GB1149969A - Improvements in or relating to electronic circuit assemblies - Google Patents

Improvements in or relating to electronic circuit assemblies

Info

Publication number
GB1149969A
GB1149969A GB2810766A GB2810766A GB1149969A GB 1149969 A GB1149969 A GB 1149969A GB 2810766 A GB2810766 A GB 2810766A GB 2810766 A GB2810766 A GB 2810766A GB 1149969 A GB1149969 A GB 1149969A
Authority
GB
United Kingdom
Prior art keywords
carrier plate
assemblies
plate
cover
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2810766A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1149969A publication Critical patent/GB1149969A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,149,969. Circuit assemblies. SIEMENS A.G. 23 June, 1966 [25 June, 1965], No. 28107/66. Heading H1R. In a circuit assembly film components are formed on one face of an electrically insulating carrier plate and are embedded in a layer of adhesive synthetic resin material, as specified below, sandwiched between the carrier plate and a cover plate of electrically insulating material. The arrangement of Fig. 1 comprises capacitors 2, resistor 3 and a flat transistor 4 mounted on a glass carrier plate, 1 interconnected by flat conductors 5 and connected to contact surfaces 6 to which external conductors 7 are connected. A further glass cover plate 10 is spaced from the carrier plate 1 by means of spacers 14 and parallel thereto and the space between the two plates is filled by synthetic resin material 8. In the arrangement of Fig. 3 (not shown) two of the assemblies shown in Fig. 1 are stacked one on top of the other, the resin flowing out to keep the whole stack together. The cover-plate can simultaneously serve as the carrier plate for further electrical components, Fig. 4 (not shown), the further components being arranged to face the components disposed upon the first carrier plate. The carrier plate of a further assembly may be employed as the cover-plate of the first assembly, Fig. 5 (not shown), in a stack. In Fig. 6 (not shown), three stacked component assemblies of the kind shown in Fig. 1 are provided, the assemblies being displaced through 90 degrees in relation to one another so that the connecting wires come out at different sides of the stack. Metal foils serving for heat dissipation may be inserted between the cover and carrier plates of stacked assemblies. The adhesive material 8 comprises a flexible aliphatic and/or aromatic epoxy resin having an epoxy number between 0À25 and 0À5, or a mixture of such an epoxy resin with an epoxydized Novolac resin having an epoxy number between 0À54 and 0À57, methylendomethylene-tetrahydrophthalic anhydride as a hardener and tris-dimethylaminomethylphenol as an accelerator; or a rigid aromatic epoxy resin having an epoxy number of 0À53, a mixture of phthalic anhydride and tetrahydrophthalic anhydride as a hardener and p,p<SP>1</SP>-dimethylaminodiphenylmethane as an accelerator. Reference has been directed by the Comptroller to Specification 1,030,151.
GB2810766A 1965-06-25 1966-06-23 Improvements in or relating to electronic circuit assemblies Expired GB1149969A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0097830 1965-06-25

Publications (1)

Publication Number Publication Date
GB1149969A true GB1149969A (en) 1969-04-23

Family

ID=7521011

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2810766A Expired GB1149969A (en) 1965-06-25 1966-06-23 Improvements in or relating to electronic circuit assemblies

Country Status (2)

Country Link
GB (1) GB1149969A (en)
NL (1) NL6608593A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009190A1 (en) * 1978-09-27 1980-04-02 International Business Machines Corporation Curable composition useful for screen-printing, a cured coating comprising said composition and process for soldering printed circuit boards using said composition
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4720740A (en) * 1985-11-26 1988-01-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009190A1 (en) * 1978-09-27 1980-04-02 International Business Machines Corporation Curable composition useful for screen-printing, a cured coating comprising said composition and process for soldering printed circuit boards using said composition
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4720740A (en) * 1985-11-26 1988-01-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same

Also Published As

Publication number Publication date
NL6608593A (en) 1966-12-27

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