GB2082388A - Improvements in or relating to carrier racks for disc-like objects - Google Patents
Improvements in or relating to carrier racks for disc-like objects Download PDFInfo
- Publication number
- GB2082388A GB2082388A GB8124972A GB8124972A GB2082388A GB 2082388 A GB2082388 A GB 2082388A GB 8124972 A GB8124972 A GB 8124972A GB 8124972 A GB8124972 A GB 8124972A GB 2082388 A GB2082388 A GB 2082388A
- Authority
- GB
- United Kingdom
- Prior art keywords
- rods
- carrier rack
- rack
- carrier
- slots
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
- H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/10—Reaction chambers; Selection of materials therefor
- C30B31/103—Mechanisms for moving either the charge or heater
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/005—Oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
A carrier rack for holding disc- like objects, e.g. semiconductor discs, wafers or slices which rack consists of two pairs of slotted transparent fused silica rods 1 and 2 which are secured to transparent fused silica tubes 3 between each pair of rods at their end area. The upper rods 1 have bores 5 at their end areas to provide index marks on transfer of discs between the silica rack and a plastics carrier rack. The rods may have slots of a greater width at periodically recurring spaces (eg for dopant sources) as well as the slots previously referred to. An additional transverse support tube may be provided between the ends of the rack. <IMAGE>
Description
SPECIFICATION
Improvements in or relating to carrier racks for disc-like objects
The present invention relates to carrier racks of transparent fused silica to hold a plurality of disc-like objects, the edge areas of which objects extend into slots in elements of the rack, said elements comprising two pairs of rods each provided with slots and extending parallel to each other, the space between one pair of rods being greater than the space between the other pair of rods, both pairs of rods being held immovably in the area of their ends. In use the rack is positioned so that rods are substantially horizontal, the widerspaced rods being above the closer-spaced rods. Hereinafter such racks will be referred to as "of the kind described".
Carrier racks of the kind described are disclosed in British Patent Specification No. GB
PS 1 426 503, and have proven very efficient in use. Generally speaking they find application in the semi-conductor industry for processing and holding semiconductor wafers or slices.
It is an object of the present invention to provide a carrier rack of the kind described which is simple to make and economical in use of the expensive transparent fused silica involved and so that the racks loaded with semiconductor wafers or slices can easily be manipulated, and enables them to be easily loaded or reloaded with semiconductor wafers from the usual storage racks of ordinary plastics materials.
It is another object that the use of such racks shall be extended.
Accordingly, the invention consists in a carrier rack of the kind described wherein a transparent fused silica tube is secured at or adjacent each end area of the rods and transversely between the wider and closer-spaced pairs of rods. Advantageously the tubes are welded to the rods.
In order that the invention may be more clearly understood, reference will now be made to the accompanying drawings which show certain embodiments thereof by way of example and in which:
Figure 1 shows an elevation of a first embodiment,
Figure 2 shows an elevation of a second embodiment, and
Figure 3 shows an elevation of a slotted rod.
Referring now to the drawings, Fig. 1 shows a carrier rack which comprises six parts viz. a pair of upper rods 1, a pair of lower rods 2, and two transverse rods 3 arranged between the pair of rods 1, 2, and adjacent the end areas thereof. All the rods and tubes are of transparent fused silica and the tubes are each welded to the upper and lower rods
at points 4. The rods 1 and 2 are slotted at 7,
the slots all being of the same width and into
which can be engaged the end areas of semi
conductor wafers or slices with which the carrier rack is to be loaded in one example of
use. As can be seen from Fig. 1, the ends of
the transparent fused silica tubes 3 are down
wardly chamfered.The transparent fused silica
tubes 3 which are arranged transversely to the rods 1, 2 are arranged to receive the tines 6
of a forked handle with which the loaded or
unloaded carrier racks can be held and
moved. The ends of the upper rods 1 are also
pierced with bores 5 which serve as indexing marks on transferring the semi-conductor
discs from a plastics carrier rack for example
to a carrier rack and vice versa.
The embodiment shown in Fig. 2 differs
from that shown in Fig. 1 in that the upper and lower pairs of rods 1, and 2 have an
unslotted area 8 each at a given distance from
the rod ends and each of these areas is
welded to an additional securing tube 9 of
transparent fused silica which is mounted transversely to and between the pairs of rods
1 and 2. This reinforcing tube enables double
carrier racks or multiple-length carrier racks to
be made compared with what might be the
normal length of a rack as shown in Fig. 1
and each "normal" length of such a multiple
rack can be separated from its neighbour by a
pre-determined distance by such additional
tube.
Instead of the rods 1 and 2 with slots of the
same width as used in Figs. 1 and 2, two
rods 10 can be used as shown in the embodi
ment according to Fig. 3, having slots 7 of
the same width and slots 11 of greater width.
The slots 11 and be located at periodically
recurrent spacings 12 in the rod 10 to serve
for the reception of plate-like or differently
shaped dopant wafers or slices, the slots 7
still serving to receive semiconductor discs.
Carrier racks with rods 10 formed in this way
are used for carrying out a doping process
with the help of solid sources whereas carrier
racks with rods 1 and 2 according to Figs. 1
and 2 are used for other methods of process
ing for semi-conductor discs such as the oxi
dation and tempering processes as well as
doping from the gas phase.
