GB2294363A - Flexible multi-layered wiring board - Google Patents
Flexible multi-layered wiring board Download PDFInfo
- Publication number
- GB2294363A GB2294363A GB9521224A GB9521224A GB2294363A GB 2294363 A GB2294363 A GB 2294363A GB 9521224 A GB9521224 A GB 9521224A GB 9521224 A GB9521224 A GB 9521224A GB 2294363 A GB2294363 A GB 2294363A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass epoxy
- epoxy base
- circuit patterns
- base
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A flexible multi-layered wiring board includes a first glass epoxy base 1, at least one second glass epoxy base 2, 3, and a glass epoxy resin layer 4, 5. The first glass epoxy base 1 has a thickness enough to impart flexibility and circuit patterns 11a, 11b formed on two surfaces thereof. The second glass epoxy base 4, 5 has circuit patterns 12a, 12b, 13a, 13b formed on two surfaces thereof and is stacked on the first glass epoxy base 1 in a thick region. The glass epoxy resin layer 4, 5 is arranged between the first and second glass epoxy bases to insulate the circuit patterns and adhere the first and second glass epoxy bases. <IMAGE>
Description
Specification
Title of the Invention
Flexible Multi-Layered Wiring Board
and Method of Manufacturing the Same
Background of the Invention
The present invention relates to a multi-layered wiring board and, more particularly, to a flexible multi-layered wiring board bendable in use and a method of manufacturing the same.
A part or all the printed wiring board used for a communication terminal device or any other electronic device has flexibility due to the limitation of a space in the electronic device. This printed wiring board is bent and then incorporated in the electronic device. For this reason, as such a conventional printed wiring board, a printed wiring board obtained by forming a predetermined conductive pattern on a flexible polyimide base has been used. A multi-layered printed wiring board having a large number of layers by using polyimide bases has also been proposed.
If the thickness of a board is increased, however, its flexibility is decreased even with a polyimide base, so that an increase in thickness is limited. For example, when a multi-layered wiring board is constituted by three or more layers, desired flexibility cannot be obtained. It is difficult to incorporate this board in an electronic device. For this reason, e.g., Japanese Patent Laid-Open
No. 4-112594 proposes the following printed wiring board. That is, as shown in Fig. 5, a portion 14 of a printed wiring board 21 constituted by an insulating base 22 and a circuit pattern 23 is irradiated with a laser beam to decrease the thickness of the portion 24 of the insulating base 22. The printed wiring board 21 is bent at the thin portion 14. In this manner, the printed wiring board 21 has flexibility.
In this general multi-layered wiring board using a polyimide base, it is confirmed that problems are posed on the micropatterning accuracy of a circuit pattern formed by printing, and the like due to a polyimide having a high absorption. More specifically, due to the high absorption, bubbles are produced between inner layers by reflow or the like in the assembly of an electronic device on a multi-layered wiring board, the dimensions of the multi-layered wiring board are changed, an insulating resistance is decreased, and the like. The electrical characteristics of the board, therefore, are changed to easily change the impedance of an electronic circuit, and particularly an RF circuit, formed on the board, and easily lose the gain.
To the contrary, if a glass epoxy base is used, there is provided a printed circuit board which can hardly be influenced by a deterioration over time and an environmental change and has stable electrical characteristics. However, the flexibility of this glass epoxy base is lower than that of an epoxy base. For this reason, e.g., Japanese Utility Model Laid-Open
No. 62-80369 tries to assure the flexibility of a printed wiring board by forming the board so as to limit a thickness within the range of 0.05 to 0.25 mm.
Also in the glass epoxy base, however, if the entire thickness is decreased as described above, degradations in electrical characteristics such as an inter-signal interference, a change in impedance, and a loss of the gain may undesirably occur in constituting, e.g., an RF microstrip line. When a multi-layered wiring board having two or more layers is practically formed using glass epoxy bases, the entire thickness of the glass epoxy bases becomes larger than that shown in
Japanese Utility Model Laid-Open No. 62-80369, thereby degrading the flexibility.
To allow such a multi-layered wiring board consisting of a glass epoxy base to have flexibility, it is considered that part of the board is irradiated with a laser beam to decrease a thickness, as in Japanese
Patent Laid-Open No. 4-112594. In practice, it is difficult to decrease the thickness of a glass epoxy base by this method, so this method cannot be used without any change. In addition, if the thickness is decreased by such a method, a predetermined circuit pattern formed at this portion is damaged. The circuit pattern at this portion is disconnected to degrade the function of the multi-layered wiring board.
Summarv of the Invention
It is an object of at least the preferred embodiments of the present invention to provide a flexible multi-layered wiring board intended to assure flexibility and prevent a degradation in electrical characteristics, and a method of manufacturing the same.
In order to achieve the above object, according to the present invention, there is provided a flexible multi-layered wiring board comprising a first glass epoxy base having a predetermined thickness enough to impart flexibility and circuit patterns formed on two surfaces thereof, part of the first glass epoxy base constituting a thin region, and a remaining portion constituting a thick region, at least one second glass epoxy base having circuit patterns formed on two surfaces thereof and stacked on the first glass epoxy base in the thick region, and a glass epoxy resin layer, arranged between the first and second glass epoxy bases, for insulating the circuit patterns, and adhering the first and second glass epoxy bases to constitute an integrally stacked structure in which the thin region is flexible in a direction of thickness.
Brief DescriPtion of the Drawings
Fig. 1 is a sectional view showing a multi-layered wiring board according to an embodiment of the present invention;
Figs. 2A to 2C are sectional views sequentially showing the steps of a method of manufacturing the multi-layered wiring board in Fig. 1;
Figs. 3A and 3B are perspective views showing states of the multi-layered wiring board in Fig. 1 before and after bending, respectively;
Fig. 4 is a sectional view showing a modification of the multi-layered wiring board of the present invention; and
Fig. 5 is a sectional view showing a conventional flexible printed wiring board.
DescriDtion of the Preferred Embodiment
An embodiment of the present invention will be described below with reference to the accompanying drawings. Fig. 1 shows the main portion of a multi-layered wiring board according to an embodiment of the present invention. Fig. 1 exemplifies the multi-layered wiring board obtained by stacking three insulating bases 3, 1, and 2 in this order so as to sandwich the insulating base 1 between the insulating bases 2 and 3. This multi-layered wiring board has a total of six-layered circuit patterns formed on the upper and lower surfaces of the insulating bases 1, 2, and 3, respectively. Each of the three insulating bases 1, 2, and 3 consists of a glass epoxy base called a prepreg. Of these glass epoxy bases, the middle glass epoxy base 1 is formed to have a thickness of 50 to 100 zm so as to stand bending.Each of the upper and lower glass epoxy bases 2 and 3 is formed to have an arbitrary thickness of 100 zm or more.
Predetermined circuit patterns lia, llb, 12a, 12b, 13a, and 13b each consisting of a copper foil are formed on the upper and lower surfaces of the insulating bases 1, 2, and 3, respectively. These glass epoxy bases 1, 2, and 3 are stacked through glass epoxy resin layers 4 and 5 in regions (thick regions A) except for part of the glass epoxy base 1 to be sandwiched. The glass epoxy bases 1, 2, and 3 are strongly adhered to each other through the glass epoxy resin layers 4 and 5 to form an integral structure. Protection films 6 such as polyimide films are formed on the upper and lower surfaces of the glass epoxy base 1 in the region (thin region B) where no base is stacked, covering the circuit patterns lla and llb.
Insulating protection films (solder resist films) 7 consisting of a material such as ultraviolet-curing ink are formed on exposing surfaces, i.e., the two upper surfaces of the glass epoxy bases 1 and 2, and the lower surface of the glass epoxy base 3 are covered to cover the circuits patterns on these surfaces. Through holes 8 extending through the glass epoxy bases 1, 2, and 3 in the direction of thickness are formed to electrically connect the six-layered circuit patterns.
Figs. 2A to 2C sequentially show the steps of a method of manufacturing the multi-layered wiring board in Fig. 1. First of all, as shown in Fig. 2A, the glass epoxy base 1 to be sandwiched is formed to have a thickness of 50 to 100 zm so as to stand bending.
Copper foils formed on the two surfaces of the glass epoxy base 1 are selectively etched by photolithography to form the circuit patterns lla and 1lib. Thin polyimide films are adhered as the protection films 6 to the two surfaces of the glass epoxy base 1 in a region to be bent.
Next, as shown in Fig. 2B, the glass epoxy resin layers 4 and 5 are formed by selective printing or the like to the upper and lower surfaces of the glass epoxy base 1 in regions except for the region where the polyimide films 6 are adhered to have a thickness of about 100 to 200 zm. In this case, thin glass epoxy resin plates each having a predetermined size and thickness may be arranged on and adhered to the two surfaces of the glass epoxy base 1.
