GB2080630B - Printed circuit panels - Google Patents

Printed circuit panels

Info

Publication number
GB2080630B
GB2080630B GB8125045A GB8125045A GB2080630B GB 2080630 B GB2080630 B GB 2080630B GB 8125045 A GB8125045 A GB 8125045A GB 8125045 A GB8125045 A GB 8125045A GB 2080630 B GB2080630 B GB 2080630B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit panels
panels
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8125045A
Other versions
GB2080630A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ingram & Glass Ltd
Original Assignee
Ingram & Glass Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ingram & Glass Ltd filed Critical Ingram & Glass Ltd
Priority to GB8125045A priority Critical patent/GB2080630B/en
Publication of GB2080630A publication Critical patent/GB2080630A/en
Application granted granted Critical
Publication of GB2080630B publication Critical patent/GB2080630B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8125045A 1980-08-21 1981-08-17 Printed circuit panels Expired GB2080630B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8125045A GB2080630B (en) 1980-08-21 1981-08-17 Printed circuit panels

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8027228 1980-08-21
GB8125045A GB2080630B (en) 1980-08-21 1981-08-17 Printed circuit panels

Publications (2)

Publication Number Publication Date
GB2080630A GB2080630A (en) 1982-02-03
GB2080630B true GB2080630B (en) 1985-07-10

Family

ID=26276643

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8125045A Expired GB2080630B (en) 1980-08-21 1981-08-17 Printed circuit panels

Country Status (1)

Country Link
GB (1) GB2080630B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
DE3447520A1 (en) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
IL120866A0 (en) * 1997-05-20 1997-09-30 Micro Components Systems Ltd Process for producing an aluminum substrate
GB9803236D0 (en) * 1998-02-17 1998-04-08 Pressac Interconnect Limited Printed circuit assembly and method of making the same
IL127256A (en) 1998-11-25 2002-09-12 Micro Components Ltd Device for electronic packaging, a process for manufacturing thereof, and a pin jig fixture for use in the process
WO2001050822A1 (en) * 1999-12-30 2001-07-12 Lear Automotive (Eeds) Spain, S.L. Composite material for obtaining printed circuits, production method thereof and printed circuit board obtained from said composite material
EP1587348A1 (en) * 2004-03-30 2005-10-19 Feng Chia University Conductive base board

Also Published As

Publication number Publication date
GB2080630A (en) 1982-02-03

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee