JP2013054979A - Organic el display device, method for manufacturing organic el display device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL display device capable of achieving reduced power consumption with a simplified manufacturing process.SOLUTION: The organic EL display device includes: a first electrode provided on a substrate; an auxiliary electrode provided to be electrically insulated from the first electrode; an inter-pixel insulation film having a first opening facing the first electrode and a second opening facing at least a part of the auxiliary electrode, respectively; an organic layer formed over the whole area of the inter-pixel insulation film and including a luminous layer; and a second electrode provided on the organic layer. The second opening of the inter-pixel insulation film has a normal taper part tilted at an obtuse angle relative to a substrate surface and a reverse taper part tilted at an acute angle relative to the substrate surface. An electrical connection between the second electrode and the auxiliary electrode is secured in an area facing the reverse taper part within the second opening, without undergoing a separate coating step using a vapor deposition mask and a coating method or a laser irradiation step.

Description

  The present disclosure relates to an organic EL display device that displays an image using an electroluminescence (EL) phenomenon of an organic material.

  In recent years, display has been increased in size, and low power consumption has been demanded. For example, an active matrix driving type organic EL display device has the same requirement, and in order to reduce power consumption, it is important to prevent a voltage drop caused by the upper electrode (cathode electrode). As a technique for preventing such a voltage drop, for example, various techniques using so-called auxiliary wiring (auxiliary electrode) have been proposed (for example, Patent Documents 1 to 4). In these methods, in the element structure in which a lower electrode (anode electrode), an organic layer (including a light emitting layer) and an upper electrode are provided in this order on a driving substrate, the auxiliary electrode is electrically insulated from the lower electrode. On the other hand, the upper electrode is disposed on the driving substrate in an electrically connected state. In such an element structure, since the auxiliary electrode is often formed on the drive substrate side, the auxiliary electrode needs to be exposed from the organic layer and brought into contact with the upper electrode.

  For example, in Patent Document 1, an organic layer is formed only in a selective region on the lower electrode so that the organic layer does not adhere to the surface of the auxiliary electrode, and then the upper electrode is formed over the entire surface of the substrate. The electrode is in contact with the upper electrode.

  Further, in a structure having an insulating film (inter-pixel insulating film) provided on the lower electrode and partitioning the light emitting region, a through-hole leading to the auxiliary electrode is provided in the inter-pixel insulating film, and the auxiliary electrode is formed using the through-hole. There is also a technique (Patent Document 2) for connecting the upper electrode and the upper electrode. Alternatively, the inter-pixel insulating film has an opening for defining a light emitting region facing the lower electrode, and an organic layer is selectively provided only in the opening portion, and the auxiliary electrode is formed on the inter-pixel insulating film (opening). There is also a technique provided on the wall portion other than (Patent Document 3).

  Furthermore, after the organic layer is formed over the entire surface of the driving substrate on which the lower electrode and the auxiliary electrode are disposed, only the portion facing the auxiliary electrode is selectively removed by laser irradiation to expose the surface of the auxiliary electrode ( There is also Patent Document 4).

JP 2005-011810 A JP 2005-327664 A JP 2006-059796 A JP 2007-052966 A

  However, in any of the methods disclosed in Patent Documents 1 to 3, when forming the organic layer, it is necessary to coat the organic layer for each region by a mask vapor deposition method or a coating method. In the mask vapor deposition method, the alignment accuracy with the mask and the yield are likely to deteriorate, and in the coating method, it is difficult to cope with high definition. On the other hand, in the method of Patent Document 4, since the laser irradiation process is performed, the manufacturing cost is increased. For this reason, it is desired that the auxiliary electrode is formed by a simple manufacturing process without going through such a separate coating process or laser irradiation process, thereby realizing low power consumption.

  The present disclosure has been made in view of such a problem, and an object of the present disclosure is to provide an organic EL display device, a method for manufacturing the organic EL display device, and an electronic apparatus that can realize low power consumption with a simple manufacturing process. It is to provide.

  An organic EL display device according to the present disclosure includes a first electrode provided on a substrate, an auxiliary electrode provided to be electrically insulated from the first electrode, a first opening facing the first electrode, and an auxiliary electrode. An inter-pixel insulating film having a second opening facing at least a part of the organic EL element; an organic layer including a light-emitting layer formed over the entire area on the inter-pixel insulating film; and a second electrode provided on the organic layer; It has. The second opening of the inter-pixel insulating film has a forward taper portion inclined at an obtuse angle with respect to the substrate surface, and a reverse taper portion inclined at an acute angle with respect to the substrate surface, and the reverse taper of the second opening. The second electrode is electrically connected to the auxiliary electrode in a region facing the part.

  In the organic EL display device according to the present disclosure, the inter-pixel insulating film has a first opening facing the first electrode, a second opening facing the auxiliary electrode, and the light emitting layer is formed over the entire area on the inter-pixel insulating film. An organic layer and a second electrode are provided. Since the second opening of the inter-pixel insulating film has a predetermined forward taper portion and a reverse taper portion, the second opening can be performed without performing a separate coating process using a deposition mask or a coating method or a laser irradiation process. In the region facing the reverse tapered portion of the opening, electrical connection between the second electrode and the auxiliary electrode is ensured.

  The method for manufacturing an organic EL display device according to the present disclosure includes a step of forming a first electrode on a substrate, a step of forming an auxiliary electrode electrically insulated from the first electrode, and a first facing the first electrode. Forming an interpixel insulating film having a second opening facing at least a part of the opening and the auxiliary electrode, forming an organic layer including a light emitting layer over the entire area on the interpixel insulating film, and organic Forming a second electrode on the layer. In the step of forming the inter-pixel insulating film, a forward tapered portion that is inclined with an obtuse angle with respect to the substrate surface and a reverse tapered portion that is inclined with an acute angle with respect to the substrate surface are formed in the second opening. In the step of forming the electrode, the second electrode is electrically connected to the auxiliary electrode in a region facing the reverse tapered portion of the second opening.

  In the method for manufacturing an organic EL display device according to the present disclosure, a first opening facing the first electrode and a second opening facing the auxiliary electrode are formed in the inter-pixel insulating film, and a predetermined forward taper is formed in the second opening. And a reverse taper portion are formed. By forming the organic layer including the light emitting layer and the second electrode over the entire region on the inter-pixel insulating film, without performing a separate coating process using a deposition mask or a coating method, or a laser irradiation process, In the region facing the reverse tapered portion of the second opening, electrical connection between the second electrode and the auxiliary electrode is ensured.

  An electronic apparatus according to the present disclosure includes the organic EL display device according to the present disclosure.

  In the present disclosure and the following embodiments, the “forward taper portion” and the “reverse taper portion” are surfaces that are non-parallel to the substrate surface (the front surface or the back surface of the substrate) and are not orthogonal (inclined surfaces). ). Further, the angle between the “forward taper portion” and the “reverse taper portion” with the substrate surface is an angle between the substrate surface and each inclined surface in the second opening. That is, in the “forward taper portion”, the angle formed with the substrate surface in the second opening is a so-called obtuse angle that is greater than 90 ° and less than 180 °, and in the “reverse taper portion”, the angle with the substrate surface is within the second opening. The formed angle is a so-called acute angle greater than 0 ° and less than 90 °.

  According to the organic EL display device, the organic EL display device manufacturing method, and the electronic apparatus of the present disclosure, the inter-pixel insulating film is provided with the first opening facing the first electrode and the second opening facing the auxiliary electrode, The second opening is provided with a predetermined forward tapered portion and a reverse tapered portion. As a result, the organic layer including the light emitting layer is formed in a desired region without undergoing a separate coating process using a deposition mask or a coating method, or a laser irradiation process, and the electrical connection between the second electrode and the auxiliary electrode. Connection can be secured. Thereby, a voltage drop caused by the second electrode can be suppressed. Therefore, the auxiliary electrode can be formed by a simple manufacturing process, and low power consumption can be realized.

It is a figure showing the cross-sectional structure of the organic electroluminescence display which concerns on embodiment of this indication. FIG. 2 is a schematic diagram illustrating a planar layout example of a first electrode and an auxiliary electrode illustrated in FIG. 1. FIG. 2 is an enlarged view in the vicinity of a first electrode and an auxiliary electrode shown in FIG. 1. It is sectional drawing for demonstrating the manufacturing method of the organic electroluminescence display shown in FIG. It is sectional drawing corresponding to the partial structure of FIG. FIG. 5 is a cross-sectional view illustrating a process following FIG. 4. FIG. 7 is a cross-sectional view illustrating a process following FIG. 6. FIG. 8 is a cross-sectional diagram illustrating a process following the process in FIG. 7. FIG. 9 is a cross-sectional diagram illustrating a process following the process in FIG. 8. 10 is a cross-sectional view corresponding to a partial region of an organic EL display device according to Comparative Example 1. FIG. 10 is a cross-sectional view corresponding to a partial region of an organic EL display device according to Comparative Example 2. FIG. It is a characteristic view showing the current-voltage characteristic when the film thickness of a 2nd electrode is changed. It is a figure showing the cross-sectional structure of the organic electroluminescence display which concerns on the modification 1. FIG. 10 is a cross-sectional view of a main part for explaining a manufacturing method according to Modification 2. FIG. It is principal part sectional drawing showing the process of following FIG. FIG. 16 is a main part cross-sectional view illustrating a process following FIG. 15. FIG. 10 is a cross-sectional view of a main part for explaining a manufacturing method according to Modification 3. FIG. 18 is an essential part cross-sectional view illustrating a process following the process in FIG. 17. It is a figure showing the whole structure containing the peripheral circuit of the display apparatus which concerns on embodiment etc. FIG. 20 is a diagram illustrating a circuit configuration of the pixel illustrated in FIG. 19. FIG. 20 is a plan view illustrating a schematic configuration of a module including the display device illustrated in FIG. 19. It is a perspective view showing the external appearance of the application example 1 of display apparatuses, such as embodiment. (A) is a perspective view showing the external appearance seen from the front side of the application example 2, (B) is a perspective view showing the external appearance seen from the back side. 12 is a perspective view illustrating an appearance of application example 3. FIG. 14 is a perspective view illustrating an appearance of application example 4. FIG. (A) is a front view of the application example 5 in an open state, (B) is a side view thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order.

1. Embodiment (Example in which an insulating film opening having a reverse taper is provided facing the auxiliary electrode on the driving substrate)
2. Modification 1 (example in which an auxiliary electrode is provided in the same layer as the TFT electrode)
3. Modification 2 (Another example of reverse taper forming method)
4). Modification 3 (Another example of reverse taper forming method)
5. Application example (application example to electronic equipment)

<Embodiment>
[Constitution]
FIG. 1 illustrates a cross-sectional configuration of an organic EL display device (organic EL display device 1) according to the first embodiment of the present disclosure. The organic EL display device 1 emits light by, for example, a so-called top emission method (upper surface light emission method). Are arranged in a matrix, for example. Each organic EL element 1A constitutes, for example, one of three sub-pixels of red (R), green (G), and blue (B), and these three sub-pixels function as one pixel. It has become.

(Drive board 10)
The drive substrate 10 is obtained by disposing a drive circuit (a pixel circuit 40 described later) including the TFT 11 on a substrate 10a made of, for example, quartz, glass, metal foil, silicon, or plastic.

  The TFT 11 corresponds to, for example, a sampling transistor 3A or a writing transistor 3B in the pixel circuit 40 described later, and the configuration thereof may be, for example, an inverted staggered structure (so-called bottom gate type) or a staggered structure (top gate type). There may be. Here, as an example, a bottom-gate thin film transistor is given as an example. For example, the TFT 11 includes a gate electrode 110 in a selective region on the substrate 10a, and a gate insulating film 111 is provided over the entire surface of the substrate 10a so as to cover the gate electrode 110 and the substrate 10a. A semiconductor layer 112 is formed on the gate insulating film 111. The semiconductor layer 112 functions as an active layer for forming a channel, and is made of, for example, amorphous silicon, polycrystalline silicon, an oxide semiconductor, or the like. An interlayer insulating film 113 having a through hole (contact hole H) is formed on the semiconductor layer 112. The interlayer insulating film 113 functions as a source or drain so as to bury the contact hole H. Source / drain electrodes 114 are provided. The TFT 11 is covered with a planarizing film 115 on the driving substrate 10.

The planarizing film 115 is made of an organic insulating film such as polyimide, acrylic resin, or novolac resin. Alternatively, it may be composed of an inorganic insulating film, for example, a single layer film or a laminated film containing at least one of silicon oxide (SiO _x ), silicon nitride (SiN _x ), silicon oxynitride (SiON), and the like. The planarization film 115 has a contact hole H2, and the TFT 11 (source / drain electrode 114) and a first electrode 12 described later are electrically connected through the contact hole H2.

(Organic EL element 1A)
The organic EL element 1A emits light by, for example, a top emission method, and includes, for example, a first electrode 12, an organic layer 15, and a second electrode 16 on the planarizing film 115 of the driving substrate 10.

  The first electrode 12 is provided for each organic EL element 1A, for example, and functions as an anode, for example. Here, the first electrode 12 is composed of a metal film having light reflectivity or a laminated film of such a metal film and a transparent conductive film (in the case of a top emission method). For example, the first electrode 12 is made of an alloy of aluminum (Al) and neodymium (Nd) (AlNd alloy), a laminated film of indium tin oxide (ITO) and silver (Ag), or indium zinc oxide (IZO) and silver. And a laminated film. However, it is desirable that the outermost surface of the first electrode 12 is provided with a material having a predetermined etching resistance in a manufacturing process described later, for example, an AlNd alloy. The first electrode 12 is provided to be electrically insulated from the second electrode 16 and an auxiliary electrode 13 described later.

  The organic layer 15 includes, for example, an organic electroluminescent layer that emits white light (hereinafter referred to as a white light emitting layer), and recombines electrons and holes by applying an electric field through the first electrode 12 and the second electrode 16. To generate white light.

  Specifically, the white light emitting layer has, for example, a structure (tandem structure) in which a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light are stacked. The red light emitting layer includes, for example, at least one of a red light emitting material, a hole transporting material, and an electron transporting material, such as 4,4-bis (2,2-diphenylbinine) biphenyl (DPVBi), It is composed of a mixture of 6-bis [(4′-methoxydiphenylamino) styryl] -1,5-dicyanonaphthalene (BSN). The green light emitting layer includes, for example, at least one of a green light emitting material, a hole transporting material, and an electron transporting material, and is composed of, for example, a mixture of ADN or DPVBi and coumarin 6. The blue light emitting layer includes, for example, at least one of a blue light emitting material, a hole transporting material, and an electron transporting material. For example, 4,4′-bis [2- {4- (N, N− Diphenylamino) phenyl} vinyl] biphenyl (DPAVBi) is mixed.

  The organic layer 15 may include, for example, a hole injection layer, a hole transport layer, an electron transport layer, and the like in addition to the light emitting layer as described above. Specifically, when the first electrode 12 functions as an anode, a structure in which a hole injection layer, a hole transport layer, a white light emitting layer, and an electron transport layer are stacked in this order from the first electrode 12 side. Also good. In addition, the organic layer 15 having such a stacked structure may be formed in common for all the organic EL elements 1A on the drive substrate 10, but a part of the layers is provided for each organic EL element 1A. Other layers may be provided in common for all organic EL elements 1A. Further, an electron injection layer made of, for example, LiF may be further provided between the organic layer 15 and the second electrode 16.

