010-05-18 2010-05-18 Backlight module TWI408461B (en)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013114947A (en) * 2011-11-30 2013-06-10 Panasonic Liquid Crystal Display Co Ltd Surface light source device
US8834006B2 (en) * 2012-07-24 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd Backlight module and liquid crystal display device
US9958600B2 (en) 2014-09-12 2018-05-01 Sakai Display Products Corporation Light-source device and display apparatus
WO2016163176A1 (en) * 2015-04-06 2016-10-13 ソニー株式会社 Lighting device and display device
CN106609957B (en) * 2015-10-22 2019-08-02 瑞仪(广州)光电子器件有限公司 Backlight module and display equipment with the backlight module
CN205071602U (en) * 2015-11-13 2016-03-02 乐视致新电子科技（天津）有限公司 Heat radiation structure and terminal
CN111258114A (en) * 2020-01-17 2020-06-09 海信视像科技股份有限公司 Display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101044427A (en) * 2004-08-18 2007-09-26 索尼株式会社 Heat radiator and display unit
TW200825555A (en) * 2006-12-08 2008-06-16 Chi Mei Optoelectronics Corp Back light module and liquid crystal display device
TWM353366U (en) * 2008-08-29 2009-03-21 Chunghwa Picture Tubes Ltd Liquid crystal display device
CN101583824A (en) * 2007-01-24 2009-11-18 夏普株式会社 Backlight structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2267378B (en) * 1992-05-22 1996-07-10 Nokia Mobile Phones Uk Illuminated LCD apparatus
JP3127774B2 (en) * 1995-03-31 2001-01-29 セイコーエプソン株式会社 Shielding material and liquid crystal display
WO2000072084A1 (en) * 1999-05-21 2000-11-30 Citizen Watch Co., Ltd. Liquid crystal display panel
KR100698046B1 (en) * 2002-12-24 2007-03-23 엘지.필립스 엘시디 주식회사 Backlight unit assembly
US7404680B2 (en) * 2004-05-31 2008-07-29 Ngk Spark Plug Co., Ltd. Optical module, optical module substrate and optical coupling structure
JP4674448B2 (en) 2004-06-14 2011-04-20 オムロン株式会社 Surface light source device and equipment using the device
TWM286937U (en) 2005-10-26 2006-02-01 Coretronic Corp Light module and liquid crystal display
TWI333571B (en) * 2005-11-11 2010-11-21 Coretronic Corp Backlight module
TW200746226A (en) * 2006-03-24 2007-12-16 Matsushita Electric Ind Co Ltd Fluorescent lamp, backlight unit and liquid crystal display
TW200743854A (en) * 2006-05-22 2007-12-01 Au Optronics Corp Backlight module and liquid crystal display including thereof
EP1876389A1 (en) * 2006-07-05 2008-01-09 LiteCorp Europe B.V. Lighting system for a display apparatus
US7948076B2 (en) * 2008-03-25 2011-05-24 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and vertical signal routing
TWM351369U (en) 2008-06-30 2009-02-21 Chunghwa Picture Tubes Ltd Backlight module
TWM351370U (en) 2008-07-02 2009-02-21 Chunghwa Picture Tubes Ltd Backlight module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101044427A (en) * 2004-08-18 2007-09-26 索尼株式会社 Heat radiator and display unit
TW200825555A (en) * 2006-12-08 2008-06-16 Chi Mei Optoelectronics Corp Back light module and liquid crystal display device
CN101583824A (en) * 2007-01-24 2009-11-18 夏普株式会社 Backlight structure
TWM353366U (en) * 2008-08-29 2009-03-21 Chunghwa Picture Tubes Ltd Liquid crystal display device

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