CN1595295A - Photosensitive composition and lithograph plate made of same - Google Patents
Photosensitive composition and lithograph plate made of same Download PDFInfo
- Publication number
- CN1595295A CN1595295A CN 200410010380 CN200410010380A CN1595295A CN 1595295 A CN1595295 A CN 1595295A CN 200410010380 CN200410010380 CN 200410010380 CN 200410010380 A CN200410010380 A CN 200410010380A CN 1595295 A CN1595295 A CN 1595295A
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- China
- Prior art keywords
- photosensitive composition
- solid amount
- resin
- infrared absorbing
- acid
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- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 39
- 150000001875 compounds Chemical class 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000011347 resin Substances 0.000 claims abstract description 71
- 239000002253 acid Substances 0.000 claims abstract description 29
- 239000000470 constituent Substances 0.000 claims description 48
- -1 oxyl Chemical group 0.000 claims description 47
- 239000007787 solid Substances 0.000 claims description 44
- 238000004132 cross linking Methods 0.000 claims description 41
- 239000007848 Bronsted acid Substances 0.000 claims description 36
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 29
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 26
- 230000035755 proliferation Effects 0.000 claims description 24
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 21
- 239000002585 base Substances 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 239000003513 alkali Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- 235000013824 polyphenols Nutrition 0.000 claims description 15
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 14
- 229940100630 metacresol Drugs 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical group CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 230000006837 decompression Effects 0.000 claims description 7
- 238000004821 distillation Methods 0.000 claims description 7
- 229920001477 hydrophilic polymer Polymers 0.000 claims description 7
- 229920002866 paraformaldehyde Polymers 0.000 claims description 7
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 7
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 7
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 7
- 238000010992 reflux Methods 0.000 claims description 7
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 6
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 6
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 claims description 6
- 150000001450 anions Chemical class 0.000 claims description 5
- 239000012954 diazonium Substances 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical class [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 5
- CUXQLKLUPGTTKL-UHFFFAOYSA-M microcosmic salt Chemical compound [NH4+].[Na+].OP([O-])([O-])=O CUXQLKLUPGTTKL-UHFFFAOYSA-M 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 125000003748 selenium group Chemical class *[Se]* 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000009395 breeding Methods 0.000 abstract 1
- 230000001488 breeding effect Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000005516 engineering process Methods 0.000 description 14
- 239000004372 Polyvinyl alcohol Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 235000011121 sodium hydroxide Nutrition 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 206010070834 Sensitisation Diseases 0.000 description 7
- 230000008313 sensitization Effects 0.000 description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 150000001299 aldehydes Chemical class 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- BJLRVFDWAOVFCI-UHFFFAOYSA-N 1h-imidazole;quinoline Chemical compound C1=CNC=N1.N1=CC=CC2=CC=CC=C21 BJLRVFDWAOVFCI-UHFFFAOYSA-N 0.000 description 1
- VZQBDGHUOBRFAA-UHFFFAOYSA-N 2-(2,6-dihydroxyphenyl)benzaldehyde Chemical compound C1(O)=C(C(O)=CC=C1)C1=CC=CC=C1C=O VZQBDGHUOBRFAA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 241001597008 Nomeidae Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000002521 alkyl halide group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- HOBCFUWDNJPFHB-UHFFFAOYSA-N indolizine Chemical compound C1=CC=CN2C=CC=C21 HOBCFUWDNJPFHB-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000004880 oxines Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002006 poly(N-vinylimidazole) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010424 printmaking Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Materials For Photolithography (AREA)
Abstract
This invention discloses a light sensitive compound and the lithoprint plate using the compound. The light sensitive compound comprises the following as weight percent: 30 t0 60 percent of resin, 5 to 20 percent of infrared absorbing compound, 30 to 60 percent of potential protonic acid, 0 to 10 percent o f acid breeding agent. The lithoprint plate comprises base with a base coating layer of hydrophilicity polymer attached with the above light sensitive layer on. The sample in this invention can get print plate 1 images more than one hundred thousand times through the multiple printing plate experience. If the plate is baked under a temperature of 220 degrees for ten minutes, the printing time can be three hundred times. The printing plate 2 can achieve one hundred times, If the plate is baked under a temperature of 220 degrees for ten minutes, the printing time can achieve five hundred times.
Description
Technical field
The present invention relates to a kind of photoactive substance and galley, the flat stamping version that especially relates to a kind of photosensitive composition and use photosensitive composition to make.
Background technology
Photosensitive lithoprint plate commonly used is included in the photographic layer on the water wettability version base, for example, in the negative type photosensitive lithoprint plate, on water wettability version base, form one deck and see that effective light (as ultraviolet ray, laser etc.) can accept the photographic layer of printing ink, non-ly see that the light coating can be removed, expose water wettability version primary surface.In lithography, utilize the difference on this performance exactly, thereby reach ink-water balance.
Along with the development of computer technology and laser technology, (Computer-to-plate.CTP) is increasingly mature for the Computer To Plate technology.The CTP technology is utilized computing machine modulation and control laser beam, and the surface of forme is scanned, and obtains the plate that can above machine prints through developing.Because many work of CTP technology can be carried out on computers, in process, remove the operations such as development, photographic fixing and manual imposition of film, improved the quality and the efficient of printing work, shortened the work period, reduce cost, become the trend of press.In all CTP technology, thermosensitive CTP technology (sense infrared laser) but have characteristics such as high press resistance rate, high resolving power brightroom operation, become the main flow of CTP technology.
As known thermal CTP plate material technology, through we test discovery in various degree to exist stability bad, shortcoming such as plate-making speed is not fast.Some photosensitive component is difficult to preparation or uses the solvent of not environmental protection, and some needs double exposure (the comprehensive UV exposure of another time of laser), and some component needs more material (using simultaneously as two kinds of phenolics) etc.
As giving edition primary surface hydrophilic technology, known having usually: provide the technology of the hydrophilic layer that comprises water-soluble polymers and other at the version primary surface.Yet, when improving water wettability, can produce such as the problem that reduces pressrun with above-mentioned technology.Therefore, satisfy high pressrun, high sensitivity, high development adaptability and these all performances of water wettability simultaneously is extremely difficult technology.
Summary of the invention
Purpose of the present invention just is to provide a kind of composition that can satisfy the sense infrared laser of high pressrun, high sensitivity, high development adaptability and water wettability performance, and the flat stamping version of using this photosensitive composition is provided.
Purpose of the present invention can realize by following measure:
The present invention includes heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator, by weight percentage, the consumption of resin accounts for the 30-60% of constituent solid amount, the infrared absorbing compounds consumption accounts for the 5-20% of constituent solid amount, potential Bronsted acid consumption accounts for the 30-60% of constituent solid amount, and the acid proliferation generator consumption accounts for the 0-10% of constituent solid amount.
Among the present invention by weight percentage, the consumption of described resin accounts for the 35-45% of constituent solid amount, the infrared absorbing compounds consumption accounts for the 10-15% of constituent solid amount, potential Bronsted acid consumption accounts for the 35-45% of constituent solid amount, and the infrared absorbing compounds consumption accounts for the 1-5% of constituent solid amount.The methylolation product that described heat cross-linking resin is the metacresol urea formaldehyde, it has following structure:
N is the natural number of 1-12.
Perhaps, described heat cross-linking resin is for mixing the methylolation product of phenolics, and it has following structure:
R represents alkyl, oxyl, aryl, halogen atom of 1-12 carbon etc. in the formula, and it is alkyl or the oxyl or the aryl of 1-6 carbon, and m, n represent the natural number between the 1-12.
Described heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, and reflux state is reaction down, and decompression distillation obtains.The alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.Described potential Bronsted acid is a polydentate compound.Described potential Bronsted acid is one or more combinations in salt compound, salt compounded of iodine, sulfosalt, microcosmic salt, selenium salt, the diazonium class.
Described potential Bronsted acid has following structure;
Wherein R represents alkyl, oxyl of hydrogen atom, 1 to 12 carbon etc.; X represents halide ion, p-toluenesulfonic acid root, hexafluoro-phosphate radical, hexafluoroantimonic anion, hexafluoroarsenate root, tetrafluoroborate etc.; N represents the natural number of 1-12.
