CN1838348A - Passive component packaging structure and manufacturing method thereof - Google Patents

Abstract

A passive component packaging structure and a related manufacturing method thereof, the passive component packaging structure comprises a substrate, a plurality of passive components, a ball grid array, and a shell, the plurality of passive components are arranged on the first surface of the substrate, a plurality of solder balls are soldered on the second surface of the substrate using ball grid array technology, the shell has an opening to cover and package the substrate, so that the second surface of the substrate is exposed outside the opening of the shell.

Description

Passive component packaging structure and manufacturing method thereof

technical field

The present invention relates to a passive component packaging structure and its related manufacturing method, in particular to a passive component packaging structure and its related manufacturing method formed by using Ball Grid Array (BGA) packaging technology.

Background technique

As a result of the highly informatized development of modern science and technology, people's demand for information processing has also increased. In order to quickly process and transmit huge amounts of data, it is usually necessary to use various sophisticated electronic equipment. However, with the change of life styles and the demands of the society, electronic equipment and electronic components are developing toward the trend of thinner, smaller, multi-functional, high-performance and high-speed.

Among the various components contained in many electronic products, they can be mainly divided into two categories: active components and passive components. The so-called active components refer to components that can perform data calculations and processing, including various integrated circuit chips; and some electronic components do not perform any calculations on the passing current signals, but only amplify their signal strength, or It simply allows the current signal to pass through. This type of component is called a passive component. A passive component is a circuit component that does not affect the basic characteristics of the signal and only passes the signal without changing it. The most common components are resistors, capacitors, inductors, and rheostats etc. Regarding the resistance part, for example, there are metal wire wound resistors, carbon film resistors, and chip resistors, etc.; for the inductance part, there are transformers, coils, and laminated ceramic inductors, etc.; for the capacitor part, there are mica capacitors, ceramic capacitors, electrolytic capacitors, and Multilayer ceramic capacitors, etc.

Recently, with the rapid development of semiconductor technology, in order to meet the miniaturization, labor saving, and high functionality of passive components, various component manufacturers spare no effort in the application and development of passive component packaging structures.

For the packaging structure of the transformer module, please refer to FIG. 1A and FIG. 1B . FIG. 1A is a schematic diagram showing a known transformer module before packaging. FIG. 1B is a side view showing a packaged conventional transformer module. As shown in FIGS. 1A and 1B , a conventional transformer module 10 includes a transformer 12 and a printed circuit board 20 . The internal structure of the transformer 12 is wound with multi-layer coils (not shown). After being encapsulated by the insulating casing 14 , only a plurality of electrical pins (pins) 16 are exposed outside. The printed circuit board 20 has the same number of electrical pins 16 and corresponding through holes (throughholes) 22. After the electrical pins 16 of the transformer 12 are inserted into the corresponding through holes 22 on the printed circuit board 20, the soldering Soldering on the point 18 completes the manufacturing process of the transformer module 10 . However, in the actual manufacturing process, the penetration hole 22 of the printed circuit board 20 is formed by drilling in a mechanical processing manner. Since the position of the penetration hole 22 on the printed circuit board 20 needs to be precisely matched to the corresponding circuit The alignment of the sex pins 16 is very likely to produce alignment errors during mass production, resulting in defective products of the transformer module 10, which does not meet the production cost requirements.

In order to solve the above problems, the known technology utilizes Surface Mounting Technology (Surface Mounting Technology, SMT) to manufacture the transformer module, please refer to FIG. 2A and FIG. 2B . FIG. 2A is a schematic diagram showing another known transformer module before packaging. FIG. 2B is a side view showing the encapsulated transformer module of FIG. 2A . As shown in FIGS. 2A and 2B , the transformer module 30 includes a transformer 32 and a printed circuit board 40 . The internal structure of the transformer 32 is also wound with multi-layer coils (not shown). After being encapsulated by the insulating case 34 , a plurality of Z-shaped electrical pins 36 extend from two sides of the insulating case 34 . Apply a layer of solder paste 38 on the printed circuit board 40 using surface mount technology, then place the transformer 32 on the printed circuit board 40 where the solder paste 38 is applied, and then send the assembly of the transformer 32 and the printed circuit board 40 to Heat and melt the solder paste 38 on the printed circuit board 40 in a high-temperature soldering furnace, so that the electrical pins 36 of the transformer 32 can be tightly adhered to the printed circuit board 40 , thus completing the manufacturing process of the transformer module 30 .

Although the packaging process of the transformer module 30 solves the problem that the transformer module 10 needs to be additionally drilled on the printed circuit board and the electrical alignment problem, however, because the electrical pins are expanded from the two sides of the transformer and arranged on the printed circuit board board, therefore, it occupies a large space, which does not meet the requirements of today's small-sized components, and when the electrical demand required by the user increases, the electrical pins 36 of the transformer module 30 also need to be increased. , and it is impossible to achieve a better structural design in a limited space.

Contents of the invention

Therefore, in order to solve the above problems, the present invention proposes a ball grid array packaging technology to make the packaging structure of passive components obtain the smallest total volume under the condition of the same semi-finished product.

To this end, the present invention provides a passive component packaging structure, which includes a substrate, a plurality of passive components, a ball grid array, and a housing, the plurality of passive components are arranged on the first surface of the substrate, multiple A solder ball is welded on the second surface of the substrate by ball grid array technology, and the casing has an opening covering and encapsulating the substrate, so that the second surface of the substrate is exposed outside the opening of the casing.

Another object of the present invention is to propose a passive component module, which uses ball grid array packaging technology to provide electrical connection of the passive component module. When the user has a large electrical demand, only the passive component and the The number of solder balls is enough, which not only maintains the total volume of the original module, but also greatly simplifies the structural design, reducing the production cost.

To this end, the present invention provides a passive element module, which includes a substrate, a plurality of passive elements, a ball grid array, and a housing, the plurality of passive elements are arranged on the first surface of the substrate, a plurality of passive elements Solder balls are welded on the second surface of the substrate by ball grid array technology, and the casing has an opening covering and encapsulating the substrate, so that the second surface of the substrate is exposed outside the opening of the casing.

Another object of the present invention is to provide a packaging method for passive components, so that semi-finished products with the same packaging structure of passive components have the smallest packaging structure.

To this end, the present invention provides a packaging method for passive components, comprising the following steps: firstly, a substrate is provided, and the substrate has a corresponding first surface and a second surface; then, disposing multiple substrates on the first surface. a passive component, and use ball grid array technology to weld a plurality of solder balls on the second surface to form a semi-finished product; finally, use a shell with an opening to cover and package the semi-finished product, so that the substrate The substrate The second surface is exposed outside the opening of the casing, thereby completing the packaging of the passive element.

In order to make the above and other purposes, features, and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, together with the accompanying drawings, as follows:

Description of drawings

FIG. 1A is a schematic diagram showing a known transformer module before packaging.

FIG. 1B is a side view showing a packaged conventional transformer module.

FIG. 2A is a schematic diagram showing another known transformer module before packaging.

FIG. 2B is a side view showing the encapsulated transformer module of FIG. 2A .

3A and 3B are schematic diagrams showing the transformer module of the present invention.

FIG. 4A is a schematic diagram showing the packaging structure of the transformer of the present invention before the packaging step.

FIG. 4B is a schematic diagram showing the packaging steps of the transformer packaging structure of the present invention.

Detailed ways

In order to describe the structure and principle of the passive component packaging structure and manufacturing method of the present invention in detail, the following passive components will use a transformer as an example to illustrate the spirit of the present invention.

Please refer to FIG. 3A and FIG. 3B . 3A and 3B are schematic diagrams showing the transformer module of the present invention. As shown in FIG. 3A and FIG. 3B , the transformer module of the present invention includes a substrate 50 and a plurality of annular iron cores 60 , 66 , 70 and 76 .

The cores 60 , 66 , 70 and 76 are wound with more than two coil windings 62 to serve as primary and secondary coils of the transformer. The substrate 50 is a printed circuit board (Printed CircuitBoard; PCB), which has a corresponding first surface 52 and a second surface 82. First, a plurality of pieces of copper or copper alloy metal are disposed on the first surface 52. Thin plate 54 is used as the solder piece of welding coil winding 62, then, the primary side and the secondary side outlet end of coil winding 62 on the iron core 60, 66, 70 and 76 are welded to different metal thin plate 54, finally, again A plurality of solder balls 80 welded by Ball Grid Array (BGA) technology are arranged on the second surface 82, each solder ball 80 will correspond to a metal sheet 54, and the metal sheet 54 on the first surface 52 The number is greater than or equal to the number of solder balls 80 on the second surface 82 .

