Background technology
The typical linear brushless motor of rectangular configuration mainly comprises two parts: armature assembly and field assembly, they separate by less air gap each other.
Armature assembly comprises the stacked wafer module of being made up of lamination 10 again, is provided with three phase windings in the slit 12 of this stacked wafer module 10.This stacked wafer module 10 is shown in Figure 1.Field assembly is the rectangle soft magnet plate, and the rectangular magnet of alternating polarity is towards air gap.
The slotted opening 14 of armature assembly is selected as far as possible for a short time usually, thereby makes detent force (cogging force) minimum.Fig. 2 shows typical slotted opening 14.Yet little slotted opening has limited the size of the electric wire that can be used for winding.In addition, slotted opening 14 becomes more little, and it is difficult more that then any machine winding technology also all will become.
In addition, for armature assembly being connected to a mechanical structure, the end face 16 of stacked wafer module 10 should have by hole that get out and screwed.Because lamination is not suitable for such hole, thus the locking wedge 18 that has installing hole be provided with, as shown in Figure 1.In case stamp out groove 20 for these locking wedges 18 on lamination, the distance between the locking wedge 18 just is fixed so, and if do not change the stamping machine that is used for this lamination, just can not change the distance between the locking wedge 18.
On April 3rd, 2002, assignee's that submit to and that transfer the application U.S. Patent application No.10/116495 solved these defectives of existing armature assembly design by a kind of armature assembly design is provided, the winding of coil is convenient in this design, also make simultaneously the detent force minimum, wherein also disclose an installing rack structure, made armature assembly become simple and flexible to the connection of mechanical structure by this installing rack.
Yet still need a kind of armature design, it can provide the detent force that reduces, and this detent force causes by magnetic resistance change rate, causes and the variation of magnetic resistance is a finite length by stacked wafer module.
Brief description of drawings
Fig. 1 is the diagram of the exemplary stack assembly of prior art.
Fig. 2 is the part diagram of the exemplary stack assembly of prior art.
Fig. 3 is a kind of part diagram of stack configuration, and this stacked wafer module is convenient to the coil winding and has also been reduced detent force simultaneously.
Fig. 4 is a kind of part diagram of stacked wafer module, and slotted opening wherein shown in Figure 3 is plugged according to a kind of structure, and this structure is convenient to the coil winding and has also been reduced detent force simultaneously.
Fig. 5 A and Fig. 5 B show according to a kind of part of the stacked wafer module that comprises installing rack of structure diagram, and the syndeton simply and flexibly that this structure provides also shows the wedge among Fig. 4 embodiment simultaneously.
Fig. 6 is the enlarged drawing of the part of tooth in the stacked wafer module in a kind of structure and wedge, and this structure is convenient to coil and is twined and also reduced detent force simultaneously.
Fig. 7 is the perspective view of stacked wafer module according to an embodiment of the invention.
Fig. 8 is the plane graph of stacked wafer module shown in Figure 7.
Fig. 9 is a perspective view of using the armature assembly of stacked wafer module shown in Figure 7.
Figure 10 is according to the preferred embodiment of the present invention, the diagram of the preference relation between the size of the magnet of stacked wafer module and field assembly.
Figure 11 A, 11B and 11C be according to the preferred embodiment of the invention stacked wafer module with respect to the diagram of three positions of field assembly.
The detailed description of disclosed embodiment
On April 3rd, 2002, U.S. Patent application No.10/116495 that submit and that transfer present assignee here was incorporated herein by reference.
With reference now to Fig. 3,, show an a kind of part of stacked wafer module 100 of structure, this structure is convenient to the coil winding and has been reduced detent force simultaneously.As shown in the figure, the tooth 102 of stacked wafer module stretches out from base portion 106.Be used for the width of slit 104 of spaced apart teeth 102 from the bottom (base portion 106) 108 (free ends of tooth) are substantially the same to the top.This toothing with existing stacked wafer module is different, and for example the top of tooth expands outwardly so that the slotted opening 14 between the tooth narrows down in Fig. 2.
According to present embodiment, the top 108 of each tooth 102 has two extra recesses 110, as shown in Figure 3; Recess 110 is used for holding magnetic wedge 112, as shown in Figure 4.The purpose of these magnetic wedges 112 is to make along the difference minimum of the air-gap reluctance of the center line 116 of the center line 114 of tooth 102 and slit 104.This difference is more little, and detent force is just more little.