  In this example, the white light emitting layer is a laminate of a red light emitting layer, a green light emitting layer, and a blue light emitting layer. However, the configuration of the white light emitting layer is not limited to this, and white light can be generated by color mixing. Any structure can be used. For example, a structure in which a blue light emitting layer and a yellow light emitting layer are stacked, or a structure in which a blue light emitting layer and an orange light emitting layer are stacked may be employed.

  In the present embodiment, the organic layer 15 is formed over the entire area of the drive substrate 10, and the second electrode is formed over the entire area of the organic layer 15.

  The second electrode 16 is provided in common to all the organic EL elements 1A on the drive substrate 10, for example, and functions as a cathode, for example. The second electrode 16 is made of, for example, indium tin oxide, indium zinc oxide, zinc oxide (ZnO), or a co-deposited film (MgAg co-deposited film) of magnesium (Mg) and silver. The second electrode 16 is electrically connected to the auxiliary electrode 13 in an opening S2 of the inter-pixel insulating film 14 described later.

A protective layer 17 is provided on the second electrode 16. The protective layer 17 has a thickness of 2 to 5 μm, for example, and may be made of either an insulating material or a conductive material. Examples of the insulating material include inorganic amorphous insulating materials such as amorphous silicon (a-Si), amorphous silicon carbide (a-SiC), amorphous silicon nitride (a-Si _1-x N _x ), and amorphous carbon (a -C) and the like are preferable. Such an inorganic amorphous insulating material does not constitute grains, and thus has low water permeability and becomes a good protective film. On the protective layer 17, the sealing substrate 20 is bonded together by an adhesive layer (not shown).

  The sealing substrate 20 seals each organic EL element 1 </ b> A together with the protective layer 17, and is made of a material such as glass that is transparent to each color light of R, G, and B, for example. The sealing substrate 20 may be provided with a color filter (not shown). The color filter has, for example, a red, green or blue filter, and is made of, for example, a resin mixed with a pigment or a dye. By providing such a color filter, light (here, white light) generated in each organic EL element 1A can be converted into R, G, B color light and extracted.

  Further, a black matrix (light shielding film) (not shown) may be provided, which can absorb external light reflected between the organic EL elements 1A (between sub-pixels), wirings, etc., and improve contrast. it can. The light-shielding film is constituted by, for example, a resin film mixed with a black colorant, or a thin film filter using thin film interference.

(Auxiliary electrode 13)
In the organic EL display device 1 that displays an image using the organic EL element 1A as described above, since the second electrode 16 is an electrode common to each organic EL element 1A, it extends over a wide region on the drive substrate 10. It is formed. For this reason, although a voltage drop occurs due to the shape of the second electrode 16, the organic EL display device 1 includes the auxiliary electrode 13 in order to suppress such a voltage drop. The auxiliary electrode 13 is disposed on the drive substrate 10 side while being electrically insulated from the first electrode 12 in the organic EL element 1 </ b> A and electrically connected to the second electrode 16. In the present embodiment, the auxiliary electrode 13 is provided in the same layer as the first electrode 12 on the drive substrate 10 (specifically, on the planarization film 115).

  FIG. 2 schematically shows a planar layout (XY planar layout parallel to the substrate surface) of the auxiliary electrode 13 and the first electrode 12. The cross-sectional structure in FIG. 1 corresponds to the laminated structure having a cross section taken along the line II in FIG. Thus, on the drive substrate 10, the some 1st electrode 12 is arrange | positioned, for example in matrix form. The auxiliary electrode 13 is provided, for example, so as to surround each first electrode 12 while being separated from each other, and the entire shape is, for example, a lattice shape. A part of the auxiliary electrode 13, for example, an intersecting portion in a lattice shape, is a contact portion (contact portion 13 </ b> A) with the second electrode 16.

  The contact portion 13A is formed so as to face an opening S2 of the inter-pixel insulating film 14 to be described later (specifically, face the reverse tapered portion 14B of the opening S2), as shown in FIG. This corresponds to a plurality of selective regions scattered in the auxiliary electrode 13. For example, the contact portion 13A may be provided only at a selective intersection among all the intersections in the lattice shape, or may be provided at all the intersections. Moreover, you may arrange | position in areas other than an intersection.

  However, the layout of the auxiliary electrode 13 is not limited to this, and may be provided so as to be electrically insulated from the first electrode 12 in the display region. Moreover, shapes other than a lattice shape may be sufficient, for example, the stripe shape extended only along one direction of a X direction or a Y direction may be sufficient. Further, the contact portions 13A may be formed in a scattered manner as described above, or may be formed in a stripe shape extending along one direction of the X direction or the Y direction, for example. Alternatively, the contact portion 13 </ b> A may be formed over the entire area of the auxiliary electrode 13.

  Such an auxiliary electrode 13 is, for example, a single layer film containing one or more of titanium (Ti), aluminum (Al), an alloy of aluminum and neodymium (AlNd alloy), indium tin oxide, and indium zinc oxide. It is composed of a laminated film. However, it is desirable that the outermost surface of the auxiliary electrode 13 is provided with a material having a predetermined etching resistance in a manufacturing process described later, such as titanium or an AlNd alloy. In order to ensure ohmic contact with the second electrode 16, it is more desirable that titanium is provided on the outermost surface.

(Inter-pixel insulating film 14)
On the driving substrate 10 on which the first electrode 12 and the auxiliary electrode 13 are disposed, an inter-pixel insulating film 14 is formed over the entire surface of the substrate. The inter-pixel insulating film 14 has a function of electrically separating each organic EL element 1A (dividing the pixel opening), and is composed of an organic insulating film such as polyimide, acrylic resin, or novolac resin, for example. It is desirable to have photosensitivity. In the present embodiment, the inter-pixel insulating film 14 has a plurality of openings S1 and S2.

  The opening S1 (first opening) is provided for each organic EL element 1A and is formed to face the first electrode 12. The organic EL elements 1A are electrically separated by the openings S1.

  The opening S2 (second opening) is provided to face at least a part of the auxiliary electrode 13. The opening S2 has a forward tapered portion 14A and a reverse tapered portion 14B. FIG. 3 shows an enlarged view near the opening S2. The forward taper portion 14A and the reverse taper portion 14B correspond to a part of the inner wall (inner side surface) of the opening S2, and have an inclined surface that is not parallel to and orthogonal to the substrate surface. Specifically, the forward taper portion 14A is an obtuse angle with the substrate surface having an angle α greater than 90 ° and less than 180 °, and the reverse taper portion 14B has an angle β with the substrate surface greater than 0 ° and 90 °. An acute angle of less than °.

  In the present embodiment, as described above, the organic layer 15 (or part of the organic layer 15) and the second electrode 16 are stacked over the entire surface of the substrate, but in the vicinity of the upper end e1 of the reverse tapered portion 14B in the opening S2. , The organic layer 15 is interrupted (divided), and the surface of the auxiliary electrode 13 is exposed. The second electrode 16 covers such a divided section of the organic layer 15 and extends to a region facing the reverse taper portion 14B in the opening S2 (a gap between the reverse taper portion 14B and the substrate surface). And is in contact with the auxiliary electrode 13. Part or all of the region of the auxiliary electrode 13 facing the reverse tapered portion 14B (the portion in contact with the second electrode 16) corresponds to the contact portion 13A.

  On the other hand, in the region of the opening S2 facing the forward tapered portion 14A, the organic layer 15 and the second electrode 16 are formed continuously (without being divided) following the shape of the forward tapered portion 14A. Further, the organic layer 15 and the second electrode 16 are continuously formed from the region facing the forward taper portion 14A to the region facing the opening S1, following the surface shape of the inter-pixel insulating film 14.

[Production method]
The organic EL display device 1 as described above can be manufactured, for example, as follows. That is, first, the drive substrate 10 is prepared. Specifically, after a driving circuit including the TFT 11 is formed on the substrate 10a made of the above-described material through a predetermined thin film process, the planarizing film 115 is formed on the entire surface of the substrate 10a by, for example, spin coating or slit coating. The film is formed by Subsequently, the formed planarizing film 115 is patterned into a predetermined shape by, for example, photolithography, and a contact hole H2 is formed in the planarizing film 115.

(First electrode, auxiliary electrode formation process)
Next, as shown in FIG. 4, the first electrode 12 and the auxiliary electrode 13 made of the above-described material are formed on the driving substrate 10 by the same or different patterning process. For example, first, an AlNd alloy is formed as the first electrode 12 over the entire surface of the substrate by, for example, a sputtering method, and then patterned by, for example, etching using a photolithography method. At this time, a part of the first electrode 12 is buried in the contact hole H2 of the planarization film 115, and the first electrode 12 and the TFT 11 are electrically connected. Thereafter, aluminum and titanium are deposited as an auxiliary electrode 13 over the entire surface of the substrate in this order by sputtering, and the formed laminated film (Ti / Al) is patterned by etching using photolithography.

  In contrast to the above order, the first electrode 12 may be formed after the auxiliary electrode 13 is formed. The order of forming the first electrode 12 and the auxiliary electrode 13 is appropriately set according to each electrode material. Moreover, when the laminated structure and material of the 1st electrode 12 and the auxiliary electrode 13 are the same, you may pattern these 1st electrode 12 and the auxiliary electrode 13 collectively in the same process.

  Next, the inter-pixel insulating film 14, the organic layer 15, and the second electrode are formed in this order on the drive substrate 10 on which the first electrode 12 and the auxiliary electrode 13 are formed as described above. 5 is an enlarged view of a part of the region D in the vicinity of the first electrode 12 and the auxiliary electrode 13 in FIG. In the following steps, a portion corresponding to the region D in the cross-sectional structure of the entire apparatus will be shown and described.

  First, as shown in FIG. 6, the reverse taper forming thin film 120 is formed on the auxiliary electrode 13 before the inter-pixel insulating film 14 is formed. At this time, in the present embodiment, a reverse taper forming thin film 120 made of a metal such as aluminum is formed over the entire surface of the substrate by sputtering, for example, and then patterned by wet etching using photolithography, for example. In this manner, the reverse taper forming thin film 120 having the forward tapers 120A1 and 120A2 on the side surfaces (having a trapezoidal cross-sectional shape) is selectively formed on the auxiliary electrode 13.

(Inter-pixel insulating film formation process)
Subsequently, the inter-pixel insulating film 14 is formed by using a photolithography method. Specifically, first, as shown in FIG. 7, the inter-pixel insulating film 14 made of the above-described material is formed over the entire surface of the substrate by, for example, spin coating or slit coating. At this time, a photosensitive resin material is used as the inter-pixel insulating film 14.

  Next, as shown in FIG. 8A, a selective region of the inter-pixel insulating film 14 is exposed using a predetermined photomask 121. At this time, a photomask 121 having an opening 121 a in a region facing the first electrode 12 and an opening 121 b in a region facing a part of the auxiliary electrode 16 is used. Of these openings 121a and 121b, the opening 121b specifically faces one of the forward tapers 120A1 and 120A2 (for example, the forward taper 120A1) in the reverse taper forming thin film 120 and the other (for example, the forward taper 120A2). ).

  Subsequently, the exposed inter-pixel insulating film 14 is developed. At this time, as the developer, for example, a TMAH (Tetra-methyl-ammonium-hydroxyde) aqueous solution is used. By using TMAH, the reverse taper forming thin film 120 made of metal (aluminum or the like) can be removed (lifted off) by wet etching simultaneously with the development of the inter-pixel insulating film 14. At this time, if an AlNd alloy is used for the first electrode 12, for example, the first electrode 12 can be left as an electrode because it is more resistant to TMAH than a case where the first electrode 12 is made of an aluminum single layer.

  Thereafter, the opening S1 is formed in a region facing the first electrode 12 in the inter-pixel insulating film 14, as shown in FIG. 8B, by washing with a rinse solution and further heating (post-baking). It is formed. On the other hand, an opening S2 having the forward tapered portion 14A and the reverse tapered portion 14B as described above is formed in a region facing the auxiliary electrode 13.

(Organic layer formation process)
Next, as shown in FIG. 9A, the organic layer 15 made of the above-described laminated structure and material is formed over the entire surface of the substrate. At this time, the organic layer 15 is formed by, for example, a vacuum evaporation method. For example, in the case of laminating light emitting layers of R, G, and B as white light emitting layers, the light emitting materials of each color are sequentially deposited, for example, over the entire surface of the substrate by a vacuum evaporation method.

  As a result, the organic layer 15 is formed over the entire area of the inter-pixel insulating film 14, but in this embodiment, the opening S2 of the inter-pixel insulating film 14 has the reverse tapered portion 14B. In the vicinity of the edge of the portion 14B (the upper end e1 in FIG. 3), the organic layer 15 is divided and formed. This is because the organic layer 15 is formed by an evaporation method having a low coverage, so that the organic material does not reach the region facing the reverse tapered portion 14B in the opening S2. Thereby, a part of the surface of the auxiliary electrode 13 is exposed from the organic layer 15 in the opening S2.

(Second electrode forming step)
Thereafter, as shown in FIG. 9B, the second electrode 16 made of the above-described material is formed by, for example, sputtering over the entire surface of the substrate. As a result, like the organic layer 15, the second electrode 16 is formed over the entire area of the inter-pixel insulating film 14. However, since the second electrode 16 is formed using a sputtering method with good coverage, it covers the divided section of the organic layer 15 and the electrode material is disposed between the reverse tapered portion 14B and the substrate surface. The air wraps around the gap and deposits, and contacts the exposed portion of the auxiliary electrode 13. In this way, electrical connection between the second electrode 16 and a part of the auxiliary electrode 13 (part or all of the region facing the reverse tapered portion 14B) is ensured. At this time, by forming the outermost surface of the auxiliary electrode 13 with titanium, it becomes easy to ensure ohmic contact with the second electrode 16.

  Next, although not shown, after covering the entire surface of the formed second electrode 16 and forming the protective layer 17 made of the above-described material, the drive substrate 10 and the sealing substrate are formed using the adhesive layer. 20 and pasted together. Thus, the organic EL display device 1 shown in FIG. 1 is completed.

[Action / Effect]
In the organic EL display device 1, when a driving current based on a video signal is supplied to each subpixel (organic EL element 1 </ b> A) through the first electrode 12 and the second electrode 16, each organic EL element 1 </ b> A has an organic layer. 15 (white light emitting layer) emits light by recombination of holes and electrons. Of the white light generated in this way, the light emitted toward the first electrode 12 (downward) is reflected by the first electrode 12 and the like and then exits from above the sealing substrate 20. On the other hand, the light emitted toward the second electrode 16 (upward) passes through the second electrode 16 as it is and then exits from above the sealing substrate 20. When exiting the sealing substrate 20, R, G, and B color lights are extracted as display light by passing through a color filter (not shown). In this way, full color video display by the top emission method is performed.

  Here, in the organic EL display device 1, as described above, a voltage drop may occur due to the shape of the second electrode 16. In order to suppress such a voltage drop, the auxiliary electrode 13 is provided. ing. Specifically, it is provided in the same layer as the first electrode 12 on the driving substrate 10 and in a state of being electrically insulated from the first electrode 12.

(Comparative example)
Such an auxiliary electrode 13 needs to be electrically connected to the second electrode 16, but improvement is desired for the following reason. 10A to 10C schematically show a part of the method for manufacturing the organic EL display device according to Comparative Example 1 (steps from the formation of the inter-pixel insulating film to the formation of the second electrode). In this comparative example 1, for example, as shown in FIG. 10A, when the inter-pixel insulating film 103 is formed, the opening 103A and the auxiliary electrode 102 are opposed to the first electrode 101 on the driving substrate 100. Opening 103B is provided respectively. Each of these openings 103A and 103B has a normal forward taper.

  Subsequently, as shown in FIG. 10B, an organic layer 104 including a light emitting layer only in a selective region corresponding to the opening 103A of the inter-pixel insulating film 103 is formed by an evaporation mask method or a coating method ( The surface of the auxiliary electrode 102 is exposed). Thereafter, as shown in FIG. 10C, the second electrode 105 is formed over the entire surface of the substrate, whereby the second electrode 105 and the auxiliary electrode 102 are brought into contact with each other to ensure electrical connection.

  11A to 11C schematically show a part of the method for manufacturing the organic EL display device according to Comparative Example 2 (steps from formation of the inter-pixel insulating film to formation of the second electrode). . In this comparative example 2, as shown in FIG. 11A, for example, after the organic layer 104 is formed over the entire area of the inter-pixel insulating film 103 similar to the comparative example 1, the region facing the auxiliary electrode 102 is formed. Only irradiate with laser light. Thereby, as shown in FIG. 11B, the organic layer 104 deposited on the auxiliary electrode 102 is selectively removed. Thereafter, as shown in FIG. 11C, the second electrode 105 is formed over the entire surface of the substrate, whereby the second electrode 105 and the auxiliary electrode 102 are brought into contact with each other to ensure electrical connection.

  Of the above Comparative Examples 1 and 2, in the method of Comparative Example 1, it is necessary to pattern the organic layer 104 by a vapor deposition method (mask vapor deposition method) using a separate mask or a coating method. At this time, the mask deposition method tends to deteriorate the alignment accuracy with the mask and the yield, and the coating method is difficult to cope with high definition. On the other hand, in the method of Comparative Example 2, since the laser irradiation process is performed to selectively remove the organic layer 15, the manufacturing cost is increased. For this reason, it is desired to form the auxiliary electrode by a simple manufacturing process without going through such a separate coating process or laser irradiation process.

  Therefore, in the present embodiment, the inter-pixel insulating film 14 is provided with the opening S1 that faces the first electrode 12, while the opening S2 that has the reverse tapered portion 14B is provided facing the auxiliary electrode 13. Thereby, even when the organic layer 15 is deposited on the entire surface, the surface of the auxiliary electrode 13 is exposed from the organic layer 15 in a region facing the reverse tapered portion 14B in the opening S2 of the inter-pixel insulating film 14. I can leave. By forming the second electrode 16 over the entire area of the organic layer 15 by sputtering, the second electrode 16 can be formed to wrap around the reverse taper portion 14B to the inside of the opening S2, and the exposed portion of the auxiliary electrode 13 can be formed. Is formed to extend to. Therefore, the second electrode 16 and the auxiliary electrode are partially supported in the opening S2 without the separate coating process using the vapor deposition mask and the coating method as in Comparative Example 1 or the laser irradiation process as in Comparative Example 2. Electrical connection with the electrode 13 is ensured.

  Here, in FIG. 12, the experimental result about the current-voltage characteristic (IV characteristic) at the time of changing the film thickness of the 2nd electrode 16 which consists of IZO in the above organic EL display devices 1 is shown. As a comparative example, an organic film was formed only on the light-emitting pixels using a separate mask (the auxiliary electrode portion was not covered with the organic film) (IZO film thickness: 40 nm), and similarly The IV characteristics were measured. From this result, it can be seen that as the film thickness of the second electrode 16 increases, better contact performance with the auxiliary electrode is obtained. For example, at IZO of 30 nm or more, the voltage drop is suppressed as in the comparative example.

  In addition, since the forward tapered portion 14A is provided in the opening S2 of the inter-pixel insulating film 14, the organic layer 15 and the second electrode 16 are formed in the shape of the forward tapered portion 14A in the region on the forward tapered portion 14A. Are formed continuously (without being divided). Further, the organic layer 15 and the second electrode 16 are continuously formed following the surface shape of the inter-pixel insulating film 14 from a region facing the forward tapered portion 14A to a region facing the opening S1. Thus, the potential can be supplied from the auxiliary electrode 13 to the portion of the second electrode 16 above the opening S1 (the electrode portion immediately above the light emitting region). Therefore, the voltage drop in the substrate surface can be suppressed more effectively.

  As described above, in this embodiment, the inter-pixel insulating film 14 is provided with the opening S1 that faces the first electrode 12 and the opening S2 that faces the auxiliary electrode 13, and the forward taper portion 14A and the reverse side are provided in the opening S2. A tapered portion 14B is formed. Thereby, even when the organic layer 15 is deposited on the entire surface, the surface of the auxiliary electrode 13 can be exposed from the organic layer 15 in a part of the opening S2 of the inter-pixel insulating film 14. Therefore, the second electrode 16 and the auxiliary electrode 13 can be electrically connected to each other in the opening S2 without performing a coating process using a vapor deposition mask or a coating method or a laser irradiation process.

  Subsequently, modified examples (modified examples 1 to 3) of the above-described embodiment will be described. In addition, the same code | symbol is attached | subjected to the same thing as the component in the said embodiment, and description is abbreviate | omitted suitably.

<Modification 1>
FIG. 13 illustrates a cross-sectional configuration of an organic EL display device (organic EL display device 2) according to Modification 1. Similar to the organic EL display device 1 of the above-described embodiment, the organic EL display device 2 emits light by, for example, a top emission method, and a plurality of organic EL elements 1A are arranged on the drive substrate 10 in a matrix, for example. It has been done. In addition, an auxiliary electrode 21 that is electrically insulated from the first electrode 12 of the organic EL element 1 </ b> A and electrically connected to the second electrode 16 is provided. The inter-pixel insulating film 14 has an opening S3 facing the auxiliary electrode 21, and a forward taper portion 14A and a reverse taper portion 14B are provided in the opening S3.

  However, in the present modification, unlike the above embodiment, the auxiliary electrode 21 is provided in a layer different from the first electrode 12 (lower layer than the first electrode 12). Specifically, the auxiliary electrode 21 is provided on the interlayer insulating film 113 in the drive substrate 10 (same layer as the source / drain electrode 114). A planarizing film 115 is formed on the auxiliary electrode 21, and an opening H <b> 3 is provided in the planarizing film 115 so as to face the auxiliary electrode 21. The inter-pixel insulating film 14 is formed so as to fill the opening H3 of the planarizing film 115.

  As in this modification, the auxiliary electrode 21 may be formed in a lower layer than the first electrode 12, for example, in the same layer as the source / drain electrode 114 of the TFT 11 in the driving substrate 10. Even in such a case, for example, in the step of forming the source / drain electrode 114, if the auxiliary electrode 21 is simultaneously formed by patterning and a region facing the auxiliary electrode 21 of the planarizing film 115 is opened, the above embodiment Similarly, the inter-pixel insulating film 14 having the openings S1 and S3 can be formed. By forming the organic layer 15 and the second electrode 16 on the inter-pixel insulating film 14, the second electrode 16 and the auxiliary electrode are formed in a region facing the reverse tapered portion 14B in the opening S3, as in the above embodiment. An electrical connection with the electrode 21 can be ensured. Therefore, an effect equivalent to that of the above embodiment can be obtained.

  The auxiliary electrode 21 may be formed in a different process from the source / drain electrode 114 by a laminated structure or an electrode material different from the source / drain electrode 114. The layer on which the auxiliary electrode 21 is provided is not limited to the same layer as the source / drain electrode 114, but may be another layer, for example, the same layer as the gate electrode 110.

<Modification 2>
14 to 16 illustrate a cross-sectional configuration of the inter-pixel insulating film forming method according to the second modification. As a method of forming an opening facing the auxiliary electrode in the inter-pixel insulating film 14 (reverse taper forming method), in addition to the method described in the above embodiment, a lift-off layer as in this modification is used. Is mentioned.

  That is, as shown in FIG. 14A, first, a thin film made of, for example, aluminum or the like is formed on the auxiliary electrode 13 as the lift-off layer 22, for example, by sputtering, and then a photoresist film 122 is formed on the aluminum film. It is applied and patterned by exposure and development. Thereafter, the aluminum film is patterned by etching using the photoresist film 122 as a mask, and the lift-off layer 22 is formed between the auxiliary electrode 13 and the photoresist film 122.

  Subsequently, as shown in FIG. 14B, the photoresist film 122 is ashed and then post-baked to form a taper (forward taper) on the side surface. The photoresist film thus formed (reverse taper forming thin film 122a) is used as a reverse taper forming thin film in the same manner as the reverse taper forming thin film 120 (metal) in the above embodiment. That is, in this modification, the photoresist film 122 used for the patterning of the lift-off layer 22 is left on the lift-off layer 22 without being removed, and this is used for reverse taper formation.

Next, the inter-pixel insulating film 14 is formed using a photolithography method. Specifically, first, as shown in FIG. 15A, the inter-pixel insulating film 14 is formed in the same manner as in the above embodiment.
Is formed over the entire surface of the substrate. After that, as shown in FIG. 15B, a selective region of the inter-pixel insulating film 14 is exposed using a photomask 121 similar to that in the above embodiment mode. Subsequently, the inter-pixel insulating film 14 is developed in the same manner as in the above embodiment. On this occasion,
As the developer, for example, by using a TMAH aqueous solution, the lift-off layer (aluminum or the like) under the reverse taper forming thin film 122a can be dissolved by wet etching simultaneously with the development of the inter-pixel insulating film 14. Thereby, the reverse taper forming thin film 122a made of a photoresist can be removed (lifted off). After this,
By washing with a rinsing solution and further heating (post-baking), the inter-pixel insulating film 14 having the openings S1 and S2 similar to those in the above embodiment can be formed as shown in FIG.

<Modification 3>
17 and 18 show a cross-sectional configuration of the method for forming an inter-pixel insulating film according to the third modification. In the second modification, the reverse taper forming method is exemplified by using a lift-off layer made of a metal such as aluminum, but when the following lift-off layer is used,
Further, the process can be simplified.

That is, first, as shown in FIG. 17A, the auxiliary electrode 13 is formed on the drive substrate 10 in the same manner as in the above embodiment. Thereafter, the first electrode 12 is formed in the same manner as in the above embodiment. At this time, a thin film pattern (lift-off layer 12A) is also formed on the auxiliary electrode 13 at the same time. That is, after forming a metal film as the first electrode 12 over the entire surface of the substrate, patterning is performed by applying, exposing, and developing a photoresist, and the photoresist film 123 is formed.
, 124 are formed. Thereafter, as shown in FIG.
, 124 as a mask, the first electrode 12 and the lift-off layer 1 are etched.
2A are collectively formed.

Subsequently, as shown in FIG. 17C, the photoresist films 123 and 124 are ashed and then post-baked to form a taper (forward taper) on the side surface. The photoresist film thus formed (reverse taper forming thin film 124a) is used as a reverse taper forming thin film in the same manner as the reverse taper forming thin film 120 (metal) in the above embodiment. That is, in this modification, the photoresist film 124 used for the patterning of the lift-off layer 12A is left on the lift-off layer 12A without being removed, and this is used for forming an inverse taper. Although the photoresist film 123a remains on the first electrode 12, it may be removed in a later step.

Next, the inter-pixel insulating film 14 is formed using a photolithography method. Specifically, first, as in the above embodiment, the inter-pixel insulating film 14 is formed over the entire surface of the substrate, and then, as shown in FIG. The region is exposed using a photomask 121 similar to that in the above embodiment mode. Subsequently, the inter-pixel insulating film 14 is developed in the same manner as in the above embodiment. At this time, as the developing solution, for example, a TMAH aqueous solution is used, so that the reverse taper forming thin film 124 is simultaneously formed with the development of the inter-pixel insulating film 14.
It can be dissolved by galvanic corrosion between the lift-off layer 12A (AlNd) in the lower layer of a and Ti formed on the outermost surface of the auxiliary electrode 13. Thereby, the reverse taper forming thin film 124a made of a photoresist can be removed (lifted off). Subsequently, the photoresist (particularly the photoresist film 123a) remaining on the driving substrate 10 is removed by ashing. Thereafter, the substrate is washed with a rinsing solution and further heated (post-baked) to form an inter-pixel insulating film 14 having openings S1 and S2 similar to those in the above-described embodiment as shown in FIG. it can.

[Overall configuration of organic EL display device, pixel circuit configuration]
Next, the overall configuration and pixel circuit configuration of the organic EL display device according to the above-described embodiment and the like will be described. FIG. 19 shows an overall configuration including peripheral circuits of a display device used as an organic EL display. Thus, for example, on the drive substrate 10, the organic EL
A display region 30 in which a plurality of pixels PXLC (subpixels) including elements are arranged in a matrix is formed, and a horizontal selector (HSEL) 31 serving as a signal line driver circuit and a scanning line are formed around the display region 30. A write scanner (WSCN) 32 as a drive circuit;
A power supply scanner (DSCN) 33 as a power supply line driving circuit is provided.

In the display area 30, a plurality (n integers) of signal lines DTL1 to DTLn are arranged in the column direction, and a plurality (m integers) of the scanning lines WSL1 to WSLm and the power supply line D are arranged in the row direction.
SL1 to DSLm are respectively arranged. Each signal line DTL and each scanning line WSL
Each pixel PXLC (any one of pixels corresponding to R, G, and B) is provided at the intersection with. Each signal line DTL is connected to a horizontal selector 31, and a video signal is supplied from the horizontal selector 31 to each signal line DTL. Each scanning line WSL is connected to the write scanner 32, and a scanning signal (selection pulse) is supplied from the write scanner 32 to each scanning line WSL. Each power supply line DSL is connected to the power supply scanner 33, and a power supply signal (control pulse) is supplied from the power supply scanner 33 to each power supply line DSL.

FIG. 20 illustrates a specific circuit configuration example in the pixel PXLC. Each pixel P
The XLC has a pixel circuit 40 including an organic EL element 3D (corresponding to the organic EL element 1A). The pixel circuit 40 is an active driving circuit having a sampling transistor 3A and a driving transistor 3B, a storage capacitor element 3C, and an organic EL element 3D.

Sampling transistor 3A has its gate connected to corresponding scanning line WSL, one of its source and drain connected to corresponding signal line DTL, and the other connected to the gate of driving transistor 3B. The drive transistor 3B has a drain connected to the corresponding power supply line DSL and a source connected to the anode of the organic EL element 3D. The cathode of the organic EL element 3D is connected to the ground wiring 3H. The ground wiring 3H is wired in common to all the pixels PXLC. The storage capacitor element 3C is disposed between the source and gate of the driving transistor 3B.

The sampling transistor 3A conducts according to the scanning signal (selection pulse) supplied from the scanning line WSL, thereby sampling the signal potential of the video signal supplied from the signal line DTL and holding it in the storage capacitor element 3C. Is. Driving transistor 3B
Receives a current supplied from a power supply line DSL set to a predetermined first potential (not shown), and supplies a drive current to the organic EL element 3D according to the signal potential held in the holding capacitor element 3C. Is. The organic EL element 3D emits light with a luminance corresponding to the signal potential of the video signal by the driving current supplied from the driving transistor 3B.

In such a circuit configuration, the sampling transistor 3A is turned on according to the scanning signal (selection pulse) supplied from the scanning line WSL, whereby the signal potential of the video signal supplied from the signal line DTL is sampled and held. It is held in the capacitive element 3C. Also,
A current is supplied to the driving transistor 3B from the power supply line DSL set to the first potential, and a driving current is supplied to the organic EL element 3D in accordance with the signal potential held in the holding capacitor element 3C. Each organic EL element 3D emits light with a luminance corresponding to the signal potential of the video signal by the supplied drive current. Thereby, video display based on the video signal is performed on the display device.