Since the ball grid array technology can be spot-welded on the second surface 82 to form an array of extremely high-density solder balls, when the electrical requirements of the transformer increase, it is only necessary to increase the number of iron cores, and then the iron cores 60, 66 , 70 , and 76 , the outlet ends of the coil windings 62 are welded to different metal sheets 54 , and then electrically connected to them by solder balls 80 to meet the electrical requirements of the transformer module.

Please refer to FIG. 4A and FIG. 4B. FIG. 4A is a schematic diagram showing the packaging structure of the transformer of the present invention before the packaging step. FIG. 4B is a schematic diagram showing the packaging steps of the transformer packaging structure of the present invention. As shown in Figures 4A and 4B, when the aforementioned transformer module is made, the semi-finished product of the transformer packaging structure of the present invention is completed, and then, a housing 90 with an opening 92 is used to cover and encapsulate the aforementioned transformer module, so that the semi-finished product The second surface 82 of the substrate 50 is exposed outside the opening 92 , and the casing 90 can be a metal casing or a plastic casing. In this way, the manufacturing process of the transformer packaging structure 100 of the present invention is completed. In addition, the transformer packaging structure of the present invention can also fill a glue between the shell 90 and the semi-finished product before packaging the semi-finished product, so that the passive components on the first surface 52 of the substrate 50 have an insulating effect.

In particular, the coil winding wound on the annular iron core of the present invention can be a common metal coil or an enameled wire coated with insulating varnish. In addition, the passive element of the present invention is not limited to a transformer with an iron core wound with more than two sets of coil windings, it can also be a set of coil windings wound on an iron core, or other passive elements such as resistors and capacitors.

Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Those skilled in the art should be able to make various modifications and changes without departing from the spirit and scope of the present invention. Modification, therefore, the scope of protection of the present invention should be defined in the appended claims.

Claims (16)

1. A passive component module, comprising: a substrate having a corresponding first surface and a second surface; a plurality of passive elements, configured on the first surface of the substrate; and A plurality of contacts are distributed on the second surface of the substrate. 2. The passive device module as claimed in claim 1, wherein the substrate is a printed circuit board. 3. The passive component module as claimed in claim 1, wherein the passive component comprises an iron core, a resistor or a capacitor. 4. The passive element module as claimed in claim 3, wherein the iron core is in a ring structure. 5. The passive component module as claimed in claim 3, wherein the iron core is wound with at least one coil winding to provide electrical properties of the passive component module. 6. The passive component module as claimed in claim 5, wherein the coil winding is an enameled wire or a metal coil. 7 . The passive device module as claimed in claim 5 , wherein the substrate further comprises a plurality of thin metal plates formed on the first surface as solder pads of the substrate. 8 . The passive component module as claimed in claim 7 , wherein the at least one turn of the coil winding has at least two lead terminals, which are welded on different metal sheets. 9. The passive device module as claimed in claim 7, wherein each contact corresponds to a thin metal plate. 10. The passive component module as claimed in claim 7, wherein the number of the plurality of thin metal plates is greater than or equal to the number of the contacts. 11. The passive component module as claimed in claim 1, wherein the plurality of contacts are solder balls soldered to the second surface in a ball grid array. 12. A passive component packaging structure, comprising: a substrate having a corresponding first surface and a second surface; a plurality of passive elements configured on the first surface of the substrate; a plurality of contacts distributed on the second surface of the substrate; and A casing is used to cover and encapsulate the substrate, so that the second surface of the substrate is exposed outside the casing. 13. The passive component packaging structure as claimed in claim 12, wherein the housing is made of metal or plastic. 14. A packaging method for passive components, comprising the following steps: providing a substrate having a corresponding first surface and a second surface; disposing a plurality of passive elements on the first surface; disposing a plurality of contacts on the second surface to form a half-finished product; and A housing is used to cover and package the semi-finished product, so that the second surface of the substrate is exposed outside the housing, and then the packaging of the passive element is completed. 15. The packaging method according to claim 14, further comprising: Before the step of packaging the semi-finished product, a glue is filled between the casing and the semi-finished product. 16. The packaging method according to claim 14, wherein the plurality of contacts are soldered to the second surface in a ball grid array manner.

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