CN103238229B - Oled module - Google Patents

Abstract

The invention relates to an OLED module comprising an OLED panel (10) and a plate-shaped carrier element (30) having a surface (35) on which the OLED panel (10) is arranged. The carrier element (30) has a protruding region (36) protruding relative to the OLED panel (10). Furthermore, the OLED module comprises operating electronics ( 32 ) for electronically operating the OLED panel ( 10 ). The drive electronics (32) comprise a structural part (32') which is arranged on the carrier element (30) at a protruding region (36) and which does not extend beyond the OLED in a direction (R) perpendicular to the surface (35) board (10). This arrangement makes it possible to construct the OLED module in a particularly flat manner, without the drive electronics ( 32 ) interfering with the minimum overall height of the OLED module.

Description

OLED module

technical field

The invention relates to an OLED module (OLED: Organic Light Emitting Diode) comprising an OLED panel and a plate-shaped carrier element having a surface for arranging the OLED panel, wherein the carrier element has a protruding area protruding relative to the OLED panel , and the OLED module includes drive electronics for electronically controlling the OLED panel. Furthermore, the invention relates to a lamp using such an OLED module as a light source.

Background technique

A corresponding OLED module is disclosed in US 2008/0231180 A1, in which the carrier element is a printed circuit board. The drive electronics are here arranged opposite the printed circuit board with respect to the OLED panel. In particular, a comparatively large overall height can thus be provided for the OLED module.

Contents of the invention

The object of the present invention is to provide an improved OLED module which can be produced in particular with a comparatively low structural height. Furthermore, a lamp with such an OLED module is provided.

According to the invention, an OLED module is provided which comprises an OLED panel and a plate-shaped carrier element which has a surface on which the OLED panel is arranged, wherein the carrier element has a protrusion protruding relative to the OLED panel area. Furthermore, the OLED module comprises drive electronics for electronically controlling the OLED panel. The drive electronics here comprises a structural component which is arranged on a protruding region on the carrier element and does not extend beyond the OLED panel in a direction perpendicular to the surface.

This arrangement enables particularly flat production of the OLED module, in particular such that the OLED module has an overall height that is not greater than the sum of the thickness of the plate-shaped carrier element and the thickness of the OLED plate. In particular, the drive electronics do not affect the minimum structural height of the OLED module in this way.

It is particularly advantageous if all structural components of the drive electronics are arranged on the protruding area on the carrier element, where all structural components do not extend beyond the OLED panel in a direction perpendicular to the surface . Furthermore, the OLED module is designed in particular such that none of the components of the drive electronics extend in the direction above the surface by 2.0 mm.

Advantageously, the carrier element has a recess or a recess in the surface on the protruding region, wherein at least one component of the drive electronics is at least partially arranged in the recess or the recess. As a result, the structural height can be reduced to a large extent. Furthermore, this makes it possible to mechanically hold relevant structural components of the drive electronics on the carrier plate.

In particular, the OLED panel has a flat side with which the OLED panel is arranged on the surface of the carrier element, wherein all components of the drive electronics are arranged along the flat side. within the area of the lateral border of the side. This makes it possible in particular to form the OLED module in a bendable or flexible manner, the bendability being limited only relatively slightly by means of structural components of the drive electronics.

In particular, the OLED module also has at least one electrical contact element for the electrical and mechanical connection between the carrier element and the OLED panel. In this way, a corresponding electrical connection can be produced and, moreover, the mechanical stability of the OLED panel on the carrier element is increased.

It is also advantageous if the OLED module also has a protective layer element which is arranged on the OLED panel opposite the carrier element with respect to the OLED panel. Not only can the protection of the OLED panel be achieved by means of the protective layer element, but also the planarization of the surface of the OLED panel can be achieved. When the protective layer element is manufactured in a light-transmissive manner, the light generated from the OLED panel can be output through the protective layer element.

The carrier element is in particular a printed circuit board, which is electrically and mechanically connected to the OLED panel.

Furthermore, a particularly low structural height of the OLED module can be achieved if the carrier element has a thickness of less than 1000 μm, in particular less than 100 μm.

