JP3942734B2 - Electronic component testing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a test apparatus for testing an electronic component such as an IC chip in a state where a thermal stress is applied. More specifically, the present invention relates to all the electronic devices to be tested at a time when simultaneously testing a plurality of electronic components. The present invention relates to an electronic component testing apparatus capable of testing a component under a substantially uniform temperature condition.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or the like, a test apparatus for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing a plurality of IC chips at a time under a temperature condition (thermal stress condition) higher than room temperature is known.
[0003]
In such a test apparatus, the upper part of the test head is covered with a test chamber, the inside is a sealed space, and a test tray holding a plurality of IC chips is conveyed onto the test head, where the IC chip is tested by a pusher. The test is conducted by pressing the head to connect and heating with warm air. By such a test under heat stress, the IC chip is well tested and at least divided into a good product and a defective product.
[0004]
[Problems to be solved by the invention]
However, in the conventional test apparatus, the IC chip inside the test chamber is heated only by the warm air. Therefore, the heating temperature of the IC chip located on the upstream side and the downstream side of the warm air is particularly high. There is a problem that variations occur. This is because, for example, it is difficult for hot air to circulate through the portion of the mechanism that presses a plurality of IC chips toward the test head. When attempting to test a large number of IC chips at the same time, temperature non-uniformity is particularly likely to occur.
[0005]
If the temperature non-uniformity is large, the specific IC chip is not tested because the test is performed outside the temperature conditions of the standard specification, and the reliability of the test is lowered.
[0006]
Moreover, when testing IC chips under thermal stress conditions, it is preferable to quickly heat all IC chips to be tested at once to a predetermined temperature condition, thereby reducing the overall test process time. . However, since the conventional test apparatus is only heated with warm air, there is a problem that the temperature raising time required for heating all the IC chips to a predetermined temperature is long.
[0007]
The present invention has been made in view of such a situation, and when testing a plurality of electronic components at the same time, all the electronic components to be tested at one time can be tested under substantially uniform temperature conditions. An object of the present invention is to provide an electronic component testing apparatus capable of shortening a test process time.
[0008]
[Means for Solving the Problems]
  In order to achieve the above object, an electronic component testing apparatus according to the present invention includes a plurality of sockets arranged on a test head so that a plurality of electronic components to be tested are respectively mounted, and each of the electronic components. A pusher that can be pressed toward the connection terminal of each socket; a drive plate that moves the pusher toward the socket; and the drive plateOr the pressing part attached to the drive plateIt is attached toThe drive plate, the pressing portion, andAnd a temperature controller for adjusting the temperature of the electronic component by heat transfer through the pusher.
[0009]
A test apparatus according to the present invention includes a test chamber that seals a space surrounding a socket, a pusher, and a drive plate disposed at an upper portion of the test head, and a temperature control circuit that circulates a temperature-controlled gas inside the test chamber. An electronic component testing apparatus further comprising a blower, wherein the temperature controller is divided into a plurality of parts along the flow direction of the gas circulating in the test chamber, and the temperature can be individually controlled. It is preferable to have.
[0010]
The test apparatus according to the present invention compensates for temperature non-uniformity caused by the position of the electronic component generated along the flow direction of the temperature-controlled gas flowing along the plurality of electronic components, and tests each electronic component in a uniform temperature state. As described above, it is preferable to further include control means for individually controlling the amount of heat transferred from the individual temperature control portion to each electronic component.
[0011]
The plurality of electronic components are preferably held by a test tray, and the test tray is transported between the pusher and the socket.
[0012]
The plurality of pushers are respectively fixed to lower ends of the adapters, the adapters are elastically held with respect to the match plate, and the match plate can be exchanged according to the type of electronic component. It is preferable that the driving plate is disposed above the match plate so as to be movable in the vertical direction.
[0013]
Although it does not specifically limit as said temperature controller, When it is a temperature controller for heating, it is preferable that it is a planar heating element. The temperature controller may be an endothermic temperature controller, in which case a Peltier element or the like is used.
[0014]
The electronic component to be tested by the test apparatus according to the present invention is not particularly limited, but an IC chip can be exemplified, for example.
[0015]
[Action]
  In the test apparatus according to the present invention, each electronic component can be pressed toward the connection terminal of each socket.A driving plate, the pressing portion andThe temperature of multiple electronic components is controlled by heat transfer via a pusher, so the temperature of the electronic component to be tested can be quickly compared to a test device that adjusts the temperature of electronic components using only warm air. Can be set to Accordingly, the test process time can be shortened.
[0016]
In addition, in the test apparatus according to the present invention, the temperature of a plurality of electronic components is adjusted by heat transfer using a temperature controller, so the temperature distribution is not uniform compared to a test apparatus that adjusts the temperature of electronic components using only warm air. Hard to occur. Therefore, it is easy to make all the electronic components to be tested at substantially the same temperature condition, and the reliability of the test of the electronic component under the heat stress condition is improved.
[0017]
In the test apparatus according to the present invention, the time required for the electronic component to reach a predetermined temperature can be further shortened by combining with the temperature control blower. In addition, the temperature of the electronic component is likely to be different depending on the air blowing position only with the temperature control blower, but the flow direction of the temperature-controlled gas is combined with the temperature controller by heat transfer like the device of the present invention. It is possible to compensate for temperature non-uniformity caused by the position of the electronic component along the line. As a result, all the electronic components to be tested at the same time can be brought to substantially the same temperature condition, and the reliability of the testing of the electronic components under the heat stress condition is improved.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
[0019]
1 is a cross-sectional view of an essential part of an IC test apparatus according to an embodiment of the present invention, FIG. 2 is an overall side view of the IC test apparatus, FIG. 3 is a perspective view of the handler shown in FIG. FIG. 5 is a perspective view showing the structure of an IC stocker of the IC test apparatus, FIG. 6 is a perspective view showing a customer tray used in the IC test apparatus, and FIG. 7 is the IC test apparatus. FIG. 8 is an exploded perspective view showing an example of the structure near the socket in the test head of the IC test apparatus, FIG. 9 is a sectional view around the socket shown in FIG. 8, and FIG. It is sectional drawing which shows the state which the pusher fell in the socket vicinity of the test head.
[0020]
First, an overall configuration of an IC test apparatus as an electronic component test apparatus according to an embodiment of the present invention will be described.
As shown in FIG. 2, the IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a test main apparatus 6.
The handler 1 sequentially carries the IC chips to be tested to the IC socket provided in the test head 5, sorts the IC chips that have been tested according to the test result, and stores them in a predetermined tray.
[0021]
The IC socket provided in the test head 5 is connected to the test main device 6 through the cable 7, and the IC chip detachably attached to the IC socket is connected to the test main device 6 through the cable 7 for testing. The IC chip is tested by a test signal from the main device 6.
[0022]
A control device that mainly controls the handler 1 is built in the lower portion of the handler 1, but a space portion 8 is provided in part. The test head 5 is replaceably disposed in the space portion 8, and an IC chip can be attached to an IC socket on the test head 5 through a through hole formed in the handler 1.
[0023]
This IC test apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested in a temperature state higher than normal temperature (high temperature) or a lower temperature state (low temperature). As shown in FIG. The chamber 100 is used to test a constant temperature bath 101 for applying a desired high or low temperature thermal stress to the IC chip to be tested, and an IC chip in a state where the thermal stress is applied in the constant temperature bath 101. It has a test chamber 102 and a heat removal tank 103 for removing thermal stress from the IC chip tested in the test chamber 102. The upper portion of the test head 5 shown in FIG. 2 is inserted into the test chamber 102 as shown in FIG. 1, where the IC chip 2 is tested.
[0024]
FIG. 4 is a view for understanding the method of handling the test IC chip in the IC test apparatus of the present embodiment, and actually shows the members arranged in the vertical direction in plan view. There is also a part. Therefore, the mechanical (three-dimensional) structure can be understood mainly with reference to FIG.
[0025]
As shown in FIGS. 3 and 4, the handler 1 of the IC test apparatus 10 of the present embodiment stores an IC chip to be tested from now on, and also classifies and stores tested IC chips, A loader unit 300 for sending an IC chip to be tested sent from the IC storage unit 200 to the chamber unit 100, a chamber unit 100 including a test head, and an unloader for classifying and extracting tested ICs that have been tested in the chamber unit 100 Part 400. Inside the handler 1, the IC chip is accommodated in a tray and conveyed.
[0026]
A large number of IC chips before being accommodated in the handler 1 are accommodated in the customer tray KST shown in FIG. 6, and in that state, supplied to the IC accommodating portion 200 of the handler 1 shown in FIGS. The IC chip 2 is transferred from the customer tray KST to the test tray TST (see FIG. 7) conveyed in the handler 1. Inside the handler 1, as shown in FIG. 4, the IC chip moves while being placed on the test tray TST, and is subjected to a test (inspection) as to whether the IC chip operates properly by being applied with a high or low temperature stress. Categorized according to the test results.
Hereinafter, the inside of the handler 1 will be described in detail individually.
[0027]
IC storage unit 200
As shown in FIG. 3, the IC storage unit 200 includes a pre-test IC stocker 201 that stores IC chips before the test, and a tested IC stocker 202 that stores IC chips classified according to the test results. It is provided.
[0028]
As shown in FIG. 5, the pre-test IC stocker 201 and the tested IC stocker 202 can enter a frame-like tray support frame 203 and enter the lower part of the tray support frame 203 and move up and down. And an elevator 204. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
[0029]
In the pre-test IC stocker 201 shown in FIG. 3, a customer tray KST storing IC chips to be tested is stacked and held. The tested IC stocker 202 holds and holds a customer tray KST containing the IC chips classified after the test.
[0030]
Since the pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure, the pre-test IC stocker 201 can be used as the tested IC stocker 202 and vice versa. is there. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers 202 can be easily changed as necessary.
[0031]
In the embodiment shown in FIGS. 3 and 4, two stockers STK-B are provided as the pre-test stocker 201. Next to the stocker STK-B, two empty stockers STK-E to be sent to the unloader unit 400 are provided as the tested IC stocker 202. Next to that, eight stockers STK-1, STK-2,..., STK-8 are provided as tested IC stockers 202, and sorted into a maximum of eight categories according to the test results and stored. It is configured so that it can. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0032]
Loader unit 300
The customer tray KST accommodated in the tray support frame 203 of the pre-test IC stocker 201 shown in FIG. 5 is, as shown in FIG. 3, a tray transfer arm 205 provided between the IC storage unit 200 and the apparatus substrate 105. As a result, it is carried from the lower side of the apparatus substrate 105 to the window part 306 of the loader part 300. Then, in the loader unit 300, the IC chips to be tested loaded on the customer tray KST are once transferred to the precursor 305 by the XY transport device 304, where the mutual positions of the IC chips to be tested are corrected. After that, the IC chip to be tested transferred to the preciser 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.
[0033]
As shown in FIG. 3, the IC transfer device 304 that reloads IC chips to be tested from the customer tray KST to the test tray TST includes two rails 301 installed on the upper portion of the device substrate 105, and these two rails. A movable arm 302 that can reciprocate between the test tray TST and the customer tray KST by 301 (this direction is referred to as a Y direction), is supported by the movable arm 302, and moves in the X direction along the movable arm 302. And a movable head 303 that can be used.
[0034]
A suction head is mounted downward on the movable head 303 of the XY transport device 304. The suction head moves while sucking air, so that the IC chip to be tested is sucked from the customer tray KST. The IC chip to be tested is transferred to the test tray TST. For example, about eight such suction heads are attached to the movable head 303, and eight IC chips to be tested can be loaded onto the test tray TST at a time.
[0035]
In the general customer tray KST, the recess for holding the IC chip to be tested is formed to be relatively larger than the shape of the IC chip to be tested, so that it is stored in the customer tray KST. The positions of the IC chips to be tested have a large variation. Accordingly, when the IC chip to be tested is sucked by the suction head and directly transferred to the test tray TST in this state, it is difficult to accurately drop the IC chip into the IC storage recess formed in the test tray TST. For this reason, in the handler 1 of the present embodiment, an IC chip position correcting means called a “preciser 305” is provided between the installation position of the customer tray KST and the test tray TST. Since this precise 305 has a relatively deep recess, and the periphery of this recess is surrounded by an inclined surface, if the IC chip to be tested adsorbed by the suction head is dropped into this recess, the slope is inclined. The drop position of the IC chip under test is corrected on the surface. As a result, the mutual positions of the eight IC chips to be tested are accurately determined, and the IC chips to be tested whose positions have been corrected are again sucked by the suction head and transferred to the test tray TST to form the test tray TST. The IC chip to be tested can be transshipped with high precision into the IC housing recess.
[0036]
Chamber 100
The above-described test tray TST is loaded into the chamber 100 after the IC chips to be tested are loaded by the loader unit 300, and each IC chip to be tested is tested while being mounted on the test tray TST.
[0037]
The chamber 100 includes a thermostatic chamber 101 that applies a target high or low temperature thermal stress to the IC chip to be tested loaded on the test tray TST, and the IC chip to be tested in a state where the thermal stress is applied in the thermostatic chamber 101. Is made up of a test chamber 102 that contacts the test head, and a heat removal tank 103 that removes the applied thermal stress from the IC chip under test in the test chamber 102.
[0038]
In the heat removal tank 103, when a high temperature is applied in the thermostatic chamber 101, the IC chip to be tested is cooled to the room temperature by blowing air, and when low temperature is applied in the thermostatic tank 101, the IC chip to be tested is heated with warm air. Or, it is heated with a heater or the like and returned to a temperature at which condensation does not occur. Then, the IC chip to be tested after heat removal is carried out to the unloader unit 400.
[0039]
As shown in FIG. 3, the constant temperature bath 101 and the heat removal bath 103 of the chamber 100 are arranged so as to protrude upward from the test chamber 102. Further, as shown conceptually in FIG. 4, the thermostatic chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 is empty. Wait while. Mainly during this standby, high or low temperature thermal stress is applied to the IC chip under test.
[0040]
As shown in FIG. 4, a test head 5 is arranged at the lower center of the test chamber 102, and a test tray TST is carried on the test head 5. Here, all the IC chips 2 held by the test tray TST shown in FIG. 7 are brought into electrical contact with the test head 5 simultaneously or sequentially, and the test is performed on all the IC chips 2 in the test tray TST. On the other hand, the test tray TST for which the test has been completed is removed by the heat removal tank 103, and after returning the temperature of the IC chip 2 to room temperature, it is discharged to the unloader section 400 shown in FIGS.
[0041]
Further, as shown in FIG. 3, an inlet opening for feeding the test tray TST from the apparatus substrate 105 to the upper part of the constant temperature bath 101 and the heat removal tank 103, and for sending the test tray TST to the apparatus substrate 105. Each of the outlet openings is formed. On the apparatus substrate 105, a test tray transfer device 108 for taking in and out the test tray TST from these openings is mounted. These conveying devices 108 are constituted by rotating rollers, for example. The test tray TST discharged from the heat removal tank 103 by the test tray transfer device 108 provided on the apparatus substrate 105 is returned to the thermostatic chamber 101 via the unloader unit 400 and the loader unit 300.
[0042]
FIG. 7 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment. The test tray TST has a rectangular frame 12, and a plurality of bars 13 are provided on the frame 12 in parallel and at equal intervals. A plurality of attachment pieces 14 are formed on both sides of the crosspieces 13 and inside the side 12a of the frame 12 parallel to the crosspieces 13 so as to protrude at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two mounting pieces 14 facing each other among the plurality of mounting pieces 14 provided between the bars 13 and between the bars 13 and the side 12a.
[0043]
Each insert storage portion 15 stores one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. For this purpose, attachment holes 21 for attachment pieces 14 are formed at both ends of the insert 16. For example, about 16 × 4 inserts 16 are attached to one test tray TST.
[0044]
Each insert 16 has the same shape and the same size, and the IC chip 2 to be tested is accommodated in each insert 16. The IC housing portion 19 of the insert 16 is determined according to the shape of the IC chip 2 to be housed, and is a rectangular recess in the example shown in FIG.
[0045]
Here, if the IC chips 2 to be tested connected to the test head 5 at a time are IC chips 2 to be tested arranged in 4 rows × 16 columns as shown in FIG. A total of four IC chips 2 to be tested arranged in every other row. That is, in the first test, a total of 16 IC chips 2 to be tested arranged every third row from the first row are connected to the contact pins 51 of the socket 50 of the test head 5 as shown in FIG. And test. In the second test, the test tray TST is moved by one row, the IC chips to be tested arranged every third row from the second row are tested in the same manner, and this is repeated four times to obtain all the IC chips to be tested. 2 is tested. The result of this test is stored in the control device of the handler 1 at an address determined by, for example, the identification number assigned to the test tray TST and the number of the IC chip 2 to be tested allocated inside the test tray TST.
[0046]
As shown in FIG. 8, on the test head 5, the number of sockets 50 corresponding to a total of four columns of IC chips 2 to be tested (for example, every third row in the row direction) in the test tray TST shown in FIG. (4 rows × 4 columns). If the size of each socket 50 can be reduced, the test head 5 has 4 on the test head 5 so that all the IC chips 2 held on the test tray TST shown in FIG. Rows × 16 columns of sockets 50 may be arranged.
[0047]
As shown in FIG. 8, one socket guide 40 is mounted for each socket 50 on the top of the test head 5 in which the socket 50 is disposed. The socket guide 40 is fixed with respect to the socket 50.
[0048]
On the test head 5, the test tray TST shown in FIG. 7 is conveyed, and the number corresponding to the interval between the IC chips 2 to be tested at one time (in the test tray TST, the total is every three rows). A total of 16 inserts 16 in four rows are positioned on the corresponding socket guides 40.
[0049]
The pushers 30 shown in FIG. 8 are provided on the upper side of the test head 5 corresponding to the number of socket guides 40. As shown in FIG. 1, each pusher 30 is fixed to the lower end of the adapter 62. Each adapter 62 is elastically held on the match plate 60. The match plate 60 is mounted on the test head 5 so that the test plate TST can be inserted between the pusher 30 and the socket guide 40. The match plate 60 is attached to the test head 5 or the drive plate 72 of the Z-axis drive device 70 so as to be movable in the Z-axis direction. The adapter 62 is adapted to the shape of the IC chip 2 to be tested. The pusher 30 and the pusher 30 are interchangeable. The test plate TST is conveyed between the pusher 30 and the socket guide 40 from the direction perpendicular to the paper surface (X axis) in FIG. As a means for transporting the test plate TST inside the chamber 100, a transport roller or the like is used. When the test tray TST is transported, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the test tray TST is sufficiently inserted between the pusher 30 and the socket guide 40. Clear gaps are formed.
[0050]
As shown in FIG. 1, the number of pressing portions 74 corresponding to the adapter 62 is fixed to the lower surface of the drive plate 72 disposed inside the test chamber 102, and the adapter 62 held on the match plate 60. The upper surface of the plate can be pressed. A drive shaft 78 is fixed to the drive plate 72, and the drive shaft 78 is connected to a pressure cylinder (not shown). The pressure cylinder is constituted by, for example, a pneumatic cylinder, and the adapter 62 can be pressed by moving the drive shaft 78 up and down along the Z-axis direction.
[0051]
As shown in FIGS. 8 and 9, a pusher 31 for pressing the IC chip to be tested is formed at the center of the pusher 30 attached to the lower end of each adapter 62, and guide holes 20 of the insert 16 are formed on both sides thereof. And the guide pin 32 inserted in the guide bush 41 of the socket guide 40 is provided. A stopper guide 33 is provided between the pressing element 31 and the guide pin 32 to restrict the lower limit when the pusher 30 moves downward by the Z-axis drive device 70. The lower limit position of the pusher that is pressed with an appropriate pressure that does not destroy the IC chip 2 to be tested is determined by contacting the stopper surface 42 of the socket guide 40.
[0052]
Each insert 16 is attached to the test tray TST using a fastener 17 as shown in FIG. 7, and the guide pins 32 and sockets of the pusher 30 described above are provided on both sides thereof as shown in FIGS. The guide bush 41 of the guide 40 has a guide hole 20 inserted from above and below.
[0053]
As shown in FIG. 10 showing the lowered state of the pusher 30, the left guide hole 20 is a positioning hole and has a smaller inner diameter than the right guide hole 20. Therefore, the guide pin 32 of the pusher 30 is inserted into the upper half of the left guide hole 20 for positioning, and the guide bush 41 of the socket guide 40 is inserted into the lower half for positioning. . Incidentally, in the drawing, the right guide hole 20, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted.
[0054]
As shown in FIGS. 9 and 10, an IC accommodating portion 19 is formed in the center of the insert 16, and the IC chip to be tested is dropped on the test tray TST shown in FIG. Will be loaded.
[0055]
As shown in FIGS. 9 and 10, two guide pins 32 formed on the pusher 30 are inserted on both sides of the socket guide 40 fixed to the test head 5, and between these two guide pins 32. A guide bush 41 for positioning is provided, and the guide bush 41 on the left side in the figure performs positioning with the insert 16 as described above.
[0056]
As shown in FIG. 10, a socket 50 having a plurality of contact pins 51 is fixed to the lower side of the socket guide 40. The contact pins 51 are spring-biased upward by a spring not shown. Yes. Therefore, even if the IC chip to be tested is pressed, the contact pins 51 are retracted to the upper surface of the socket 50, while the contact pins 51 are contacted to all terminals of the IC chip 2 even if the IC chip 2 to be tested is pressed slightly inclined. 51 can come into contact.
[0057]
In the present embodiment, in the chamber 100 configured as described above, as shown in FIG. 1, a temperature control blower 90 is mounted inside a sealed casing 80 that configures the test chamber 102. The temperature control blower 90 includes a fan 92 and a heat exchanging portion 94. The air inside the casing is sucked by the fan 92 and discharged to the inside of the casing 80 through the heat exchanging portion 94. Set to predetermined temperature conditions (high or low temperature).
[0058]
The heat exchanging portion 94 of the temperature control blower 90 is configured by a heat dissipation heat exchanger or an electric heater through which a heating medium flows when the inside of the casing is heated to a high temperature. A sufficient amount of heat can be provided to maintain a high temperature of about ° C. When the inside of the casing is cooled, the heat exchanging portion 94 is constituted by a heat-absorbing heat exchanger through which a refrigerant such as liquid nitrogen circulates. The inside of the casing is, for example, about −60 ° C. to room temperature. It is possible to absorb a sufficient amount of heat to maintain a low temperature. The internal temperature of the casing 80 is detected by, for example, the temperature sensor 82, and the air volume of the fan 92 and the heat volume of the heat exchanging portion 94 are controlled so that the inside of the casing 80 is maintained at a predetermined temperature.