According in the further embodiment of this invention shown in Fig. 5 A and the 5B, make up armature assembly and comprise: the stacked wafer module 100 that has the winding (not shown); Be arranged in the magnetic wedge 112 of slit 104; And the installing rack of making by soft magnetic material 120.Preferably, installing rack 120 is along the size of the y direction of stacked wafer module 100 size greater than stacked wafer module 100, and its thickness is preferably more than the thickness of the base portion 106 of stacked wafer module 100.Shown in Fig. 5 A, also be preferably more than the width dimensions of stacked wafer module transverse to the width dimensions of the longitudinal axis of stacked wafer module 100.Preferred employing dovetail structure provides the accurate assembling between stacked wafer module 100 and the installing rack 120.
This preferred dovetail structure further illustrates in Fig. 5 B.End at stacked wafer module 100 can see that base portion 106 has a surface outward-dipping towards the direction of the outer surface of base portion 106.Can also see that the end of installing rack 120 has the part 122 and 124 of extending downwards on the direction of tooth 102, its inner surface has the shape that matches with the end of base portion 106.Especially, part 122 and 124 inner surface be to intramedullary expansion, makes the end that part 122 and 124 locking base portions 106 expand outwardly.Though disclose the dovetail structure, should be appreciated that within the spirit of disclosed embodiment also available other structure is positioned at installing rack 120 on the base portion 106 of stacked wafer module 100 as preferred structure.
In the embodiment shown in Fig. 5 A and Fig. 5 B, owing to all parts that are not break iron (base portion 106 and installing rack 120) all are layerings, so the solid section of break iron (installing rack 120) will have extra eddy current losses.Yet, because the cross section of the solid section of break iron is greater than the cross section (Fig. 5 B) of layered portion, so the flux density in the solid section of break iron is relatively low.Therefore, with (flux density)
2Proportional additional eddy current losses also can be lower.
Under the structure of the installing rack of disclosed embodiment, need not change lamination punch for the change that adapts to distance between the installing hole, and, can be by changing the structure that single installing rack changes installing hole, and unlike prior art, need change a plurality of wedges.
Fig. 6 be solid or stratiform magnetic wedge 112 and recess 110 between the expanded view of relation, they are formed on the top 108 of tooth 102 of armature stacked wafer module 100 of the disclosure embodiment.Preferred employing dovetail structure is so that accurately cooperate between tooth 102 and the wedge 112.As shown in Figure 6, wedge 112 has trapezoidal cross section, inwards towards the length on the wedge surface 126 of winding (not shown) greater than length away from winding surface outwardly.Top 108 at each tooth 102 cuts out recess 110, and its shape matches with the size of wedge 112, so that realize that between recess 110 and wedge 112 dovetail cooperates.Should be noted that for the embodiment among Fig. 6 when being placed in wedge 112 in the recess 110, the size of wedge 112 makes it flush basically with the outward surface of tooth 102 away from winding surface outwardly.
Though disclose dovetail structure, should be appreciated that within the spirit of the disclosure embodiment also available other structure is locating wedge 112 between contiguous tooth 102 as preferred structure.
Though top embodiment has improved performance, but still need reduce by the caused detent force of magnetic resistance change rate, this magnetic resistance change rate is that the finite length by stacked wafer module causes.
With reference now to Fig. 7,8,9,10,11A, 11B and 11C,, one embodiment of the invention are disclosed, this embodiment provides a kind of linear brushless DC motor unshakable in one's determination that reduces detent force.Especially, this embodiment has such feature, thereby promptly is configured as the detent force that wedge shape fully reduces linear electric motors by the end tooth 152 and 154 with stacked wafer module 150.In the preferred structure of this embodiment, end tooth can have right triangular cross-sectional in the plane that is parallel to installing rack 156, the hypotenuse in this cross section from the end of stacked wafer module 150 outwards towards.Wedge shape end tooth 152 and 154 Breadth Maximum W along the direction of motion
MaxApproximate the centre-to-centre spacing t between magnet 164 (Figure 10) greatly
pAnd, wedge shape end tooth 152 and 154 minimum widith W along the direction of motion
MinSubstantially be zero (Fig. 8).It will be noted that also each wedge shape end tooth 152 and 154 extends outwardly beyond for example about W of installing rack 156 on the Breadth Maximum this point
Max/ 3.
Another of embodiment shown in Fig. 7,8,9,10,11A, 11B and the 11C be characterised in that, wedge shape end tooth 152 and 154 outer surface do not extend to entire depth as the surface of internal tooth 158.As can be seen from Figure 7, having thickness is that the step 160 of x is between the outer surface of installing rack and wedge shape end tooth 152 and 154.
Fig. 9 shows a kind of armature assembly, and it comprises the stacked wafer module 150 shown in Fig. 7 and 8.It illustrates every an internal tooth 158 and all is surrounded with winding 153. End frame 155 and 157 also is shown has been fixed to the end of installing rack 156, lay respectively at wedge shape end tooth 152 and 154 below.Can see that installing rack 156 has the dovetail type syndeton in its end and inside.It is more detailed that the inclined-plane of the dovetail type structures at place, installing rack 156 ends can be seen in Fig. 7.
As shown in figure 10, preferably, stacked wafer module 150 keeps constant along the total length of the direction of motion, and can equal (N
p+ 1/2) * t
pIn this relational expression, N
pBe the number of magnetic poles below the stacked wafer module 150 (for example: 8,10,12 or the like), t
pBe pole span, wherein in the field assembly 162 that uses with stacked wafer module 150, the centre-to-centre spacing of opposite polarity two adjacent magnets 164 is pole span.For example, disclosed among Figure 10 is the interval that is used for the magnet 164 of the stacked wafer module 150 of the linear brushless DC motor unshakable in one's determination that detent force reduces and field assembly 162, wherein pole span t
pBe 16mm, the number of magnetic poles N below the stacked wafer module
pBe 11.In this structure, the length of stacked wafer module 150 is 16 * (11+1/2)=184mm.Utilize this method, stacked wafer module 150 can cover the magnet (being 11.5 in this case) of about equal number, and needn't consider the position of stacked wafer module with respect to field (magnet) assembly.
In the aforementioned embodiment, the width of the internal tooth 158 of stacked wafer module 150 is approximately 8.2mm, the centre-to-centre spacing t between the internal tooth 158
tBe approximately 14mm.And the magnet of field assembly is approximately 14.4mm along the width of the direction of motion.Should be noted that also because the taper of end tooth 152 and 154, stacked wafer module 150 all has identical " length " (along direction of motion) in any point transverse to the direction of motion.This has diagram at top shown in Figure 10, and wherein top, middle part or the bottom along stacked wafer module 150 all has identical size 11.5 * t
p
Disclosed this stacked wafer module 150 is with respect to the principal character of the structure of field assembly 162 magnet of identical (on an average) quantity that has been stack surface " covering ", and magnetic resistance can not change basically as the function of stacked wafer module position.In this embodiment, the quantity of each pole pair slit (tooth) of answering is near 1 (12 slits are to 11 magnetic poles).This means pole span t
pTooth pitch t no better than
tIn traditional stack configuration, having all is that the stack configuration of lamination of straight-tooth can cover an integer pole span (being 11 in this case).On the contrary, the structure of the disclosure embodiment covers and divides several pole spans (being 11.5 in this case).According to embodiment shown in Figure 10, the length of any longitudinal cross-section of stacked wafer module all equals 11.5 pole spans.For the number of teeth relative among this embodiment, as can be seen, comprise that the number of teeth of the stacked wafer module of end tooth equals N with number of magnetic poles
p+ 1.
Figure 11 A, 11B, 11C illustrate three positions of stacked wafer module 150 with respect to field (magnet) assembly 162, shown that stack surface all is identical on each position for " covering " of magnet 164.Like this, for example in Figure 11 A, can see that the shade of stacked wafer module 150 all approximately covers 11.5 magnets 164 with respect to field assembly 162 along the direction of motion on any longitudinal cross-section.At the top of Figure 11 A, the left side of the shade of stacked wafer module 150 starts from the center of magnet 164, and (direction of motion) extends on 11 entire magnets to the right.The middle part of shade starts from the left side edge of a magnet, and extends on ten magnets and one-half additional magnet to the right.Can see that from Figure 11 A, 11B, 11C for illustrated embodiment, the length on the wedge shape end tooth 152 of stacked wafer module 150 and 154 base approximates pole span t greatly
pAlso as can be seen in this illustrated embodiment, tooth pitch t
tLess than t
pBut greater than 0.75t at least
pShown in Figure 11 A, 11B, the 11C another is characterised in that: in the scope of linear brushless DC motor motion, with respect to magnet 164 diverse locations, have at least a magnet to be covered by tooth no more than in the stacked wafer module for stacked wafer module 150.
In theory, under the situation that does not have fringing flux, will be zero by stacked wafer module in the detent force that finite length caused of the direction of motion, thereby can eliminate detent force.In practice, detent force reduces greatly, almost is suppressed, and has found that motion is very level and smooth.
The term that adopt in this place and only express the purpose unrestricted for explanation, and, be not intended to use these terms and express the equivalent of getting rid of shown and described part or all of feature, will be appreciated that in the scope of disclosed embodiment, to have multiple variation.