JPH0269989A - Board arrangement structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate arrangement structure in which a plurality of substrates having the same function are arranged.

[Conventional technology]

An example of a device using a plurality of boards having the same function is a multi-line optical communication system using a plurality of optical fibers as information transmission lines as shown in FIG. In this optical communication system, a pair of optical transmitting modules 2, which convert electrical signals into optical signals and send them to an optical fiber 1, and an optical receiving module 3, which converts optical signals received from the optical fiber 1 into electrical signals, are used. A photoelectric conversion section is provided for each line. Optical receiver module 3
As shown in FIG. 3, the light receiving element 5 and the amplification IC
6 is mounted on a single insulating substrate 7 to form a hybrid IC board, which is housed in a box-shaped package 8. Here, the light receiving element 5 is a photoelectric conversion element such as a photodiode that converts an optical signal received from the optical fiber 1 into an electrical signal, and the amplification IC 6 is an integrated circuit for amplifying the output signal of the light receiving element 5. be. Furthermore, a predetermined wiring pattern is formed on the insulating substrate 7.

On the other hand, although not shown, the optical transmission module 2 is
A hybrid IC board is formed by mounting a light emitting element 10 and a driving IC II on a single insulating substrate, and this hybrid IC board is housed in a box-shaped bag to have a structure almost similar to an optical receiving module. . Note that light emitting element 1
0 is a photoelectric conversion element such as a light emitting diode that converts an electric signal into an optical signal, and driving IC1,1 is a light emitting element 10.
It is an integrated circuit for driving.

Therefore, the optical transmitting module and optical receiving module provided for each line each have a hybrid IC board having the same function, and the hybrid IC board provided for each line is packaged in an individual package. It was housed in 8. For this reason, a pair of packages is provided for each optical fiber, making the entire system large.

[Problem to be solved by the invention]

To solve this problem, it is conceivable to house individual hybrid IC boards having the same function in a single package. However, when hybrid IC boards having the same function are housed and arranged in a single package, simply arranging the boards close to each other as shown in FIG. 4 results in a lead portion that should be grounded. Lead parts to be connected to different external connection lines are close to each other, such as lead part L5 to which voltages of +5 and +5■ are to be applied.

It is extremely difficult to separately connect different external connection wires to such adjacent lead portions while maintaining mutual insulation.

Therefore, it is possible to create an appropriate distance between adjacent boards and separate the lead parts from each other to facilitate external connection.
It is not possible to downsize the device.

Therefore, in view of the above-mentioned circumstances, the present invention provides a board arrangement structure that allows easy external connection even when boards having the same function are arranged close to each other, and is suitable for downsizing the device. It is intended to.

[Means to solve the problem]

In order to achieve the above object, in the substrate arrangement structure according to the present invention, lead parts for external connection are arranged on the side,
Further, the present invention is characterized in that substrates in which the array patterns of the lead portions are mirror images of each other are alternately arranged in parallel, and the lead portions to be connected to the same external connection line are opposed to each other.

[Effect]

According to the above configuration, since the lead parts to be connected to the same external connection line face each other, there is no need to create a gap between the boards in order to insulate the facing lead parts. The substrates can be arranged in contact with each other and can be easily connected to the outside.

〔Example〕

Embodiments of the present invention will be described below with reference to FIG.

FIG. 1 shows an embodiment in which the present invention is applied to an array of reception hybrid IC boards 3 in a photoelectric conversion section of an optical communication system having multiple lines. Note that, in FIG. 1, the light receiving element mounted on the substrate 13, the amplifying IC for amplifying its output, etc. are omitted.

As shown, the hybrid IC boards 3 are arranged side by side with their sides abutting each other, and the sides of the board 13 are provided with lead portions for connection with the outside. 1st
As is clear from the figure, the lid part is formed into four semi-cylindrical parts cut out from the side of the substrate 13, and the conductive patterns formed on the adjacent substrates 3 are mirror images of each other. It is formed to be. Therefore, the arrangement of lead portions formed on adjacent substrates 13 are also mirror images of each other. In this way, when the conductive patterns are formed in a mirror image relationship with each other] 3, when the conductive patterns are formed by thick film printing, etc., the screen used for printing is used upside down, or the substrates are used in a reverse relationship with each other. By separately manufacturing and using screens, the conductive pattern can be easily obtained without reducing the degree of freedom in designing the conductive pattern.

The arrangement in which the mirror-image substrates obtained in this way most effectively achieve the object 1 of the present invention is as shown in the figure, in which the substrates are brought into contact with each other at the sides and alternately When arranged in this way, the semicircular recesses in which the lead portions are formed come together to form a cylindrical through hole. By inserting a single external connection wire into this through hole and soldering it,
It is possible to connect external connection lines to both mutually facing lead portions at the same time.

In addition, light receiving elements such as photodiodes, amplification ICs for amplifying their output signals, and other electronic components are mounted on substrates not shown or adjacent to each other so as to be mirror images of each other. Therefore, the hybrid IC substrates are adjacent to each other. All three have the same function. In this case, the structures of the light receiving elements, amplification ICs, etc. mounted on adjacent substrates are also mirror images of each other.

The hybrid IC boards arranged as described above are housed in a single package (not shown) to constitute a single optical receiver module for multiple lines.

In addition, as an example, the arrangement structure of hybrid IC boards for optical reception that constitutes an optical receiving module has been explained as an example, but the present invention is also applicable to the arrangement of hybrid IC boards that constitute an optical transmitting module. In addition, it is also applicable to an arrangement of general substrates having the same function.

〔Effect of the invention〕

As explained above, in the substrate arrangement structure according to the present invention, the lead parts for external connection are arranged on the side, and
Boards in which the arrangement patterns of the lead parts are mirror images of each other are arranged in parallel alternately, and the lead parts to be connected to the same external connection line are faced to each other. The lead portions to be connected face each other, and there is no need to insulate the opposing lead portions from each other, allowing for easy external connection.

Further, since there is no need to provide a gap between the substrates, it is possible to downsize the device to which the substrate arrangement structure according to the present invention is applied.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the substrate array structure according to the present invention, FIG. 2 is a block diagram showing a conventional optical communication system, and FIG. 3 is an optical FIG. 4 is a partially cutaway perspective view showing a receiving module partially cut away, and FIG. 4 is a perspective view showing an example of arrangement of a conventional hybrid IC board. 1... Optical fiber, 2... Optical transmission module, 3.
- Optical receiving module, 5... Light receiving element, 6... Amplifying IC 17... Insulating substrate, 8... P/S cage, 1
3...Noλ hybrid IC board, L...lead part. Patent applicant: Sumitomo Electric Industries, Ltd.

Claims (1)

[Claims] Boards in which lead parts for external connection are arranged on the sides and in which the arrangement patterns of the lead parts are mirror images of each other are arranged in parallel alternately, and the lead parts to be connected to the same external connection line are placed opposite each other. A substrate array structure characterized by: