AT316116B - Method for producing a laminated body - Google Patents
Method for producing a laminated bodyInfo
- Publication number
- AT316116B AT316116B AT613369A AT613369A AT316116B AT 316116 B AT316116 B AT 316116B AT 613369 A AT613369 A AT 613369A AT 613369 A AT613369 A AT 613369A AT 316116 B AT316116 B AT 316116B
- Authority
- AT
- Austria
- Prior art keywords
- producing
- laminated body
- layers
- desc
- page number
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
- B29C70/504—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC] using rollers or pressure bands
- B29C70/506—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC] using rollers or pressure bands and impregnating by melting a solid material, e.g. sheet, powder, fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/251—Particles, powder or granules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
<Desc/Clms Page number 1>
EMI1.1
<Desc/Clms Page number 2>
zur HerstellungKunststoffpulver mechanisch oder mit Hilfe eines Fliesshettes aufträgt, wobei die Hilfsphase mit dem System mit reagiert bzw. eingebaut wird und nicht abgedunstet werden muss.
Vorrichtungen zur Durchführung des erfindungsgemässen Verfahrens werden im folgenden an Hand der
EMI2.1
:bedeutet dabei die Vorratsrollen für die einzelnen Schichtlagen --3--, mit --2-- sind die Auftragsvorrichtungen bezeichnet und mit--) 2-- die Fixiereinrichtungen. Die einzelnen Schichten werden nach dem Passieren der Fixiereinrichtung über die Umlenkrollen --4-- zu einem Paar Umlenkrollen --3--
EMI2.2
--5-- eingebracht. Sobaldder Presse angelangt sind. stoppt die gesamte Anlage und es erfolgt die gemeinsame Pressung der eingeführten Schichten. Nachdem die Pressung beendet ist, setzt sich die Anlage wiedetin Bewegung und die pulverbeschichteten Lagen gelangen in die Presse, während das fertig verpresste Material in eine Schncidmaschine
6- gelangen. Mit --7-- ist eine fertige Platte bezeichnet.
Fig. 2 zeigt eine Taktanlage mit elektrostatischem Auftrag. Der Aufbau dieser Anlage ist praktisch derselbe
EMI2.3
m Fig. i gctc*gn ; n Amaausgestaltet und bewegt sich im Takt hin und her.
Fig. 3 zeigt eine Taktanlage mit einer Hilfsphasen-Auftragsvorrichtung --10--. Die hochviskosen Stoffe werden durch Aufwalzen auf die einzelnen Schichten aufgebracht und anschliessend werden die vorbehandelten Schichren über Umlenkrollen --4-- durch ein aus polymerem Kunststoffpulver bestehendes Fliessbett -11-- geführt. Der übrige Aufbau der Anlage entspricht der in Fig. 1 dargestellten Anlage.
Durch das erfindungsgemässe Verfahren wird also ermöglicht, in einem Arbeitsgang Harzdurchtr. inkung und
EMI2.4
! also überhaupt weg. da ja die Schichtstoffeden ublichen Anlagen mit Trockenofen ist ein Antagenstopp praktisch unmöglich, da die Schichtstoffe sofort verbrennen wurden, falls das Abkühlen des Ofens nicht abgewartet wird. ir Erläuterung des erfindungsgemassen Verfahrens werden folgende Beispiele angeführt :
EMI2.5
i c t. tng verpresst.
Die nach diesem Verfahren hergestellten kupferkaschinerten Schichtstoffe können beispielsweise zur Herstellung von gedruckten Schaltungen verwendet werden.
EMI2.6
**WARNUNG** Ende DESC Feld kannt Anfang CLMS uberlappen**.
<Desc / Clms Page number 1>
EMI1.1
<Desc / Clms Page number 2>
Applying plastic powder mechanically or with the help of a Fliesshette, whereby the auxiliary phase reacts with the system or is incorporated and does not have to be evaporated.