[0059]
Hot air or cold air generated through the heat exchanging portion 94 of the temperature control blower 90 flows along the Y-axis direction in the upper portion of the casing 80, descends along the casing side wall opposite to the device 90, and matches the match plate 60. It returns to the apparatus 90 through the gap between the test head 5 and circulates inside the casing.
[0060]
In the present embodiment, in addition to such a temperature control blower 90, a plurality of planar heating elements 76 (individual temperature control portions of the temperature controller) are arranged on the upper surface of the drive plate 72 of the Z-axis drive device 70. It is. Each planar heating element 76 is divided and arranged on the upper surface of the drive plate corresponding to the pressing portion 74 arranged along the Y-axis direction. In FIG. 1, the dividing direction of the planar heating element 76 coincides with the flow direction of temperature-controlled air circulating inside the test chamber along the Y-axis direction arrangement direction of the IC chips 2 on the test head 5. The plurality of planar heating elements 76 arranged separately in the Y-axis direction are band-shaped heating elements that are not divided in the X-axis direction. However, the planar heating element 76 may be divided and controlled individually in the X-axis direction.
[0061]
Each planar heating element 76 is controlled by an output signal from a control device 96 as a control means, and temperature control is possible individually. The planar heating element is not particularly limited. For example, a planar heating element having a heating layer in which a conductive coating is applied to a base fabric, and conductive filaments (wires, bands, threads) are arranged in a planar shape. A planar heating element having a heating layer comprising: a planar heating element comprising a heating layer comprising a conductive sheet in which conductive particles are dispersed; and a planar heating element having a heating layer comprising a conductive coating layer formed on an insulating sheet. A body etc. can be illustrated.
[0062]
Each planar heating element 76 is generated along the flow direction of temperature-controlled air flowing along the plurality of IC chips 2 arranged along the Y-axis direction based on an output signal from the control device 96. The amount of heat transferred from each planar heating element 76 to each IC chip 2 is individually controlled so as to compensate for temperature non-uniformity due to position 2 and to test each IC chip 2 at a uniform temperature state. ing.
[0063]
For example, in order to make the inside of the test chamber 102 into a high temperature state, when the temperature-controlled air blown out from the temperature control air blower 90 is hot air, it is arranged on the test head 5 on the downstream side of the hot air. The temperature of the IC chip 2 to be applied tends to be lower than the temperature of the IC chip 2 disposed on the upstream side. Therefore, in this embodiment, the amount of heat transferred from the planar heating element 76 to the IC chip 2 arranged on the downstream side of the hot air above the test head 5 is the IC chip 2 arranged on the upstream side. On the other hand, control by the control device 96 is performed so that the amount of heat transferred from the sheet heating element 76 is larger.
[0064]
Specifically, each planar heating element is obtained so that a non-uniform temperature distribution of the IC chip 2 by only the temperature control air blower 90 is obtained in advance by actual measurement or simulation, and the temperature distribution is compensated to obtain a uniform temperature distribution. The amount of steady heat transferred from 76 is determined. Alternatively, the temperature distribution of the plurality of IC chips 2 arranged in the Y-axis direction is measured in real time by the temperature sensor, and the control device 96 controls each of the planar heating elements 76 based on the output signals from the temperature sensors. The amount of heat transferred to the IC chip 2 is controlled. As a result, the IC chip can be subjected to a high temperature stress test with a uniform temperature distribution.
[0065]
Further, in order to make the inside of the test chamber 102 in a low temperature state, when the temperature-adjusted air blown out from the temperature control blower 90 is cold air, it is arranged at the upper part of the test head 5 on the downstream side of the cold air. The temperature of the IC chip 2 tends to be higher than the temperature of the IC chip 2 arranged on the upstream side. Therefore, in the present embodiment, the amount of heat transferred from the planar heating element 76 to the IC chip 2 arranged on the downstream side of the cold air above the test head 5 is transferred to the IC chip 2 arranged on the upstream side. On the other hand, control by the control device 96 is performed so that the amount of heat transferred from the planar heating element 76 is smaller. Specific control is the same as in the case of high temperature stress. As a result, the low temperature stress test of the IC chip can be performed with a uniform temperature distribution.
[0066]
From the viewpoint of improving the heat transfer from the planar heating element 76 to the IC chip 2, the drive plate 72, the pressing portion 74, the adapter 62, and the pusher 30 serving as the heat transfer path have excellent heat transfer characteristics. It is preferable that it is made of a metal.
[0067]
Unloader unit 400
3 and 4 are also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300, and the XY transport devices 404 and 404. As a result, the tested IC chips are transferred from the test tray TST carried out to the unloader unit 400 to the customer tray KST.
[0068]
As shown in FIG. 3, the device substrate 105 of the unloader unit 400 has a pair of windows 406 and 406 arranged so that the customer tray KST conveyed to the unloader unit 400 faces the upper surface of the device substrate 105. It has been opened.
[0069]
Although not shown, an elevating table for elevating and lowering the customer tray KST is provided below each window portion 406. Here, the tested IC chips to be tested are reloaded to fill up. The lowered customer tray KST is loaded and lowered, and this full tray is transferred to the tray transfer arm 205.
[0070]
Incidentally, in the handler 1 of the present embodiment, although the maximum number of categories that can be sorted is eight, only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. Therefore, the categories that can be sorted in real time are limited to four categories. In general, non-defective products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices. In addition to these, four categories are sufficient, but retesting is required, for example. Categories that do not belong to these categories, such as things, may occur.
[0071]
As described above, when an IC chip to be tested classified into a category other than the category assigned to the four customer trays KST (see FIGS. 5 and 6) arranged in the window 406 of the unloader unit 400 is generated, One customer tray KST is returned from the unloader unit 400 to the IC storage unit 200, and a customer tray KST in which a newly generated IC chip of a newly generated category is stored is transferred to the unloader unit 400 instead. An IC chip may be stored. However, if the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time, resulting in a problem that the throughput is reduced. For this reason, in the handler 1 of the present embodiment, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and a test IC chip of a category that rarely occurs is provided in the buffer unit 405. I keep it temporarily.
[0072]
For example, the buffer unit 405 is provided with a capacity for storing about 20 to 30 IC chips to be tested, and a memory for storing the categories of IC chips stored in the respective IC storage positions of the buffer unit 405 is provided. The category and position of the IC chip under test temporarily stored in the unit 405 are stored for each IC chip under test. Then, at the time of sorting work or when the buffer unit 405 is full, the customer tray KST of the category to which the IC chip under test stored in the buffer unit 405 belongs is called from the IC storage unit 200 and stored in the customer tray KST. To do. At this time, the IC chips to be tested temporarily stored in the buffer unit 405 may cover a plurality of categories. In such a case, when calling the customer tray KST, a plurality of customer trays KST are transferred to the window of the unloader unit 400 at a time. Calling the unit 406 is sufficient.
[0073]
Operation of the test apparatus 10
In the test apparatus 10 according to the present embodiment, as shown in FIG. 1, in addition to the temperature-controlled air blower 90, a plurality of sheet heating elements 76 are used to drive a plurality of components via the drive plate 72, the pressing portion 74, the adapter 62, and the pusher 30. The temperature of the IC chip 2 is adjusted by heat transfer. For this reason, the IC chip 2 to be tested can be quickly set to the target temperature as compared with the conventional test apparatus in which the temperature of the IC chip 2 is adjusted only by the hot air from the temperature control blower 90. Therefore, the overall test process time can be shortened.
[0074]
Further, in the test apparatus 10 according to the present embodiment, the temperature of the plurality of IC chips 2 is adjusted by heat transfer by the planar heating element 76, so that the temperature is adjusted only by warm air as compared with the conventional test apparatus. Therefore, nonuniform temperature distribution is unlikely to occur. Therefore, it is easy to make all the IC chips 2 to be tested simultaneously have substantially the same temperature condition, and the reliability of the test of the IC chip 2 under the heat stress condition is improved.
[0075]
Further, the temperature control IC 90 alone tends to cause a difference in the temperature of the IC chip 2 depending on the air supply position. However, like the device 10 of the present embodiment, a planar heating element that adjusts the temperature of the IC chip 2 by heat transfer. By combining with 76, temperature nonuniformity due to the position of the IC chip 2 generated along the flow direction of the temperature-controlled gas can be compensated. As a result, all the IC chips 2 to be tested simultaneously can be brought to substantially the same temperature condition, and the reliability of the test of the IC chip 2 under the heat stress condition is improved.
[0076]
Other embodiments
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.
[0077]
For example, in the above-described embodiment, the planar heating element 76 that can be individually controlled is mounted on the upper surface of the drive plate 72. However, the mounting position of the planar heating element is not limited to these positions, and the driving plate 72 and the pressing portion. 74, the position of the lower surface of the pressing part 74, the upper surface of the adapter 62, etc. may be sufficient. The temperature controller for adjusting the temperature by heat transfer is not limited to the planar heating element 76 but may be a heating temperature controller such as other heaters. Alternatively, the temperature controller for adjusting the temperature by heat transfer may be an endothermic temperature controller such as a Peltier element. When performing a high-temperature stress test using a test apparatus, the temperature of the IC chip 2 positioned upstream of the flow of warm air blown by the temperature control blower 90 is higher than the temperature of the IC chip 2 downstream thereof. It tends to be higher. If the amount of heat from the temperature control blower 90 is set in accordance with the temperature condition of the downstream IC chip 2, the temperature of the IC chip 2 located on the upstream side may be higher than the test specification.