<Application example>
Hereinafter, application examples to the electronic apparatus such as the organic EL display device 1 will be described.
The organic EL display device 1 and the like can be applied to electronic devices in various fields such as a television device, a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, or a video camera. In other words, the organic EL display device 1 and the like can be applied to electronic devices in various fields that display a video signal input from the outside or a video signal generated inside as an image or video.

(module)
The organic EL display device 1 and the like are incorporated into various electronic devices such as application examples 1 to 5 described later, for example, as a module shown in FIG. In this module, for example, a region 210 exposed from the sealing substrate 20 is provided on one side of the drive substrate 10, and the wiring of the horizontal selector 31, the light scanner 32, and the power scanner 33 is extended to the exposed region 210. A connection terminal (not shown) is formed. This external connection terminal has a flexible printed circuit (FPC) for signal input and output.
220 may be provided.

(Application example 1)
FIG. 22 illustrates the appearance of a television device. This television device
For example, the video display screen unit 3 including the front panel 310 and the filter glass 320.
00, and this video display screen unit 300 corresponds to the organic EL display device 1 or the like.

(Application example 2)
FIG. 23 shows the appearance of a digital camera. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 corresponds to the organic EL display device 1 or the like.

(Application example 3)
FIG. 24 shows the appearance of a notebook personal computer. The notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image. The display unit 530 corresponds to the organic EL display device 1 and the like. .

(Application example 4)
FIG. 25 shows the appearance of the video camera. This video camera is, for example,
A main body 610 and a subject photographing lens 620 provided on the front side surface of the main body 610
, A start / stop switch 630 and a display unit 640 at the time of shooting. The display unit 640 corresponds to the organic EL display device 1 or the like.

(Application example 5)
FIG. 26 shows the appearance of a mobile phone. In this mobile phone, for example, an upper housing 710 and a lower housing 720 are connected by a connecting portion (hinge portion) 730, and a display 740, a sub-display 750, a picture light 760, and a camera 77 are connected.
0. Of these, the display 740 or the sub-display 750 corresponds to the organic EL display device 1 or the like.

As described above, the embodiments, modifications, and application examples have been described, but the present disclosure is not limited to these embodiments and the like, and various modifications are possible. For example, the material and thickness of each layer described in the above embodiment and the like, or the film formation method and film formation conditions are not limited, and other materials and thicknesses may be used, or other film formation methods and film formation may be performed. It is good also as film | membrane conditions.

Moreover, in the said embodiment etc., although the sputtering method was illustrated as a film-forming method of the 2nd electrode 16, it can also form by diagonal vapor deposition (oblique vapor deposition from the direction along a taper surface).
In this way, the second electrode 16 may be deposited in the opening S2 having a reverse tapered portion.

Further, in the above-described embodiment and the like, the top emission type is exemplified as the organic EL element. However, the organic EL element is not limited to this and can be applied to a bottom emission type (so-called bottom emission type). In this case, the first electrode 12 is formed of a transparent conductive film, and the second electrode 16 is provided with a metal film having light reflectivity. In this case, for example, R, G, B color filters may be provided on the TFT 11 of the drive substrate 10. Specifically, an inorganic insulating film is provided on the TFT 11 and a color filter is formed in a region facing the first electrode 12 on the inorganic insulating film.

In the above-described embodiment and the like, the case of an active matrix organic EL display device has been described. However, the present disclosure can also be applied to a passive matrix organic EL display device. Furthermore, the configuration of the pixel driving circuit for active matrix driving is not limited to that described in the above embodiment, and a capacitor or a transistor may be added as necessary.

The present disclosure may be configured as described in the following (1) to (20).
(1) A first electrode provided on a substrate, an auxiliary electrode provided in electrical insulation with the first electrode, a first opening facing the first electrode, and at least one of the auxiliary electrode An inter-pixel insulating film having a second opening facing each other, an organic layer formed over the entire area on the inter-pixel insulating film and including a light emitting layer, and a second electrode provided on the organic layer And the second opening of the inter-pixel insulating film includes a forward tapered portion that is inclined with an obtuse angle with respect to the substrate surface, and a reverse tapered portion that is inclined with an acute angle with respect to the substrate surface. An organic EL display device in which the second electrode is electrically connected to the auxiliary electrode in a region facing the reverse tapered portion of two openings.
(2) In a region of the second opening facing the reverse tapered portion, a part of the auxiliary electrode is exposed from the organic layer, and the second electrode is in contact with the auxiliary electrode in the exposed region. The organic EL display device according to (1) above.
(3) In the region of the second opening facing the forward tapered portion, the organic layer covers the auxiliary electrode, and the organic layer and the second electrode are each continuously following the shape of the forward tapered portion. The organic EL display device according to (1) or (2), which is provided in the above.
(4) From the region facing the forward tapered portion of the second opening to the region facing the first opening, the organic layer and the second electrode continuously follow the surface shape of the inter-pixel insulating film. The organic EL display device according to any one of (1) to (3), which is provided.
(5) The organic EL display device according to any one of (1) to (4), wherein the auxiliary electrode is provided in the same layer as the first electrode on the substrate.
(6) A pixel circuit including a thin film transistor is provided on the substrate, and the auxiliary electrode is provided in the same layer as any of the gate, source, and drain electrodes of the thin film transistor. The organic electroluminescence display in any one.
(7) The first electrode is an alloy of aluminum and neodymium (AlNd alloy), a laminated film of indium tin oxide (ITO) and silver (Ag), or a laminated film of indium zinc oxide (IZO) and silver. The organic EL display device according to any one of (1) to (6) above.
(8) The organic EL according to any one of (1) to (7), wherein the second electrode is formed of a co-deposited film of indium tin oxide, indium zinc oxide, zinc oxide (ZnO), magnesium (Mg), and silver. Display device.
(9) The auxiliary electrode is a single layer film or a multilayer film including at least one of titanium (Ti), aluminum (Al), an alloy of aluminum and neodymium (AlNd alloy), indium tin oxide, and indium zinc oxide. The organic EL display device according to any one of the above (1) to (8).
(10) The organic EL display device according to any one of (1) to (9), wherein the light emitting layer is a white light emitting layer.
(11) a step of forming a first electrode on the substrate, a step of forming an auxiliary electrode electrically insulated from the first electrode, a first opening facing the first electrode, and at least one of the auxiliary electrodes Forming an inter-pixel insulating film having a second opening facing a part thereof; forming an organic layer including a light-emitting layer over the entire area on the inter-pixel insulating film; The step of forming the inter-pixel insulating film includes forming a forward tapered portion inclined at an obtuse angle with respect to the substrate surface and an acute angle with respect to the substrate surface. In the step of forming an inclined reverse taper portion and forming the second electrode, an organic EL that electrically connects the second electrode to the auxiliary electrode in a region of the second opening facing the reverse taper portion. Manufacturing method of display device.
(12) In the region of the second opening facing the reverse tapered portion, a part of the auxiliary electrode is exposed from the organic layer, and the second electrode is brought into contact with the auxiliary electrode in the exposed region. A method for producing an organic EL display device according to 11).
(13) In the step of forming the organic layer, the organic layer is formed by vapor deposition, and in the step of forming the second electrode, the second electrode is formed by sputtering or oblique vapor deposition. ) Or the method for producing an organic EL display device according to (12).
(14) In the region of the second opening facing the forward tapered portion, the organic layer and the second electrode are continuously formed in accordance with the shape of the forward tapered portion, respectively (1) to (13) The manufacturing method of the organic electroluminescent display apparatus in any one of.
(15) From the region of the second opening facing the forward tapered portion to the region of facing the first opening, the organic layer and the second electrode are continuously formed following the surface shape of the inter-pixel insulating film. The manufacturing method of the organic electroluminescence display in any one of said (1)-(14) to form.
(16) Before the step of forming the interpixel insulating film, a reverse taper forming thin film having a forward taper on the side surface is formed on the auxiliary electrode, and in the step of forming the interpixel insulating film, the reverse After forming the insulating film material over the taper forming thin film, the first opening is formed in the inter-pixel insulating film, and the reverse taper forming thin film and the reverse taper forming thin film of the insulating film material are formed. The method of manufacturing an organic EL display device according to any one of (1) to (15), wherein the second opening is formed by selectively removing a portion excluding a portion facing the forward taper of .
(17) The method for manufacturing an organic EL display device according to the above (16), wherein a lift-off layer for removing the reverse taper forming thin film is formed between the reverse taper forming thin film and the auxiliary electrode.
(18) The method for manufacturing an organic EL display device according to (17), wherein the photoresist film used when forming the lift-off layer is used as the thin film for forming an inverse taper.
(19) The method for manufacturing an organic EL display device according to (18), wherein after the auxiliary electrode is formed, the lift-off layer and the first electrode are collectively formed in the same step.
(20) At least one of the first electrode provided on the substrate, the auxiliary electrode provided to be electrically insulated from the first electrode, the first opening facing the first electrode, and the auxiliary electrode. An inter-pixel insulating film having a second opening facing each other, an organic layer formed over the entire area on the inter-pixel insulating film and including a light emitting layer, and a second electrode provided on the organic layer And the second opening of the inter-pixel insulating film includes a forward tapered portion that is inclined with an obtuse angle with respect to the substrate surface, and a reverse tapered portion that is inclined with an acute angle with respect to the substrate surface. An electronic apparatus including an organic EL display device in which the second electrode is electrically connected to the auxiliary electrode in a region facing the reverse tapered portion of two openings.