Devices for carrying out the method according to the invention are described below with reference to the
EMI2.1
: means the supply rolls for the individual layers --3--, --2-- denotes the application devices and--) 2-- denotes the fixing devices. After passing through the fixing device, the individual layers are turned into a pair of deflection rollers --4--
EMI2.2
--5-- introduced. As soon as the press has arrived. the entire system stops and the layers introduced are pressed together. After pressing is finished, the system starts moving again and the powder-coated layers enter the press, while the finished pressed material is fed into a cutting machine
6- arrive. A finished plate is designated with --7--.
Fig. 2 shows a cycle system with electrostatic application. The structure of this system is practically the same
EMI2.3
m Fig. i gctc * gn; n Ama designed and moves back and forth in time.
Fig. 3 shows a cycle system with an auxiliary phase application device --10--. The highly viscous substances are applied to the individual layers by rolling and then the pretreated layers are passed over pulleys --4-- through a fluidized bed -11-- made of polymer plastic powder. The rest of the structure of the system corresponds to the system shown in FIG.
The method according to the invention thus makes it possible to penetrate resin in one operation. ininking and
EMI2.4
! so away at all. Since the laminates are used in the usual systems with drying ovens, it is practically impossible to stop the antagen because the laminates would burn immediately if the oven did not cool down. The following examples are given to explain the process according to the invention:
EMI2.5
i c t. tng pressed.
The copper-machined laminates produced by this process can be used, for example, for the production of printed circuits.
EMI2.6
** WARNING ** End of DESC field may overlap beginning of CLMS **.
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT613369A AT316116B (en) | 1969-06-27 | 1969-06-27 | Method for producing a laminated body |
AT603873A AT335721B (en) | 1969-06-27 | 1973-07-10 | METHOD OF MANUFACTURING A LAMINATED BODY |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT613369A AT316116B (en) | 1969-06-27 | 1969-06-27 | Method for producing a laminated body |
Publications (1)
Publication Number | Publication Date |
---|---|
AT316116B true AT316116B (en) | 1974-06-25 |
Family
ID=3583209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT613369A AT316116B (en) | 1969-06-27 | 1969-06-27 | Method for producing a laminated body |
Country Status (1)
Country | Link |
---|---|
AT (1) | AT316116B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3324302A1 (en) * | 1983-07-06 | 1985-01-24 | Santrade Ltd., Luzern | DEVICE FOR PRODUCING MULTI-LAYER LAMINATE PANELS |
EP0158027A2 (en) * | 1984-04-10 | 1985-10-16 | DIELEKTRA GmbH | Method for making copper-clad base material for conductive plates |
WO1987000791A1 (en) * | 1985-07-31 | 1987-02-12 | H R Smith (Technical Developments) Limited | Production of laminates |
DE3540389C1 (en) * | 1985-11-14 | 1991-09-26 | Santrade Ltd | Device for the production of glass mat reinforced thermoplastics |
WO1997013630A1 (en) * | 1995-10-07 | 1997-04-17 | Bakelite Ag | Process for producing pressed laminates |
-
1969
- 1969-06-27 AT AT613369A patent/AT316116B/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3324302A1 (en) * | 1983-07-06 | 1985-01-24 | Santrade Ltd., Luzern | DEVICE FOR PRODUCING MULTI-LAYER LAMINATE PANELS |
EP0158027A2 (en) * | 1984-04-10 | 1985-10-16 | DIELEKTRA GmbH | Method for making copper-clad base material for conductive plates |
EP0158027A3 (en) * | 1984-04-10 | 1986-10-01 | President Engineering Corp. | Method for making copper-clad base material for conductive plates |
WO1987000791A1 (en) * | 1985-07-31 | 1987-02-12 | H R Smith (Technical Developments) Limited | Production of laminates |
US5057175A (en) * | 1985-07-31 | 1991-10-15 | H.R. Smith (Technical Developments, Ltd.) | Method and apparatus for making continuous lengths of thermoplastic fiber reinforced laminates |
DE3540389C1 (en) * | 1985-11-14 | 1991-09-26 | Santrade Ltd | Device for the production of glass mat reinforced thermoplastics |
WO1997013630A1 (en) * | 1995-10-07 | 1997-04-17 | Bakelite Ag | Process for producing pressed laminates |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EIH | Change in the person of patent owner | ||
ELJ | Ceased due to non-payment of the annual fee |