[0078]
In such a case, an endothermic temperature controller is disposed in place of the planar heating element 76 of the above embodiment, and the amount of heat absorbed from the IC chip 2 located on the upstream side is transferred from the IC chip 2 on the downstream side. It is preferable that the amount of heat absorbed is greater than that to eliminate uneven temperature distribution.
[0079]
In the test apparatus 10 according to the above-described embodiment, as shown in FIGS. 3 and 4, the chamber 100 includes the thermostatic bath 101, the test chamber 102, and the heat removal bath 103, but according to the present invention. In the test apparatus, the constant temperature bath 101 and / or the heat removal bath 103 can be omitted.
[0080]
【The invention's effect】
As described above, according to the electronic component testing apparatus according to the present invention, when testing a plurality of electronic components simultaneously, all the electronic components to be tested at one time are tested under substantially uniform temperature conditions. In addition, the overall test process time can be shortened.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an essential part of an IC test apparatus according to an embodiment of the present invention.
FIG. 2 is an overall side view of the IC test apparatus.
FIG. 3 is a perspective view of the handler shown in FIG. 2;
FIG. 4 is a flow chart of a tray showing a method for routing an IC under test.
FIG. 5 is a perspective view showing a structure of an IC stocker of the IC test apparatus.
FIG. 6 is a perspective view showing a customer tray used in the IC test apparatus.
FIG. 7 is a partially exploded perspective view showing a test tray used in the IC test apparatus.
FIG. 8 is an exploded perspective view showing an example of the structure in the vicinity of the socket in the test head of the IC test apparatus.
FIG. 9 is a cross-sectional view of the vicinity of the socket shown in FIG.
FIG. 10 is a cross-sectional view showing a state where the pusher is lowered in the vicinity of the socket of the test head.
[Explanation of symbols]
1 ... Handler
2 ... IC chip
5 ... Test head
6 ... Main equipment for testing
10 ... IC test equipment (electronic parts test equipment)
16 ... Insert
30 ... Pusher
40 ... Socket guide
50 ... Socket
60 ... Match plate
62 ... Adapter
70 ... Z-axis drive device
72 ... Drive plate
74 ... Pressing part
76 ... Planar heating element (individual temperature control part of temperature controller)
80 ... Casing
82 ... Temperature sensor
90 ... Temperature controlled air blower
92 ... Fans
94 ... Heat exchanger
96 ... Control device
100 ... Chamber
101 ... Thermostatic bath
102 ... Test chamber
103 ... Heat removal tank
TST ... Test tray

Claims (7)

A plurality of sockets arranged on the test head so that a plurality of electronic components to be tested are respectively mounted;
A pusher capable of pressing each electronic component in the direction of the connection terminal of each socket;
A drive plate for moving the pusher toward the socket;
An electronic component mounted on the driving plate or a pressing portion attached to the driving plate, and having a temperature controller that adjusts the temperature of the electronic component by heat transfer via the driving plate, the pressing portion, and the pusher. Test equipment. A test chamber for sealing a space surrounding a socket, a pusher and a driving plate disposed on the top of the test head;
An electronic component testing apparatus further comprising a temperature control air blower for circulating a temperature-controlled gas inside the test chamber,
2. The electronic component test apparatus according to claim 1, wherein the temperature controller is divided into a plurality of portions along a flow direction of a gas circulating inside the test chamber, and has an individual temperature control portion capable of individually controlling the temperature.   The individual temperature control is performed so as to compensate for the temperature non-uniformity caused by the position of the electronic component along the flow direction of the temperature-controlled gas flowing along the plurality of electronic components and to test each electronic component at a uniform temperature state. 3. The electronic component testing apparatus according to claim 2, further comprising control means for individually controlling the amount of heat transferred from the portion to each electronic component.   The electronic component testing apparatus according to claim 1, wherein the plurality of electronic components are held by a test tray, and the test tray is conveyed between the pusher and the socket. The plurality of pushers are fixed to the lower end of the adapter,
The adapter is elastically held against the match plate;
The match plate is arranged on the test head so as to be exchangeable according to the type of electronic component,
The electronic component testing apparatus according to claim 1, wherein the drive plate is disposed on the match plate so as to be movable in the vertical direction.   The electronic component testing apparatus according to claim 1, wherein the temperature controller is a planar heating element.   The electronic component testing apparatus according to claim 1, wherein the electronic component is an IC chip.

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