JP2555878B2 - Method of manufacturing film carrier tape - Google Patents

Description

The present invention relates to a method for producing a film carrier tape.

[Conventional technology]

A conventional method of manufacturing a film carrier tape will be described together with a method of manufacturing a semiconductor device using a film carrier method with reference to plan views and sectional views taken along the line CC 'of FIG. 8 and FIG.

First, a sprocket hole 1 for transporting and positioning and a device hole 3 which is an opening for receiving the semiconductor chip 2 are formed in an insulating film such as polyimide, and then a metal foil such as copper is adhered onto the insulating film. A lead 4 having a pad 4A for electrical selection at one end and extending into the device hole at the other end is formed by etching the metal foil at one end.
Film carrier tape 6C thus formed
And the bumps 7 which are metal protrusions on the electrode terminals in advance.
The semiconductor chip 2 provided with is prepared.

Next, the leads 4 of the film carrier tape 6C and the bumps 7 of the semiconductor chip 2 are subjected to inner lead bonding by a thermocompression bonding method or a eutectic method. Next, a contactor is brought into contact with the pad 4A for electrical selection to perform electrical selection and a bias test. Here, in order to prevent deformation of the leads 4, a suspender 8 which is an insulating film frame is previously provided integrally with the film carrier tape, and a resin 9 is used as shown in FIG. 10 for improving reliability and mechanical protection. In some cases, the semiconductor chip 2 is resin-sealed by potting.

When mounting the film carrier type semiconductor device as described above, the lead 4 is cut into a desired length, and then the
As shown in FIG. 11, for example, the adhesive 10
Thus, after the semiconductor chip 2 is fixed, the leads 4 can be outer lead bonded to the bonding pads 12 on the printed circuit board 11.

These film carrier type semiconductor devices have advantages such as high speed because bonding can be performed at one time regardless of the number of leads, and automation of work is easy because a film carrier tape is used. There is.

[Problems to be Solved by the Invention]

In the conventional film carrier described above, a suspender, which is a frame of an insulating film for preventing lead deformation, is generally provided, but the suspender is bonded at a stage before forming the leads in the process of manufacturing the film carrier tape. Therefore, chemicals used for etching and plating during lead formation remain on the suspenders and become impurity ions. For this reason, there is a problem that the insulation resistance between the leads on the suspender deteriorates and an electrical leak defect occurs.

This problem becomes more serious as the number of leads of the semiconductor device is increased and the lead width and the lead pitch are reduced.

[Means for solving the problem]

A method of manufacturing a film carrier tape according to the present invention is a film having a sprocket hole, a device hole into which a semiconductor chip is inserted, and a plurality of leads formed so as to extend into the device hole and whose tips are electrically connected to the semiconductor chip. And a method for manufacturing a film carrier tape having an insulating film frame for preventing lead deformation fixed to the lead in the device hole, wherein the plurality of leads are formed with their tip portions connected and plated. After that, the insulating film frame is fixed and then the connecting portion at the tip of the lead is removed to separate the leads.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 to 5 are a plan view and a cross-sectional view of an insulating tape shown in the order of steps for explaining a first embodiment of the present invention.

First, as shown in FIGS. 1 and 2, a metal foil 14 made of Cu or the like is adhered to an insulating film made of polyimide or the like in which the sprocket hole 1 and the device hole 3 are formed by a pressing method or the like via an adhesive 13. To do.

Next, as shown in FIGS. 3 and 4, the metal foil is selectively etched by a general photoetching method,
An electrical selection pad 4A is provided at one end and the other end extends into the device hole 6 to form a lead 4 connected to the tip of another lead. The connecting portion 4B at the tip of the lead formed integrally with the lead 4 is for preventing the deformation of the lead 4.

 Next, the lead 4 is plated with Au, Sn, or the like.

Next, the insulating film made of polyimide or the like is processed into a desired shape by a pressing method or the like to form the suspenders 8A,
It is bonded to a predetermined position on the back surface of the lead 4 in the device hole 3 via the adhesive 13. Although the shape of the suspender 8A is not limited, it is preferable that the suspender 8A has a quadrangular ring shape so as to surround the semiconductor chip and exist on the lead because it is for preventing deformation of the lead.

Finally, as shown in FIG. 5, the integrally formed connecting portion 4B of the tip portion of the lead 4 is removed by a pressing method or the like to separate the tip portion of each lead 4.

As described above, according to the first embodiment, the lead 4 is formed integrally with the connecting portion 4B, plating is performed, and then the suspender 8A is fixed. Will no longer remain on the suspenders. For example, there were several tens of micrograms of contaminants per TAB tape in the past, but the number became less than several micrograms. As a result, electrical leakage between the leads on the suspenders was greatly reduced.

The material of the suspender is close to the expansion coefficient of the semiconductor chip, such as those with insulating coating on Fe-Ni alloy etc. to prevent deterioration due to the difference in expansion coefficient between the semiconductor chip to which the suspender and the lead are joined due to temperature change. Insulating materials can also be used.

FIG. 6 and FIG. 7 are a plan view and a sectional view taken along the line CC ′ of the insulating tape for explaining the second embodiment of the present invention.

First, as in the case of the first embodiment, the sprocket hole 1 and the device hole 3 are provided in the insulating film, and then,
A lead 4 having an electrical selection pad 4A at one end and having the other end connected to the tip of another lead is formed.

Next, after plating lead 4, suspender
8B is provided on the back surface of the lead 4 in the device hole 3. Here, the suspenders 8B are formed in a ring shape using only an adhesive by a printing method, a stamping method, a dispensing method, or the like. By using a rubber-like adhesive such as a silicone resin as the adhesive, there is an advantage that deterioration due to a difference in expansion coefficient between the semiconductor chip to which the suspender and the lead are bonded can be prevented due to temperature change.

Also in the second embodiment, similarly to the first embodiment described above, since the suspender is formed after the lead is etched and plated, the deterioration of the insulation resistance between the leads is reduced.

In each of the above embodiments, the film carrier tape is described as being composed of two layers of the metal foil and the insulating film, but it may be composed of only the metal foil.
In this case, since the pad 4A cannot be formed as shown in FIG. 5, the lead 4 is connected to the bonding pad 12 on the printed circuit board as shown in FIG. 11 in order to perform electrical selection. There is a need to.

〔The invention's effect〕

As described above, the present invention maintains the effect of preventing lead deformation, which is the purpose of the suspender, by forming the suspender of the film carrier tape in the film carrier tape manufacturing process after etching and plating the leads. This has the effect of eliminating the electrical lease between the leads on the suspenders due to contamination during the lead etching or plating process, which has been a problem after conventional mounting.

[Brief description of drawings]

1 to 5 are plan and sectional views of an insulating film shown in the order of steps for explaining the first embodiment of the present invention, and FIGS. 6 and 7 are the second embodiment of the present invention. And FIG. 8 to FIG. 11 are plan views for explaining a conventional film carrier and a method for manufacturing a film carrier type semiconductor device. FIG. 1 ... Sprocket hole, 2 ... Semiconductor chip, 3 ...
… Device hole, 4… Lead, 4A… Pad, 4B…
… Connecting parts, 6A to 6C …… Film carrier tape, 7…
… Bumps, 8,8A, 8B …… Suspenders, 9 …… Resin, 10
...... Adhesive, 11 …… Substrate, 12 …… Bonding pad,
13 …… Adhesive, 14 …… Metal foil, 15 …… Insulating film.

Claims (1)

(57) [Claims] 1. A film having a sprocket hole, a device hole into which a semiconductor chip is inserted, and a plurality of leads formed so as to extend into the device hole and whose ends are electrically connected to the semiconductor chip, and the inside of the device hole. In the method of manufacturing a film carrier tape having a lead deformation preventing insulating film frame fixed to the lead, the plurality of leads are formed in a state where their leading ends are connected and plated, and then the insulating film frame is formed. A method for producing a film carrier tape, which comprises fixing and then removing the connecting portion at the tip of the lead to separate each lead.