Described infrared absorbing compounds is one or more of following compound: carbon black, phthalocyanine, portion spend cyanines, diazonium indenes etc.
Described infrared absorbing compounds has following structure:
Described acid proliferation generator has following structure:
A kind of flat stamping version of using photosensitive composition as claimed in claim 1 to make, it comprises base, is the undercoat that contains hydrophilic polymer on base, is attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.
The hydrophilic layer that contains hydrophilic agglomerant among the present invention contains-COOH ,-CH
2OH or-NH
2One or more compounds in the group.The material that contains hydrophilic radical in the described hydrophilic layer that contains hydrophilic agglomerant be among PVA, polyvinylpyrrolidone, the acrylic type multipolymer HMMM one or more.
The present invention is owing to adopt said components, sample draws by the experiment of a plurality of formes: forme 1 usefulness Lotem400V (production of Creo company) exposure, develop with TNDM860 washer (the second film production of Lekai group) after the imaging, preheat temperature 120 ℃, 1 minute, developer solution uses TND (the second film production of Lekai group) developer solution, next uses TG (the second film production of Lekai group) the wiping space of a whole page.The image seal journey of this moment can reach 100,000 impressions, and this version is as baking 10 minutes in 220 ℃, and the seal journey can reach 300,000 impressions.Forme 2 usefulness Lotem400V (production of Creo company) exposure is developed with TNDM860 washer (two glue production) after the imaging, preheat temperature 110 ℃, 1 minute, and developer solution uses TND (two glue production) developer solution, next uses TG (two glue production) the wiping space of a whole page.The image seal journey of this moment can reach 100,000 impressions, and this version is as baking 10 minutes in 220 ℃, and the seal journey can reach 500,000 impressions.
Embodiment
The present invention does with detailed description below in conjunction with drawings and Examples:
Embodiment 1
The present invention comprises heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator, by weight percentage, the consumption of resin accounts for 30% of constituent solid amount, the infrared absorbing compounds consumption accounts for 5% of constituent solid amount, potential Bronsted acid consumption accounts for 60% of constituent solid amount, and the acid proliferation generator consumption accounts for 5% of constituent solid amount.
The methylolation product that described heat cross-linking resin is the metacresol urea formaldehyde, it has following structure:
N is the natural number of 1-12.
The heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, and reflux state is reaction down, and decompression distillation obtains.
The alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.
Described potential Bronsted acid is a polydentate compound.
Described infrared absorbing compounds is one or more of following compound: carbon black, phthalocyanine, portion spend cyanines, diazonium indenes.
Described acid proliferation generator has following structure:
The flat stamping version that adopts photosensitive composition of the present invention to make comprises base, is the undercoat that contains hydrophilic polymer on base, is attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.
The described hydrophilic layer that contains hydrophilic agglomerant contains-COOH ,-CH
2OH or-NH
2One or more compounds in the group.
Embodiment 2
Comprise heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator among the present invention, by weight percentage, the consumption of resin accounts for 60% of constituent solid amount, the infrared absorbing compounds consumption accounts for 10% of constituent solid amount, potential Bronsted acid consumption accounts for 30% of constituent solid amount, and the acid proliferation generator consumption accounts for 0% of constituent solid amount.
Described heat cross-linking resin is for mixing the methylolation product of phenolics, and it has following structure:
R represents alkyl, oxyl, aryl, halogen atom of 1-12 carbon etc. in the formula, and it is alkyl or the oxyl or the aryl of 1-6 carbon, and m, n represent the natural number between the 1-12.
Described heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, and reflux state is reaction down, and decompression distillation obtains.
The alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.
Described potential Bronsted acid is one or more combinations in salt compound, salt compounded of iodine, sulfosalt, microcosmic salt, selenium salt, the diazonium class.
Described infrared absorbing compounds has following structure:
Described acid proliferation generator has following structure:
The flat stamping version that adopts aforesaid photosensitive composition to make, it comprises base, is the undercoat that contains hydrophilic polymer on base, is attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.