  DESCRIPTION OF SYMBOLS 1, 2 ... Organic EL display apparatus, 1A ... Organic EL element, 10 ... Drive board, 11 ... TFT, 12 ... 1st electrode, 13, 21 ... Auxiliary electrode, 14 ... Inter pixel insulating film, 15 ... Organic layer, 16 2nd electrode, 17 ... protective layer, 20 ... sealing substrate, S1 to S3 ... opening, 14A ... forward taper part, 14B ... reverse taper part, 120, 122a, 124a ... thin film for forming reverse taper, 22, 12A ... Lift-off layer.

Claims (20)

A first electrode provided on a substrate;
An auxiliary electrode that is electrically insulated from the first electrode;
An inter-pixel insulating film having a first opening facing the first electrode and a second opening facing at least a part of the auxiliary electrode;
An organic layer formed over the entire area of the inter-pixel insulating film and including a light emitting layer;
A second electrode provided on the organic layer,
The second opening of the inter-pixel insulating film is
A forward taper portion inclined at an obtuse angle with respect to the substrate surface;
A reverse taper portion inclined at an acute angle with respect to the substrate surface, and the second electrode is electrically connected to the auxiliary electrode in a region facing the reverse taper portion of the second opening. EL display device. In a region facing the reverse tapered portion of the second opening,
The organic EL display device according to claim 1, wherein a part of the auxiliary electrode is exposed from the organic layer, and the second electrode is in contact with the auxiliary electrode in the exposed region. In the region of the second opening facing the forward tapered portion, the organic layer covers the auxiliary electrode, and the organic layer and the second electrode are continuously provided following the shape of the forward tapered portion, respectively. The organic EL display device according to claim 1. The organic layer and the second electrode are continuously provided following the surface shape of the inter-pixel insulating film from a region facing the forward tapered portion of the second opening to a region facing the first opening. The organic EL display device according to claim 1. The organic EL display device according to claim 1, wherein the auxiliary electrode is provided in the same layer as the first electrode on the substrate. A pixel circuit including a thin film transistor is provided on the substrate,
The organic EL display device according to claim 1, wherein the auxiliary electrode is provided in the same layer as any one of a gate electrode, a source electrode, and a drain electrode in the thin film transistor. The first electrode is an alloy of aluminum and neodymium (AlNd alloy), a laminated film of indium tin oxide (ITO) and silver (Ag), or a laminated film of indium zinc oxide (IZO) and silver. The organic EL display device described in 1. The organic EL display device according to claim 1, wherein the second electrode is formed of a co-evaporated film of indium tin oxide, indium zinc oxide, zinc oxide (ZnO), magnesium (Mg), and silver. The auxiliary electrode is a single layer film or a multilayer film including at least one of titanium (Ti), aluminum (Al), an alloy of aluminum and neodymium (AlNd alloy), indium tin oxide, and indium zinc oxide. Item 2. An organic EL display device according to Item 1. The organic EL display device according to claim 1, wherein the light emitting layer is a white light emitting layer. Forming a first electrode on a substrate;
Forming an auxiliary electrode electrically insulated from the first electrode;
Forming an inter-pixel insulating film having a first opening facing the first electrode and a second opening facing at least a part of the auxiliary electrode;
Forming an organic layer including a light emitting layer over the entire region on the inter-pixel insulating film;
Forming a second electrode on the organic layer,
In the step of forming the inter-pixel insulating film, a forward taper portion inclined at an obtuse angle with respect to the substrate surface and a reverse taper portion inclined at an acute angle with respect to the substrate surface are formed in the second opening,
In the step of forming the second electrode, the second electrode is electrically connected to the auxiliary electrode in a region facing the reverse tapered portion of the second opening. The part of the auxiliary electrode is exposed from the organic layer in a region of the second opening facing the reverse tapered portion, and the second electrode is brought into contact with the auxiliary electrode in the exposed region. Manufacturing method of organic EL display device. In the step of forming the organic layer, the organic layer is formed by a vapor deposition method,
The method of manufacturing an organic EL display device according to claim 12, wherein in the step of forming the second electrode, the second electrode is formed by a sputtering method or an oblique deposition method. 12. The organic EL display device according to claim 11, wherein the organic layer and the second electrode are continuously formed to follow the shape of the forward tapered portion in a region of the second opening facing the forward tapered portion. Production method. The organic layer and the second electrode are continuously formed following the surface shape of the inter-pixel insulating film from a region facing the forward tapered portion of the second opening to a region facing the first opening. Item 15. A method for producing an organic EL display device according to Item 14. Before the step of forming the inter-pixel insulating film, a thin film for forming a reverse taper having a forward taper on the side surface is formed on the auxiliary electrode.
In the step of forming the inter-pixel insulating film,
After covering the reverse taper forming thin film and forming an insulating film material,
The first opening is formed in the inter-pixel insulating film, and the reverse taper forming thin film and a portion of the insulating film material excluding a part facing the forward taper of the reverse taper forming thin film are selectively used. The method of manufacturing an organic EL display device according to claim 11, wherein the second opening is formed by removing the second opening. The method of manufacturing an organic EL display device according to claim 16, wherein a lift-off layer for removing the reverse taper forming thin film is formed between the reverse taper forming thin film and the auxiliary electrode. The method of manufacturing an organic EL display device according to claim 17, wherein a photoresist film used when forming the lift-off layer is used as the reverse taper forming thin film. After forming the auxiliary electrode,
The method for manufacturing an organic EL display device according to claim 18, wherein the lift-off layer and the first electrode are collectively formed in the same process. A first electrode provided on a substrate;
An auxiliary electrode that is electrically insulated from the first electrode;
An inter-pixel insulating film having a first opening facing the first electrode and a second opening facing at least a part of the auxiliary electrode;
An organic layer formed over the entire area of the inter-pixel insulating film and including a light emitting layer;
A second electrode provided on the organic layer,
The second opening of the inter-pixel insulating film is
A forward taper portion inclined at an obtuse angle with respect to the substrate surface;
A reverse taper portion inclined at an acute angle with respect to the substrate surface, and the second electrode is electrically connected to the auxiliary electrode in a region facing the reverse taper portion of the second opening. An electronic device provided with an EL display device.

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