As shown in Fig. 2C, the circuit patterns 12a, 12b, 13a, and 13b are respectively formed on the upper and lower surfaces of the glass epoxy bases 2 and 3 each having a thickness of 100 zm or more by using copper foils according to the above method. These glass epoxy bases 2 and 3 are adhered to the glass epoxy resin layers 4 and 5 respectively formed to the upper and lower surfaces of the glass epoxy base 1, respectively.
The three glass epoxy bases 1, 2, and 3 are vertically pressed by a press machine. The glass epoxy resin layers are hardened to form a multi-layered wiring board having a total thickness of about 1 mm.
Thereafter, through holes are formed in required portions. The through holes 8 for electrically connecting the circuit patterns to each other are formed by, e.g., metallizing a region including the through holes to form the multi-layered wiring board shown in
Fig. 1.
As a result, the multi-layered wiring board formed in this manner has the thin region B constituted by only one glass epoxy base 1, and the thick regions A obtained by stacking the three glass epoxy bases 1, 2, and 3. The sufficiently thick board, therefore, can be assured. A circuit such as an RF microstrip line is formed in the thick region A having the multi-layered structure to prevent degradations in electrical characteristics such as an inter-signal interference, a decrease in impedance, and a loss of the gain. On the other hand, the flexibility of the multi-layered wiring board can be assured in the thin region B due to the presence of the thin region B in part of this multi-layered wiring board.Fig. 3A shows a state in which various electronic components P are mounted in the regions having the multi-layered wiring structures as the thick regions A, and then the multi-layered wiring board is bent at the thin region B. As shown in
Fig. 3B, the multi-layered wiring board can be bent through substantially lug00 so as to allow the two thick regions A, which sandwich the thin region B therebetween and have the multi-layered structures, to face each other.
In this manner, the thin region B for flexibility is provided as part of the multi-layered wiring board having the thick regions A. Since the thickness of the thin region B is decreased not by, e.g., being irradiated with a laser beam, the circuit pattern is not damaged and disconnected in this thin region B, and the function of the multi-layered wiring board is not degraded. Especially by forming the protection films 6 on the thin region B, one of the circuit patterns ila and 11b which is exposed on the outer surface of the multi-layered wiring board bent at a bending portion can be effectively prevented from being damaged.
The above embodiment has exemplified the structure in which the thin region B is formed by the second glass epoxy base 1 in the three-layered structure constituted by the glass epoxy bases 1, 2, and 3, thereby assuring the flexibility. Alternatively, the glass epoxy base 1 which has the thin region B may be arranged on the first or third layer.
In addition, the above embodiment has exemplified the three-layered wiring board. The number of layers is not limited to three. The multi-layered wiring board may be constituted as follows. That is, as shown in Fig. 4, two glass epoxy bases 101 and 102 are stacked through a glass epoxy resin layer 104 to form the thick regions A, and only one of the glass epoxy bases 101 and 102 forms the thin region B to assure flexibility. Four-layered circuit patterns lila, lllb, 112a, and 112b are formed on the glass epoxy bases 101 and 102, respectively. Reference numeral 106 denote protection films; 107, insulating protection films; and 108, a through hole.
Further, the multi-layered wiring board may be constituted by four or more glass epoxy bases, and a thin region may be formed by one of the glass epoxy bases.
As has been described above, according to the present invention, the thin region constituted by only one glass epoxy base is formed as part of the plane region of the multi-layered wiring board obtained by stacking a plurality of glass epoxy bases each of which has the circuit patterns respectively formed on the upper and lower surfaces thereof. With this arrangement, the electrical characteristics can be effectively improved by using the glass epoxy bases. In addition, the flexibility of the multi-layered wiring board can be assured in the thin region, and the multi-layered structures can be realized in the other regions. Therefore, the flexible multi-layered wiring board can be realized with the advantage of the multi-layered structure.
The insulating protection films such as polyimide films are formed on the surfaces of one glass epoxy base which constitutes the thin region. This insulating protection films can protect the circuit patterns formed on this glass epoxy base from bending.
According to the method of manufacturing the multi-layered wiring board of the present invention, insulating protection films are formed on the upper and lower surfaces in part of the flat region of the first glass epoxy base which has circuit patterns formed thereon and is formed to have a thickness enough to impart flexibility. A glass epoxy resin layer is formed on at least one of the upper and lower surfaces of the glass epoxy base except for this region. Another relatively thick glass epoxy base having circuit patterns formed thereon is placed on the glass epoxy resin layer. These layers are pressed against the first glass epoxy base to form an integral structure. In this manner, a flexible multi-layered wiring board can be manufactured in a small number of steps.
Each feature disclosed in this specification (which term includes the claims) and/or shown in the drawings may be incorporated in the invention independently of other disclosed and/or illustrated features.
The appended abstract as filed herewith is included in the specification by reference.
Claims (11)
1. A flexible multi-layered wiring board characterized by comprising:
a first glass epoxy base (1, 101) having a predetermined thickness enough to impart flexibility and circuit patterns (lla, llb, llla, lllb) formed on two surfaces thereof, part of said first glass epoxy base constituting a thin region (B), and a remaining portion constituting a thick region (A);
at least one second glass epoxy base (2, 102) having circuit patterns (12a, 12b, 112a, 112b) formed on two surfaces thereof and stacked on said first glass epoxy base in said thick region; and
a glass epoxy resin layer (4, 104), arranged between said first and second glass epoxy bases, for insulating said circuit patterns, and adhering said first and second glass epoxy bases to constitute an integrally stacked structure in which said thin region is flexible in the direction of its thickness.
2. A board according to claim 1, wherein said first glass epoxy base has a thickness of 20 to 100 zm.
3. A board according to claim 1, further comprising protection films (6, 106) for covering said two surfaces of said first glass epoxy base in said thin region to protect said circuit patterns.
4. A board according to claim 3, wherein said protection films comprise polyimide films adhered to said two surfaces of said first glass epoxy base in said thin region.
5. A board according to claim 1, further comprising insulating protection films (7, 107) for covering exposing surfaces of said stacked structure corresponding to said thick region to insulate and protect said circuit patterns.
6. A board according to claim 1, wherein said second glass epoxy base has a thickness larger than a thickness of said first glass epoxy base.
7. A flexible multi-layered wiring board characterized by comprising:
a first glass epoxy base (1, 101) having a predetermined thickness enough to impart flexibility and circuit patterns (lla, llb, llla, 111b) formed on two surfaces, part of said first glass epoxy base constituting a thin region (B), and a remaining portion constituting a thick region (A);
second and third glass epoxy bases (2, 3, 102) which have circuit patterns (12a, 12b, 13a, 13b, 112a, 112b) formed on two surfaces of each of said second and third epoxy bases, are respectively stacked on said two surfaces of said first glass epoxy base in said thick region, and have a thickness larger than a thickness of said first glass epoxy base;;
glass epoxy resin layers (4, 5, 104), respectively arranged between said first glass epoxy base and said second and third glass epoxy bases, for insulating said circuit patterns, and respectively adhering said first glass epoxy base and said second and third glass epoxy bases to constitute an integrally stacked structure in which said thin region is flexible in a direction of thickness;
protection films (6, 106) for covering said two surfaces of said first glass epoxy base in said thin region to protect said circuit patterns; and
insulating protection films (7, 107) for covering exposing surfaces of said stacked structure corresponding to said thick region to insulate and protect said circuit patterns.
8. A method of manufacturing a flexible multi-layered wiring board, characterized by comprising:
the step of forming insulating protection films (6, 106) on two surfaces, in a predetermined region (B), of a first glass epoxy base (1, 101) having a predetermined thickness enough to impart flexibility and circuit patterns (lea, llb, llla, 111b) formed on said two surfaces;
the step of forming a glass epoxy resin layer (4, 104) on at least one surface of said first glass epoxy base in a region (A) where said insulating protection film is not formed;
the step of stacking, on said glass epoxy resin layer, a second glass epoxy base having circuit patterns (12a, 12b, 112a, 112b) formed on two surfaces thereof; and
the integrally stacked structure constituting step of pressing at least said first and second glass epoxy bases and said first glass epoxy resin layer to constitute an integrally stacked structure.
9. A method according to claim 8, further comprising the steps of:
forming a second glass epoxy resin layer (5) on the other surface of said first glass epoxy base in said region where said insulating protection film is not formed in correspondence with said first glass epoxy resin layer; and
stacking, on said second glass epoxy resin layer, a third glass epoxy base (3) having circuit patterns (13a, 13b) formed on two surfaces thereof, and
wherein the integrally stacked structure constituting step constitutes an integrally stacked structure obtained by pressing said first to third glass epoxy bases and said first and second glass epoxy resin layers.
10. A method according to claim 8, further comprising the step of forming an insulating protection film (7, 107) on an exposing surface of said stacked structure corresponding to a thick region to insulate and protect said circuit pattern.
11. A flexible multi-layered wiring board, or a method of manufacture thereof substantially as herein described with reference to Figures 1 to 4 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28292394A JPH08125342A (en) | 1994-10-21 | 1994-10-21 | Flexible multilayered wiring board and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9521224D0 GB9521224D0 (en) | 1995-12-20 |
| GB2294363A true GB2294363A (en) | 1996-04-24 |
Family
ID=17658870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9521224A Withdrawn GB2294363A (en) | 1994-10-21 | 1995-10-17 | Flexible multi-layered wiring board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH08125342A (en) |
| GB (1) | GB2294363A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2127125A1 (en) * | 1997-02-05 | 1999-04-01 | Mecanismos Aux Ind | Improvements introduced in printed circuit manufacturing |
| EP0971568A2 (en) * | 1998-07-02 | 2000-01-12 | Robert Bosch Gmbh | Electronic component |
| US6288343B1 (en) * | 1998-10-08 | 2001-09-11 | Samsung Electronics Co., Ltd. | Printed circuit board |
| EP1224847A1 (en) * | 1999-10-01 | 2002-07-24 | Motorola Inc. | Flexible circuit board and method for making a flexible circuit board |
| WO2004084595A1 (en) * | 2003-03-19 | 2004-09-30 | Hirschmann Electronics Gmbh & Co. Kg | Domed circuit board of an antenna amplifier for a vehicle antenna device |
| EP1768470A1 (en) * | 2004-06-10 | 2007-03-28 | Ibiden Co., Ltd. | Flex-rigid wiring board and manufacturing method thereof |
| US7378596B2 (en) | 2003-04-18 | 2008-05-27 | Ibiden Co., Ltd. | Rigid-flex wiring board |
| US7423219B2 (en) | 2004-06-11 | 2008-09-09 | Ibiden Co., Ltd. | Flex-rigid wiring board |
| CN101770959A (en) * | 2009-01-05 | 2010-07-07 | 伊姆贝拉电子有限公司 | Rigid-flex module and manufacturing method |
| WO2019055436A1 (en) * | 2017-09-12 | 2019-03-21 | Knowles Cazenovia, Inc. | Vertical switched filter bank |
| CN109600912A (en) * | 2018-12-13 | 2019-04-09 | 中科芯集成电路股份有限公司 | Flexible rigid PCB circuit board of one kind and preparation method thereof |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4586424B2 (en) * | 2004-03-15 | 2010-11-24 | 日立化成工業株式会社 | Printed circuit board |
| JP4735092B2 (en) * | 2004-07-14 | 2011-07-27 | 日立化成工業株式会社 | Printed circuit board |
| TW200638811A (en) | 2004-09-21 | 2006-11-01 | Ibiden Co Ltd | Flexible printed wiring board |
| JP2007096131A (en) * | 2005-09-29 | 2007-04-12 | Toshiba Corp | Printed wiring board |
| CN102469699B (en) * | 2010-11-12 | 2014-05-21 | 富葵精密组件(深圳)有限公司 | Rigid-flex circuit board manufacturing method |
| CN103096647B (en) * | 2011-10-31 | 2016-01-13 | 健鼎（无锡）电子有限公司 | The manufacture method of folding type printed circuit board (PCB) |
| WO2014207822A1 (en) * | 2013-06-25 | 2014-12-31 | 株式会社メイコー | Printed wiring board |
| JP5684958B1 (en) * | 2014-01-14 | 2015-03-18 | 株式会社メイコー | Printed wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0493939A1 (en) * | 1990-12-31 | 1992-07-08 | Compaq Computer Corporation | Flexible printed circuits |
| GB2279180A (en) * | 1993-06-17 | 1994-12-21 | Nec Corp | Printed wiring board structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0693534B2 (en) * | 1990-02-26 | 1994-11-16 | 日本アビオニクス株式会社 | Flexible rigid printed wiring board |
| JP2503580Y2 (en) * | 1990-05-22 | 1996-07-03 | 凸版印刷株式会社 | Antenna support |
| JPH07109942B2 (en) * | 1992-02-28 | 1995-11-22 | 日本アビオニクス株式会社 | Flexible rigid printed wiring board |
| JP4131964B2 (en) * | 2004-12-10 | 2008-08-13 | 株式会社東芝 | Information terminal equipment |
-
1994
- 1994-10-21 JP JP28292394A patent/JPH08125342A/en active Pending
-
1995
- 1995-10-17 GB GB9521224A patent/GB2294363A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0493939A1 (en) * | 1990-12-31 | 1992-07-08 | Compaq Computer Corporation | Flexible printed circuits |
| GB2279180A (en) * | 1993-06-17 | 1994-12-21 | Nec Corp | Printed wiring board structure |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2127125A1 (en) * | 1997-02-05 | 1999-04-01 | Mecanismos Aux Ind | Improvements introduced in printed circuit manufacturing |
| EP0971568A2 (en) * | 1998-07-02 | 2000-01-12 | Robert Bosch Gmbh | Electronic component |
| EP0971568A3 (en) * | 1998-07-02 | 2002-01-02 | Robert Bosch Gmbh | Electronic component |
| US6288343B1 (en) * | 1998-10-08 | 2001-09-11 | Samsung Electronics Co., Ltd. | Printed circuit board |
| EP1224847A1 (en) * | 1999-10-01 | 2002-07-24 | Motorola Inc. | Flexible circuit board and method for making a flexible circuit board |
| EP1224847A4 (en) * | 1999-10-01 | 2004-12-08 | Motorola Inc | Flexible circuit board and method for making a flexible circuit board |
| WO2004084595A1 (en) * | 2003-03-19 | 2004-09-30 | Hirschmann Electronics Gmbh & Co. Kg | Domed circuit board of an antenna amplifier for a vehicle antenna device |
| US7655869B2 (en) | 2003-04-18 | 2010-02-02 | Ibiden Co., Ltd. | Flex-rigid wiring board |
| US7378596B2 (en) | 2003-04-18 | 2008-05-27 | Ibiden Co., Ltd. | Rigid-flex wiring board |
| EP1768470A1 (en) * | 2004-06-10 | 2007-03-28 | Ibiden Co., Ltd. | Flex-rigid wiring board and manufacturing method thereof |
| EP1768470A4 (en) * | 2004-06-10 | 2010-03-03 | Ibiden Co Ltd | Flex-rigid wiring board and manufacturing method thereof |
| US7423219B2 (en) | 2004-06-11 | 2008-09-09 | Ibiden Co., Ltd. | Flex-rigid wiring board |
| US9674948B2 (en) | 2009-01-05 | 2017-06-06 | Ge Embedded Electronics Oy | Rigid-flex electronic module |
| US9425158B2 (en) | 2009-01-05 | 2016-08-23 | Ge Embedded Electronics Oy | Rigid-flex module and manufacturing method |
| CN101770959A (en) * | 2009-01-05 | 2010-07-07 | 伊姆贝拉电子有限公司 | Rigid-flex module and manufacturing method |
| US9820375B2 (en) | 2009-01-05 | 2017-11-14 | Ge Embedded Electronics Oy | Rigid-flex module and manufacturing method |
| WO2019055436A1 (en) * | 2017-09-12 | 2019-03-21 | Knowles Cazenovia, Inc. | Vertical switched filter bank |
| WO2019055438A1 (en) * | 2017-09-12 | 2019-03-21 | Knowles Cazenovia, Inc. | Vertical switched filter bank |
| US10770776B2 (en) | 2017-09-12 | 2020-09-08 | Knowles Cazenovia, Inc. | Vertical switched filter bank |
| US11355829B2 (en) | 2017-09-12 | 2022-06-07 | Knowles Cazenovia, Inc. | Vertical switched filter bank |
| US11437696B2 (en) | 2017-09-12 | 2022-09-06 | Knowles Cazenovia, Inc. | RF devices and methods thereof involving a vertical switched filter bank |
| CN109600912A (en) * | 2018-12-13 | 2019-04-09 | 中科芯集成电路股份有限公司 | Flexible rigid PCB circuit board of one kind and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08125342A (en) | 1996-05-17 |
| GB9521224D0 (en) | 1995-12-20 |
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