The described hydrophilic layer that contains hydrophilic agglomerant contains-COOH ,-CH
2OH or-NH
2One or more compounds in the group.
Flat stamping version according to claim 13 is characterized in that: the material that contains hydrophilic radical in the described hydrophilic layer that contains hydrophilic agglomerant be among PVA, polyvinylpyrrolidone, the acrylic type multipolymer HMMM one or more.
Embodiment 3
The present invention comprises heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator, by weight percentage, the consumption of resin accounts for 35% of constituent solid amount, the infrared absorbing compounds consumption accounts for 10% of constituent solid amount, potential Bronsted acid consumption accounts for 45% of constituent solid amount, and the acid proliferation generator consumption accounts for 10% of constituent solid amount.
Photosensitive composition according to claim 1 and 2 among the present invention is characterized in that: described heat cross-linking resin is the methylolation product of metacresol urea formaldehyde, and it has following structure:
N is the natural number of 1-12.
The heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, and reflux state is reaction down, and decompression distillation obtains.
The alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.
Described potential Bronsted acid is one or more combinations in salt compound, salt compounded of iodine, sulfosalt, microcosmic salt, selenium salt, the diazonium class.
Described infrared absorbing compounds is one or more of following compound: carbon black, phthalocyanine, portion spend cyanines, diazonium indenes etc.
Described acid proliferation generator has following structure:
The flat stamping version that adopts aforesaid photosensitive composition to make, it comprises base, is the undercoat that contains hydrophilic polymer on base, is attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.
The described hydrophilic layer that contains hydrophilic agglomerant contains-COOH ,-CH
2OH or-NH
2One or more compounds in the group.
The material that contains hydrophilic radical in the described hydrophilic layer that contains hydrophilic agglomerant be among PVA, polyvinylpyrrolidone, the acrylic type multipolymer HMMM one or more.
Embodiment 4
The present invention comprises heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator, by weight percentage, the consumption of resin accounts for 45% of constituent solid amount, the infrared absorbing compounds consumption accounts for 15% of constituent solid amount, potential Bronsted acid consumption accounts for 35% of constituent solid amount, and the acid proliferation generator consumption accounts for 5% of constituent solid amount.
The methylolation product that described heat cross-linking resin is the metacresol urea formaldehyde, it has following structure:
N is the natural number of 1-12.
Described heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, and reflux state is reaction down, and decompression distillation obtains.
The alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.
Described potential Bronsted acid has following structure;
Wherein R represents alkyl, oxyl of hydrogen atom, 1 to 12 carbon etc.; X represents halide ion, p-toluenesulfonic acid root, hexafluoro-phosphate radical, hexafluoroantimonic anion, hexafluoroarsenate root, tetrafluoroborate etc.; N represents the natural number of 1-12.
Described infrared absorbing compounds has following structure:
Described acid proliferation generator has following structure:
The flat stamping version that adopts aforesaid photosensitive composition to make, it comprises base, is the undercoat that contains hydrophilic polymer on base, is attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.
The described hydrophilic layer that contains hydrophilic agglomerant contains-COOH ,-CH
2OH or-NH
2One or more compounds in the group.
The material that contains hydrophilic radical in the described hydrophilic layer that contains hydrophilic agglomerant be among PVA, polyvinylpyrrolidone, the acrylic type multipolymer HMMM one or more.
Embodiment 5
Photosensitive composition of the present invention comprises heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator, by weight percentage, remove outside the point value that the several enforcement in front lifted, its content all can in following scope, wherein, the consumption of resin accounts for the 30-60% of constituent solid amount, the infrared absorbing compounds consumption accounts for the 5-20% of constituent solid amount, potential Bronsted acid consumption accounts for the 30-60% of constituent solid amount, and the acid proliferation generator consumption accounts for the 0-10% of constituent solid amount.Moreover, as preferred proportional range, by weight percentage, the consumption of described resin accounts for the 35-45% of constituent solid amount, the infrared absorbing compounds consumption accounts for the 10-15% of constituent solid amount, potential Bronsted acid consumption accounts for the 35-45% of constituent solid amount, and the infrared absorbing compounds consumption accounts for the 1-5% of constituent solid amount.Above-mentioned these all can.
And the methylolation product that described heat cross-linking resin is the metacresol urea formaldehyde, it has following structure:
N is the natural number of 1-12.
The heat cross-linking resin also can adopt the methylolation product that mixes phenolics, and it has following structure:
R represents alkyl, oxyl, aryl, halogen atom of 1-12 carbon etc. in the formula, and it is alkyl or the oxyl or the aryl of 1-6 carbon, and m, n represent the natural number between the 1-12.
Described heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, and reflux state is reaction down, and decompression distillation obtains.
The alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.
Described potential Bronsted acid is a polydentate compound.Perhaps, potential Bronsted acid is one or more combinations in salt compound, salt compounded of iodine, sulfosalt, microcosmic salt, selenium salt, the diazonium class.
Described potential Bronsted acid has following structure;
Wherein R represents alkyl, oxyl of hydrogen atom, 1 to 12 carbon etc.; X represents halide ion, p-toluenesulfonic acid root, hexafluoro-phosphate radical, hexafluoroantimonic anion, hexafluoroarsenate root, tetrafluoroborate; N represents the natural number of 1-12.
Described infrared absorbing compounds is one or more of following compound: carbon black, phthalocyanine, portion spend cyanines, diazonium indenes.
Perhaps, infrared absorbing compounds has following structure:
Described acid proliferation generator has following structure:
According to aforementioned photosensitive composition make the flat stamping version comprise base, be the undercoat that contains hydrophilic polymer on base, be attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.The hydrophilic layer that contains hydrophilic agglomerant contains-COOH ,-CH
20H or-NH
2One or more compounds in the group.Contain the material that contains hydrophilic radical in the hydrophilic layer of hydrophilic agglomerant and be among PVA, polyvinylpyrrolidone, the acrylic type multipolymer HMMM one or more.
Embodiment 6
The present invention provides a kind of composition that can satisfy the sense infrared laser of high pressrun, high sensitivity, high development adaptability and water wettability performance, and uses said composition to be made into the direct printmaking plate of thermo-sensitive computer.The content that prescription and composition are set forth as the several embodiment in front.
Used heat cross-linking resin among the present invention is meant the phenolics that contains methylol.As everyone knows, phenolics is had many uses, and they obtain by phenolic compound and aldehyde reaction.Along with the difference of reaction conditions, show different characteristics, under acid condition, the product of excessive phenol and aldehydes reaction is a linear phenolic resin; Under the alkali condition, aldehydes matter and excessive aldehyde reaction obtain thermosetting phenolic resin, also are resol resin.Used heat cross-linking resin among the present invention is to utilize the methylolation of linear phenolic resin to obtain, and has linear phenolic resin and resol resin two specific characters.Can realize methylolated linear phenolic resin comprise phenol formaldehyde resin, metacresol formaldehyde resin, and to cresols formaldehyde resin, resorcinol benzaldehyde resin and poly(4-hydroxystyrene) resin.Available resin structure can be represented with following general formula:
Resin 1
Resin 2
Resin 1, n is the natural number between the 1-12, is preferably 4-8.Resin 2, R represents alkyl, oxyl, aryl, halogen atom of 1-12 carbon etc. in the formula, the preferably alkyl of 1-6 carbon or oxyl or aryl, m, n represent the natural number between the 1-12, preferably 4-8.Consider the crosslinking active and the shelf stability of photosensitive composition, the methylolation rate of resin should be at 10-90%, preferably 40-50%.The weight-average molecular weight of resin is 1000-8000, is preferably 3000-5000.
Utilize BTB-24 (sky, Weihai becomes the chemical plant to produce) can produce cross-linked resin, utilize R-32 (The Second Film Factory of Lucky Group) can produce cross-linked resin with resin 2 structures with resin 1 structure for raw material.The consumption of resin accounts for the 30-60% of constituent solid amount, preferably 35-45%.
The infrared absorbing compounds that uses in the temperature-sensitive constituent among the present invention can be dyestuff or pigment.This compounds wide range comprises cyanines, part cyanines, indolizine, phthalocyanine, pyrans, indoles etc.These compounds can absorb infrared laser, produce heat energy.The infrared absorbing agents that the present invention uses is carbon black and NK-4680 (Japanese pigment) dyestuff.NK-4680 has following structure:
The infrared absorbing compounds consumption accounts for the 5-20% of constituent solid amount, preferably 10-15%.
The potential Bronsted acid that the present invention uses is meant the parent that forms Bronsted acid by decomposes, and this potential Bronsted acid can produce HCL, HPF after decomposing
6Deng acid, it is the catalyzer that the heat cross-linking resin crosslinks is solidified.It is a lot of to can be used in potential Bronsted acid of the present invention, have ion-type, nonionic etc., the triaizine compounds that replaces as various salt compounds, alkylhalide group, special sulfonates compounds etc.The present invention has used a kind of diazo salt macromolecule resin as potential Bronsted acid especially, makes infrared light activated constituent and uses the photosensitive lithoprint plate of this constituent that higher sensitivity and press resistance rate are arranged.Concrete general structure is as follows:
Wherein R represents alkyl, oxyl of hydrogen atom, 1 to 12 carbon etc.; X represents halide ion, p-toluenesulfonic acid root, hexafluoro-phosphate radical, hexafluoroantimonic anion, hexafluoroarsenate root, tetrafluoroborate etc.; N represents the natural number of 1-12, is preferably 2-5, and representative material is N-5000 (The Second Film Factory of Lucky Group).Potential Bronsted acid consumption accounts for the 30-60% of constituent solid amount, preferably 35-45%.
The acid proliferation generator that uses among the present invention, it acts on H
+Exist down, the acid proliferation generator compound can produce extra acid, and the sensitivity of plate is improved.That uses among the present invention has:
The acid proliferation generator consumption accounts for the 0-10% of constituent solid amount, preferably 1-5%.
Except that above-mentioned material, temperature-sensitive constituent of the present invention also should comprise colorant, stabilizing agent, auxiliary sensitizer, exposure indicator and surfactant etc.
The support of flat stamping version of the present invention can be aluminium plate or other metallograph, also can be polyester film base and scribbles high molecular paper substrate etc.And best support is the aluminium plate of anode electrolysis, oxidation, and coating contains-COOH-NH
2, the coating of hydrophilic radicals such as-OH.Preferably use following compounds to form hydrophilic layer: vinyl-type resin and derivant thereof, as, PVA (polyvinyl alcohol (PVA)), modified PVA, polyvinylpyrrolidone and polyvinyl imidazole quinoline; Acrylic acid type multipolymer, as, polyacrylic acid, polyacrylamide etc.
Specifically implement the following 1:
Synthesizing of heat cross-linking resin 1:
In the 500ml there-necked flask of stirring machine, condenser pipe and thermometer is housed, add 78gBTB-24 phenolics (sky, Weihai becomes the chemical plant to produce), 300ml ethanol, the formalin of 60ml37%, 1g NaOH, reaction is 6 hours under 80-90 ℃ of situation, vacuumizes and boils off solvent, pour out product while hot, obtain the 80g product.
Make the base version
With thickness is the aluminium plate (alloy 1050) of 0.3mm, with carrying out surperficial sand millingization with nylon bruss and 400 orders (mesh) float stone-aqueous suspension after the clean degreasing of triclene, washes.Flooded 9 seconds with 45 ℃ of 25% sodium hydrate aqueous solution.Apply with following coating fluid then, obtained the version base in drying coated 15 seconds at 80 ℃, the coating overlay capacity is 15g/m after super-dry
2
Coating liquid 1:
HMMM (hexamethylol methine melamine) 0.3g
Methyl alcohol 100g
Water 1g
Regulate following sensitization liquid, applying sensitization liquid 1 on gained base version, to make it coating amount be 1.3g/m
2, baking temperature is 110 ℃, 3 minutes, thereby obtains lithographic plate 1.
Sensitization liquid 1:
Heat cross-linking resin 1 0.5g
N-5000 (the second film production of Lekai group) 0.5g
NK-468 (Japanese pigment) 0.1g
BO-603 (Beijing Chemical Plant) 0.01g
A-1 0.01g
Cyclohexanone 5g
Ethylene glycol monomethyl ether 5g forme exposes with Lotem400V (production of Creo company), develop with TNDM860 washer (the second film production of Lekai group) after the imaging, preheat temperature 120 ℃, 1 minute, developer solution uses TND (the second film production of Lekai group) developer solution, next uses TG (the second film production of Lekai group) the wiping space of a whole page.The image seal journey of this moment can reach 100,000 impressions, and this version is as baking 10 minutes in 220 ℃, and the seal journey can reach 300,000 impressions.
Sensitization liquid 2
In sensitization liquid 1, A-2 equivalent replacement A-1 repeats above operation, obtains identical result.
Perhaps, the following operation 2 of specific embodiment
Synthesizing of heat cross-linking resin 2:
Stirring machine is being housed, is adding R-32 (The Second Film Factory of Lucky Group) in three mouthfuls of beakers of the 500ml of cooling tube and thermometer, the operation of repetitive operation 1 obtains heat cross-linking resin 2.Aluminum substrate and coating liquid are with aforementioned operation 1:
Sensitization liquid 3
Replace heat cross-linking resin 1 with heat cross-linking resin 2, other is constant.
Applying sensitization liquid 2 on gained base version, to make it coating amount be 1.3g/m
2, baking temperature is 120 ℃, 3 minutes, thereby obtains lithographic plate 2.
Forme 2 usefulness Lotem400V (production of Creo company) exposure is developed with TNDM860 washer (two glue production) after the imaging, preheat temperature 110 ℃, 1 minute, and developer solution uses TND (two glue production) developer solution, next uses TG (two glue production) the wiping space of a whole page.The image seal journey of this moment can reach 100,000 impressions, and this version is as baking 10 minutes in 220 ℃, and the seal journey can reach 500,000 impressions.
Claims (15)
1, a kind of photosensitive composition, it is characterized in that: it comprises heat cross-linking resin, potential Bronsted acid, infrared absorbing compounds and acid proliferation generator, by weight percentage, the consumption of resin accounts for the 30-60% of constituent solid amount, the infrared absorbing compounds consumption accounts for the 5-20% of constituent solid amount, potential Bronsted acid consumption accounts for the 30-60% of constituent solid amount, and the acid proliferation generator consumption accounts for the 0-10% of constituent solid amount.
2, photosensitive composition according to claim 1, it is characterized in that: by weight percentage, the consumption of described resin accounts for the 35-45% of constituent solid amount, the infrared absorbing compounds consumption accounts for the 10-15% of constituent solid amount, potential Bronsted acid consumption accounts for the 35-45% of constituent solid amount, and the infrared absorbing compounds consumption accounts for the 1-5% of constituent solid amount.
3, photosensitive composition according to claim 1 and 2 is characterized in that: described heat cross-linking resin is the methylolation product of metacresol urea formaldehyde, and it has following structure:
N is the natural number of 1-12.
4, according to claim 1 or described photosensitive composition, it is characterized in that: described heat cross-linking resin is for mixing the methylolation product of phenolics, and it has following structure:
R represents alkyl, oxyl, aryl, halogen atom of 1-12 carbon etc. in the formula, and it is alkyl or the oxyl or the aryl of 1-6 carbon, and m, n represent the natural number between the 1-12.
5, photosensitive composition according to claim 1 and 2, it is characterized in that: described heat cross-linking resin is a raw material with metacresol or mixed phenol phenolics and formaldehyde or paraformaldehyde, and acetone or alcohol is a solvent, and alkali compounds is a catalyzer, reflux state is reaction down, and decompression distillation obtains.
6, photosensitive composition according to claim 1 and 2 is characterized in that: the alkali compounds of making catalyzer in the described heat cross-linking resin reaction is NaOH, KOH, Na
2CO
3One or more.
7, according to claim 1 or 2 described photosensitive compositions, it is characterized in that: described potential Bronsted acid is a polydentate compound.
8, photosensitive composition according to claim 1 and 2 is characterized in that: described potential Bronsted acid is one or more combinations in salt compound, salt compounded of iodine, sulfosalt, microcosmic salt, selenium salt, the diazonium class.
9, claim 1 or 2 described photosensitive compositions, it is characterized in that: described potential Bronsted acid has following structure;
Wherein R represents alkyl, oxyl of hydrogen atom, 1 to 12 carbon etc.; X represents halide ion, p-toluenesulfonic acid root, hexafluoro-phosphate radical, hexafluoroantimonic anion, hexafluoroarsenate root, tetrafluoroborate; N represents the natural number of 1-12.
10, photosensitive composition according to claim 1 and 2 is characterized in that: described infrared absorbing compounds is one or more of following compound: carbon black, phthalocyanine, portion spend cyanines, diazonium indenes.
11, according to the described photosensitive composition of the method for claim 1 or 2, it is characterized in that: described infrared absorbing compounds has following structure:
12, photosensitive composition according to claim 1 and 2 is characterized in that: described acid proliferation generator has following structure:
13, a kind of flat stamping version of using photosensitive composition as claimed in claim 1 to make, it is characterized in that: it comprises base, is the undercoat that contains hydrophilic polymer on base, is attached with the photosensitive coating of aforementioned photosensitive composition at undercoat.
14, flat stamping version according to claim 13 is characterized in that: the described hydrophilic layer that contains hydrophilic agglomerant contains-COOH ,-CH
2OH or-NH
2One or more compounds in the group.
15, flat stamping version according to claim 13 is characterized in that: the material that contains hydrophilic radical in the described hydrophilic layer that contains hydrophilic agglomerant be among PVA, polyvinylpyrrolidone, the acrylic type multipolymer HMMM one or more.
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|---|---|---|---|
| CNB2004100103803A CN100510959C (en) | 2004-06-30 | 2004-06-30 | Photosensitive composition and lithograph plate made of same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100103803A CN100510959C (en) | 2004-06-30 | 2004-06-30 | Photosensitive composition and lithograph plate made of same |
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| CN100510959C CN100510959C (en) | 2009-07-08 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101770167B (en) * | 2008-12-30 | 2012-05-16 | 乐凯集团第二胶片厂 | Positive type infrared light-sensitive composition and positive type heat-sensitive lithographic plate |
| CN101439610B (en) * | 2007-11-22 | 2012-07-04 | 乐凯集团第二胶片厂 | Negative type infrared light responsive composition, negative type printing plate and method of use thereof |
| CN103587273A (en) * | 2013-11-04 | 2014-02-19 | 北京中科纳新印刷技术有限公司 | Photosensitive grain-free printing plate and manufacturing method and application thereof |
| CN107045260A (en) * | 2017-04-12 | 2017-08-15 | 安徽强邦印刷材料有限公司 | A kind of photosensitive layer of heat-sensitive positive picture CTP plate |
-
2004
- 2004-06-30 CN CNB2004100103803A patent/CN100510959C/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101439610B (en) * | 2007-11-22 | 2012-07-04 | 乐凯集团第二胶片厂 | Negative type infrared light responsive composition, negative type printing plate and method of use thereof |
| CN101770167B (en) * | 2008-12-30 | 2012-05-16 | 乐凯集团第二胶片厂 | Positive type infrared light-sensitive composition and positive type heat-sensitive lithographic plate |
| CN103587273A (en) * | 2013-11-04 | 2014-02-19 | 北京中科纳新印刷技术有限公司 | Photosensitive grain-free printing plate and manufacturing method and application thereof |
| CN107045260A (en) * | 2017-04-12 | 2017-08-15 | 安徽强邦印刷材料有限公司 | A kind of photosensitive layer of heat-sensitive positive picture CTP plate |
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| Publication number | Publication date |
|---|---|
| CN100510959C (en) | 2009-07-08 |
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