Furthermore, the OLED module can advantageously be designed as a bendable OLED module or as a rigid OLED module.

When the OLED module also has a potting compound which is arranged around at least one component of the drive electronics, in particular around all components of the drive electronics, it is possible to achieve a particularly good protection of the OLED module and/or a particularly good stability of the OLED module. The potting compound described here is especially a waterproof and/or elastic material.

A large degree of protection can be achieved by means of a housing arranged around the OLED panel. The housing here is in particular made of metal. As a result, heat that may be generated during the operation of the OLED module can be dissipated particularly well.

The carrier element can advantageously have a hexagonal shape. In this case, the OLED module is particularly suitable, for example, when several OLED modules of the same type are to be combined together to form together the light output area of the lamp.

According to another aspect of the invention, a lamp is provided which uses at least one OLED module according to the invention as a light source.

Description of drawings

Hereinafter, the present invention will be described in detail based on embodiments with reference to the drawings. In the attached picture:

Figure 1 shows a schematic cross-sectional view of a first embodiment of an OLED module according to the invention,

Figure 2 shows a schematic sectional view of a second embodiment,

Figure 3 shows a schematic sectional view of a third embodiment,

Figure 4 shows a schematic top view of a third embodiment,

Figures 5, 6a and 6b show schematic views of another embodiment having a hexagonal shape,

7 and 8 show schematic perspective views of an embodiment having a hexagonal shape.

detailed description

A cross-sectional view of a first embodiment of an OLED module according to the invention is schematically shown in FIG. 1 . The OLED module has an OLED panel 10 and a plate-shaped carrier element 30 which has a surface 35 on which the OLED panel 10 is arranged.

OLED panel 10 can be constructed, for example, as follows: about 100 nm thick transparent ITO (Indium-Zinn-Oxid (Indium Tin Oxide)) on glass, about 100 to 200 nm thick organic layer (with up to 7 sublayers) and about 100 to 500nm thick metal cathode (eg aluminum).

The carrier element 30 has a protruding region 36 protruding relative to the OLED panel 10 .

Furthermore, the OLED module has drive electronics 32 for electronically driving the OLED panel 10 . The drive electronics 32 here comprises a structural part 32' which is arranged in particular on a protruding region 36 on the surface 35 on the carrier element 30 and which does not extend beyond the OLED panel in a direction R perpendicular to the surface 35. 10. That is, as shown with reference to FIG. 1 , the structural member 32' does not extend beyond the surface 35 and does not continue upwardly above the OLED panel 10. That is, the extension of the structural part 32' is no greater than the extension of the OLED panel 10, calculated from the surface 35.

This arrangement makes it possible to construct the OLED module particularly flat or with a particularly low overall height.

In particular, it can be provided that the OLED panel 10 has a planar side 15 (hereinafter also referred to as underside 15 ), with which the OLED panel 10 is arranged on the surface 35 of the carrier element 30 . Protruding region 36 here denotes a region of carrier element 30 which is located outside the vertical projection or vertical projection plane P of bottom side 15 or side surface 15 of carrier element 30 .

A particularly flat design overall can be achieved if all components of the drive electronics system 32 are arranged corresponding to the above-described arrangement on the protruding region 36 on the carrier element 30 . In this way it is achieved that none of the structural components of the drive electronics 32 extend beyond the OLED panel 10 in the direction R perpendicular to the surface 35 . For example, such a structure is possible that none of the components of the drive electronics 32 extend beyond the surface 352.0 mm or 1.8 mm.

In the case that the carrier element 30 has a recess or a recess (not shown in the figures) in the surface 35 on the protruding region 36 and at least one component of the drive electronics 32 is at least partially arranged in this recess or this recess, The construction height can be reduced to a greater extent. In this way, the relevant structural components can advantageously be brought into electrical contact with the carrier element 30 and thus also held mechanically on the carrier element 30 .

Furthermore, the OLED module can have at least one electrical contact element 31 for the electrical and mechanical connection between the carrier element 30 and the OLED panel 10 . As illustrated in FIG. 1 , the OLED panel 10 may have a base element 10', for example made of glass, and a closure element 10", wherein the underside 15 of the OLED panel 10 is the side or underside of the closure element 10". Here the base element 10' can have a protruding area 13 with respect to the closure element 10", wherein such a protruding area 13 of the base element 10' (analogously to the above definition of the protruding area 36 of the carrier element 30) is used to denote such a protruding area 13 of the base element 10'. An area which is located outside the vertical projection of the underside 15 or the side surface 15 on the carrier element 30 or outside the vertical projection plane P. The contact surface 11 of the electrode of the OLED panel 10 can be arranged at this protruding area 13 of the base element 10' , this contact surface also serves to make contact with the electrical contact element 31. This makes it relatively simple to establish a reliable electrical and mechanical connection between the OLED panel 10 and the carrier element 30.

That is to say, in this structure, on the one hand, a "space" is created between the surface 35 of the carrier element 30 and the protruding region 13 of the base element 10', which can advantageously be used at least partially for arranging the drive electronics 32. Seen in plan view, the recess can be formed annularly around the closure element 10 ″.

In total, a plurality (for example four) of such electrical contact elements 31 or contact surfaces 11 may be provided.

In addition, a layer of adhesive material can be provided between the underside 15 of the OLED panel 10 and the carrier element 30 , which serves for the mechanical connection between these two parts.

Furthermore, the OLED module can have an in particular light-transmissive protective layer element 20 , which is arranged on the OLED pane 10 opposite the carrier element 30 with respect to the OLED pane 10 . Correspondingly, the light output of the OLED panel 10 can be achieved by the protective layer element 20 having a light-transmissive design.

Referring to FIG. 1 , that is, the protective layer member 20 is disposed on the OLED panel 10 and provides light output upward. The protective layer element 20 can be attached to the OLED panel 10 optically and mechanically so as to plane the surface 16 of the OLED panel 10 . The protective layer element 20 can be arranged or held on the OLED pane 10 by means of an adhesive layer.

That is to say that the OLED module comprises in particular three layers, wherein a first layer is formed by the protective layer element 20 , a second layer is formed by the OLED panel 10 , and a third layer is formed by the carrier element 30 .

The carrier element 30 is in particular a printed circuit board, which is connected mechanically and electrically to the OLED panel 10 . The carrier element 30 or the printed circuit board advantageously has a thickness of less than 1000 μm, in particular less than 100 μm, in relation to a structural height of the OLED module which is as small as possible.

The drive electronics 32 can have a driver IC for the constant current supply of the OLED panel 10 , as well as passive structural elements, such as resistors for current regulation or coils and capacitors for smoothing the output voltage. Furthermore, the integration of a bus interface for external control of the OLED modules can be provided. In particular a microcontroller can be integrated for this purpose, as well as optionally level shifters and passive components (if required).

Referring to FIG. 1 , this means that in particular all structural components of the drive electronics 32 have a flat structural shape, so that none of these structural components extend upward beyond the OLED panel 10 . These structural components are here arranged beside the OLED panel 10 or between the protruding region 13 of the base element 10' and the surface 35 of the carrier element 30. This flat structural shape achieves a lower overall height of the OLED module compared to the prior art. The structural elements of the drive electronics 32 can be arranged in the "recess" of the closure element 10 ″ in the region of the contact between the carrier element 30 (or printed circuit board) and the OLED panel 10 , so that this space is used particularly well.

Furthermore, the OLED module can have electrical connection terminals 33 for the electrical connection.

That is to say, using at least one electrical connection element 31 for the OLED panel 10, active and passive driver components of the drive electronics 32, and connection terminals 33, the printed circuit board can be mechanically and electrically connected outwards at the same time. The way is fastened on the OLED panel 10; moreover this can enhance the mechanical stability and control of the OLED module.

The OLED panel 10 , the cover element 20 and the carrier element 30 can be rigid or flexible and bendable. The integration of the aforementioned electrical structural components can be provided by means of SMD, chip-on-board packaging, chip-on-film packaging or similar processes: these processes all favor flat structural shapes.

The components of the drive electronics 32 can in particular be arranged in the region along the lateral boundary of the lower side 15 , ie in a ring-shaped region around the lower side 15 when viewed from above. The bendability or flexibility of the OLED module is not limited by this arrangement, or is at most only weakly limited, or is limited only in the aforementioned region around the underside 15 .

Fig. 2 schematically shows another embodiment. Unless stated otherwise, the descriptions with respect to the first embodiment also apply to the second embodiment and reference numerals are used analogously. That is to say, only the differences from the first embodiment will be described below.

In the second embodiment, a potting compound 40 is additionally provided; this potting compound 40 can be arranged in particular in the region surrounding the OLED panel 10 , specifically between the carrier element 30 and the protective layer element 20 . As a result, the mechanical stability can be further increased and/or a closure of the structural element or of the contact surface can be achieved, thereby ensuring particularly good protection. The potting compound 40 here is particularly preferably waterproof.

It is also possible to provide a potting compound 40 which is not fully hardened, that is to say an elastic potting compound 40 , so that the OLED module with the potting compound 40 can be produced in a bendable or flexible manner.

FIG. 3 schematically shows a third embodiment; FIG. 4 shows a corresponding plan view. The above explanations apply again correspondingly, so only the differences with respect to the above representations are explained.

In this implementation, the OLED module additionally has a housing 50 . The housing 50 can have a base plate, which is arranged opposite the OLED panel 10 relative to the carrier element 30 , that is to say, as a further, ie, fourth layer in the sense of the above-mentioned three layers.

The housing 50 can in particular have holes for the electrical connection terminals 33 . It can be provided that wires are soldered to the electrical connection terminal 33 or that the electrical connection to the power supply is established by means of spring contacts or clip contacts.

The housing can in particular be arranged around the OLED panel 10 . The encapsulation of the OLED module can be increased to a large extent by the housing 50 . The housing 50 is in particular made of metal. As a result, heat that may be generated during operation of the OLED panel 10 can be dissipated particularly well.

Furthermore, the outer shape or shape of the OLED module can be advantageously influenced by means of the housing 50 , so that in this way the possibility of improving the shape relative to the outer shape of the OLED module is improved.

If the potting compound 40 or the housing 50 is removed in FIG. 4 , a corresponding view of the first or second embodiment is obtained. The light-emitting area of the OLED panel 10 is designated with reference numeral 12 .

As can also be seen from FIG. 4 , provision can be made for the carrier plate 30 to be rectangular, wherein the components of the drive electronics 32 are arranged on the carrier plate 30 only on two opposite sides given by the shape. This restricts the bendability of the OLED module about an axis parallel to the two sides involved, particularly in certain cases, as a result.

However, the rectangular shape in the top view is not mandatory. According to the invention it can also be provided that the OLED module has a shape, seen in plan view, which is not rectangular but, for example, hexagonal. This is illustrated in Figures 5, 6a and 6b according to another embodiment. The above explanations apply again accordingly, so only the differences from the above explanations are explained below.

FIG. 5 shows a corresponding sectional view, FIG. 6 a shows a top view of the OLED module without the protective layer element 20 , and FIG. 6 b shows a top view of the OLED module with the protective layer element 20 .

The hexagonal shape of the OLED module can be obtained by a corresponding shape of the carrier element 30 . The OLED panel 10 may be configured, for example, as an octagon and additionally, for example, have a circular luminous area 12 .

The hexagonal shape of the OLED modules is particularly suitable when several OLED modules are to be joined together as close together as possible, so that a lamp is formed with a light-radiating surface consisting of the light-emitting surface of a single OLED module .

FIG. 7 schematically shows an exploded view of the last-mentioned embodiment. The outcoupling system is denoted here by reference numeral 21 and the optical surface (diffuse/reflective) by reference numeral 22 .

FIG. 8 shows an example of a carrier element 30 , here as a printed circuit board, which has integrated components or components of the drive electronics 32 . The drive electronics 32 can have, for example, a PWM current driver, a DMX512 interface, an optional touch interface; PWM driver performance parameters: 12V or 24V power supply, 350mAPWM drive, 400:1 dimming degree, 82% efficiency, and a structural height of 1.7mm.

The OLED module according to the invention is particularly suitable for use as a light source for lamps, for example for room lighting. According to the invention, therefore, a lamp is also provided which uses at least one OLED module as light source. Here, the lamp can advantageously be produced particularly flat in accordance with the above description.

Claims (19)

1. an OLED module, this OLED module has:

-OLED plate (10);

-plate-shaped support element (30), this carrier element has for the surface (35) that described OLED plate (10) is set;

Wherein said carrier element (30) has the outburst area (36) outstanding with respect to described OLED plate (10),With

-drive electronics (32), this drive electronics is used for OLED plate described in the mode control of electronics(10)，

It is characterized in that,

Described drive electronics (32) comprises such structure member, and described structure member is arranged on described carrier unitThe described outburst area (36) of part (30) is upper, and this structure member is in the direction perpendicular to described surface (35)(R) on, do not extend beyond described OLED plate (10),

Described OLED plate (10) has downside (15), and described OLED plate (10) utilizes this downside (15) to establishPut on the described surface (35) of described carrier element (30), wherein said OLED plate (10) has substrateElement (10 ') and closure elements (10 "), wherein said downside (15) is described closure elements (10 ")Side, and wherein said base members (10 ') has outburst area with respect to described closure elements (10 ").

2. OLED module according to claim 1,

Wherein, all structure members of described drive electronics (32) are all arranged on described carrier element (30)On described outburst area, and in the direction perpendicular to described surface, do not extend beyond described OLED plate (10).

3. OLED module according to claim 1 and 2,

Wherein, all structure members of described drive electronics (32) do not extend beyond described surface (35) 2.0mm.

4. OLED module according to claim 1,

Wherein, described carrier element (30) has the depression that is positioned at described surface (35) on described outburst areaOr space, and at least one structure member of described drive electronics (32) is at least partially disposed on, and this is recessedFall into or this space in.

5. OLED module according to claim 1,

Wherein, described OLED plate (10) has smooth side (15), and described OLED plate utilizes this side to establishPut upper on the described surface (35) of described carrier element (30), wherein said drive electronics (32) allStructure member is all arranged in the region of the lateral boundaries of described smooth side (15).

6. OLED module according to claim 1,

This OLED module also has,

-at least one electric contacts (31), described electric contacts for described carrier element (30) and described inElectrical connection and mechanical connection between OLED plate (10).

7. OLED module according to claim 1,

This OLED module also has,

-protective layer element (20), this protective layer element is about described OLED plate (10) and described carrier element (30)Relatively be arranged on described OLED plate (10).

8. OLED module according to claim 1,

Wherein, described carrier element (30) is printed circuit board (PCB), and this printed circuit board (PCB) is with electric means and mechanical systemBe connected with described OLED plate (10).

9. OLED module according to claim 1,

Wherein, described carrier element (30) has such thickness, and this thickness is less than 1000 μ m.

10. OLED module according to claim 1,

This OLED module structure becomes flexible OLED module or is configured to the OLED module of rigidity.

11. OLED modules according to claim 1,

This OLED module also has,

-mould material (40), this mould material is around at least one structural portion of described drive electronics (32)Part arranges.

12. OLED modules according to claim 1,

This OLED module also has,

-shell (50), this shell arranges around described OLED plate (10).

13. OLED modules according to claim 1,

Wherein, described carrier element (30) has hexagonal shape.

14. OLED modules according to claim 7,

Wherein, described protective layer element (20) is printing opacity.

15. OLED modules according to claim 9,

Wherein, described thickness is less than 100 μ m.

16. OLED modules according to claim 11, wherein said mould material (40) drives around describedAll structure member settings of moving electronic installation (32).

17. OLED modules according to claim 11, wherein, described mould material (40) is waterproofAnd/or flexible.

18. OLED modules according to claim 12, wherein, described shell (50) is made of metal.

19. 1 kinds of lamps, this lamp using at least one according to the OLED module described in any one in the claims asLight source.