Claims (9)
1. A carrier rack of the kind described,
wherein a transparent fused silica tube is
secured at or adjacent each end area of the
rods and transversely thereto between the
wider and closer-spaced pairs of rods.
2. A carrier rack as claimed in claim 1,
wherein all said rods have an unslotted area at
a given distance from the ends of the rod, and
said area being secured to an additional secur
ing tube which is arranged transversely to and
between the pairs of rods.
3. A carrier rack as claimed in claim 1 or 2, wherein the ends of the tubes interconnecting the pairs of rods are downwardly chamfered.
4. A carrier rack as claimed in claim 1, 2 or 3, wherein each rod of the pair is pierced with a bore adjacent their end areas.
5. A carrier rack as claimed in any of the preceding claims, wherein all said rods have some slots of greater width than the remaining slots at periodically recurrent intervals.
6. A carrier rack as claimed in any of the preceding claims, wherein the rods and tubes are welded together.
7. A carrier rack substantially as hereinbefore described with reference to Fig. 1 of the accompanying drawings.
8. A carrier rack substantially as hereinbefore described with reference to Fig. 2 of the accompanying drawings.
9. A carrier rack substantially as hereinbefore described with reference to Fig. 3 of the accompanying drawings.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19808021868 DE8021868U1 (en) | 1980-08-16 | 1980-08-16 | CARRIER HORDE FOR SEMICONDUCTOR DISCS |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2082388A true GB2082388A (en) | 1982-03-03 |
GB2082388B GB2082388B (en) | 1984-05-23 |
Family
ID=6718055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8124972A Expired GB2082388B (en) | 1980-08-16 | 1981-08-14 | Improvements in or relating to carrier racks for disc-like objects |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5737826A (en) |
DE (1) | DE8021868U1 (en) |
FR (1) | FR2488731A1 (en) |
GB (1) | GB2082388B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0100539A2 (en) * | 1982-07-30 | 1984-02-15 | Tecnisco Ltd. | Assembled device for supporting semiconductor wafers or the like |
EP0267462A2 (en) * | 1986-11-12 | 1988-05-18 | Heraeus Amersil, Inc. | Mass transferable semiconductor substrate processing and handling full shell carrier (boat) |
US4775317A (en) * | 1984-11-16 | 1988-10-04 | Heraeus Quarzschmelze Gmbh | Oven for the heat treatment of semiconductor substrates |
WO1996007199A2 (en) * | 1994-08-31 | 1996-03-07 | Heraeus Quarzglas Gmbh | Quartz glass jig for the heat treatment of silicon wafers and method and device for producing same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844836U (en) * | 1981-09-21 | 1983-03-25 | 日本電気ホームエレクトロニクス株式会社 | Semiconductor manufacturing jig |
DE3419866C2 (en) * | 1984-05-28 | 1986-06-26 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Carrier tray made of quartz glass for disk-shaped substrates |
DE3440111C1 (en) * | 1984-11-02 | 1986-05-15 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Carrier horde |
DE3829159A1 (en) * | 1988-08-27 | 1990-03-08 | Westdeutsche Quarzschmelze Gmb | Device for holding semiconductor wafers |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5068775A (en) * | 1973-10-19 | 1975-06-09 | ||
JPS53133366A (en) * | 1977-04-27 | 1978-11-21 | Nec Corp | Impurity diffusion method |
-
1980
- 1980-08-16 DE DE19808021868 patent/DE8021868U1/en not_active Expired
-
1981
- 1981-04-20 JP JP5866081A patent/JPS5737826A/en active Granted
- 1981-08-14 GB GB8124972A patent/GB2082388B/en not_active Expired
- 1981-08-14 FR FR8115738A patent/FR2488731A1/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0100539A2 (en) * | 1982-07-30 | 1984-02-15 | Tecnisco Ltd. | Assembled device for supporting semiconductor wafers or the like |
EP0100539A3 (en) * | 1982-07-30 | 1985-05-22 | Tecnisco Ltd. | Assembled device for supporting semiconductor wafers or the like |
US4775317A (en) * | 1984-11-16 | 1988-10-04 | Heraeus Quarzschmelze Gmbh | Oven for the heat treatment of semiconductor substrates |
EP0267462A2 (en) * | 1986-11-12 | 1988-05-18 | Heraeus Amersil, Inc. | Mass transferable semiconductor substrate processing and handling full shell carrier (boat) |
EP0267462A3 (en) * | 1986-11-12 | 1990-01-31 | Heraeus Amersil, Inc. | Mass transferable semiconductor substrate processing and handling full shell carrier (boat) |
WO1996007199A2 (en) * | 1994-08-31 | 1996-03-07 | Heraeus Quarzglas Gmbh | Quartz glass jig for the heat treatment of silicon wafers and method and device for producing same |
WO1996007199A3 (en) * | 1994-08-31 | 1996-05-02 | Heraeus Quarzglas | Quartz glass jig for the heat treatment of silicon wafers and method and device for producing same |
Also Published As
Publication number | Publication date |
---|---|
JPS5737826A (en) | 1982-03-02 |
GB2082388B (en) | 1984-05-23 |
JPS6141128B2 (en) | 1986-09-12 |
FR2488731B3 (en) | 1983-06-10 |
DE8021868U1 (en) | 1981-01-29 |
FR2488731A1 (en) | 1982-02-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |