GB823269A - Improved electric circuit wiring - Google Patents

Improved electric circuit wiring

Info

Publication number
GB823269A
GB823269A GB3209556A GB3209556A GB823269A GB 823269 A GB823269 A GB 823269A GB 3209556 A GB3209556 A GB 3209556A GB 3209556 A GB3209556 A GB 3209556A GB 823269 A GB823269 A GB 823269A
Authority
GB
United Kingdom
Prior art keywords
foil
lines
board
conducting
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3209556A
Inventor
John Melvin Bedford
Stanley Canning Morgan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parmeko Ltd
Original Assignee
Parmeko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parmeko Ltd filed Critical Parmeko Ltd
Priority to GB3209556A priority Critical patent/GB823269A/en
Publication of GB823269A publication Critical patent/GB823269A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

823,269. Printed circuits. PARMEKO Ltd. Oct. 22, 1957 [Oct. 22, 1956], No. 32095/56. Class 37. Preformed wiring is produced by applying to an insulating board or sheet a conducting foil having regularly spaced interstices all of identical size and shape and arranged in regular horizontal and vertical rows, provided lines of conducting foil intersecting one another at regular intervals, and thereafter punching the insulating sheet or board and the foil simultaneously to individually gap predetermined ones of the intersecting lines and thereby interrupt the continuity of these lines and provide the desired circuit wiring. The conducting film may first be applied to a flexible sheet of insulating material before mounting on a rigid insulating board such as thin synthetic resin-bonded laminated paper. As shown, a recticular foil a is stamped out of copper and is attached to an insulating board e. The horizontal and vertical conducting lines so formed are interrupted where required by holes f, punched through the foil a and the insulating board e preferably by a battery of small punches. Smaller holes g and slots h are also provided for the connection and mounting of components on either side of the board. The layout and circuit of a threestage transistor audio frequency amplifier is also shown in the Specification. Specification 804,189 is referred to.
GB3209556A 1956-10-22 1956-10-22 Improved electric circuit wiring Expired GB823269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3209556A GB823269A (en) 1956-10-22 1956-10-22 Improved electric circuit wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3209556A GB823269A (en) 1956-10-22 1956-10-22 Improved electric circuit wiring

Publications (1)

Publication Number Publication Date
GB823269A true GB823269A (en) 1959-11-11

Family

ID=10333153

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3209556A Expired GB823269A (en) 1956-10-22 1956-10-22 Improved electric circuit wiring

Country Status (1)

Country Link
GB (1) GB823269A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525065A1 (en) * 1982-04-08 1983-10-14 Carpano & Pons Matrix interconnection system for joining circuit nodes - uses grid of conducting strips into which discontinuous can be introduced to form specific conduction paths
US5082876A (en) * 1988-04-08 1992-01-21 Borden, Inc. Compositions for foundry molding processes utilizing reclaimed sand
US5234973A (en) * 1988-04-08 1993-08-10 Acme Resin Corporation Compositions for foundry molding processes utilizing reclaimed sand
JP6277342B1 (en) * 2016-11-04 2018-02-07 達也 宮崎 Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525065A1 (en) * 1982-04-08 1983-10-14 Carpano & Pons Matrix interconnection system for joining circuit nodes - uses grid of conducting strips into which discontinuous can be introduced to form specific conduction paths
US5082876A (en) * 1988-04-08 1992-01-21 Borden, Inc. Compositions for foundry molding processes utilizing reclaimed sand
US5234973A (en) * 1988-04-08 1993-08-10 Acme Resin Corporation Compositions for foundry molding processes utilizing reclaimed sand
JP6277342B1 (en) * 2016-11-04 2018-02-07 達也 宮崎 Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same

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