JPH0969502A - Cleaning equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To clean the upper and lower surfaces of a work entirely and uniformly by means of a roll brush by pushing upper and lower roll brushes in the direction for pushing a work against a drive roller. SOLUTION: A semiconductor wafer 2 is pushed against a drive roller 6 and a rotational force is transmitted thereto. Consequently, the semiconductor wafer 2 is rotated by the drive roller 6 while resisting against the contact force with a pair of roll brushes 21, 22. More specifically, the semiconductor wafer 2 is rotated by the drive roller 6 when the upper and lower surfaces thereof are cleaned along the radial direction by means of the pair of roll brushes 21, 22. Consequently, the pair of vertical roll brushes 21, 22 slide evenly on the upper and lower surfaces of semiconductor wafer 2 with no limitation on the sliding part. Upper and lower surfaces of a work can thereby be cleaned uniformly with brush over the entire surface thereof even if the bristles are abraded unevenly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus for simultaneously cleaning the upper and lower surfaces of a disk-shaped work with a roll brush.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a semiconductor device, there is a process that requires a semiconductor wafer as a work to be cleaned with high cleanliness. As a method for cleaning such a work, there are a dip method in which a plurality of works are immersed in a cleaning liquid, and a single-wafer method in which a cleaning liquid is sprayed toward a substrate to be cleaned to wash one by one. In recent years, a single-wafer method which is advantageous in terms of cost while being able to obtain high cleanliness has been increasingly used.

A cleaning device using a roll brush is known as one of the single-wafer processes. This cleaning device linearly conveys a work in a predetermined direction by a conveying line, and during the conveyance, a plurality of roll brushes are attached to the front and back surfaces of the work while their bristles are in contact with each other. Are arranged so as to be orthogonal to the conveying direction of the work, and each roll brush is rotated while supplying the cleaning liquid to remove fine particles adhering to both front and back surfaces of the work by the roll brush. I am trying.

However, if the roll brush provided in the middle of the conveying line is brought into contact with the upper and lower surfaces of the work which is linearly conveyed by the conveying line, for example, the worn state of the brush bristles of the above-mentioned roll brush will be reduced. If the roll brushes are not uniform or the arrangement state (horizontal level) of the roll brushes is inclined, the pair of upper and lower roll brushes may not uniformly contact the entire upper and lower surfaces of the work. for that reason,
There is a case where the entire upper and lower surfaces of the work cannot be washed with a uniform cleanliness by a pair of roll brushes.

[0005]

As described above, the conventional cleaning device is arranged on the upper and lower surfaces of the work which is linearly carried by the carrying line, with the axis line orthogonal to the carrying direction of the work. Since the roll brush is brought into contact with the roll brush, if the bristles of the roll brush are worn in an uneven state or the arrangement is inclined, the upper and lower surfaces of the above work can be uniformly cleaned over the entire surface. Sometimes I couldn't wash it.

The present invention has been made in view of the above circumstances, and its purpose is to provide a cleaning device capable of uniformly cleaning the entire upper and lower surfaces of a work with a roll brush. Especially.

[0007]

In order to solve the above-mentioned problems, the invention of claim 1 is a cleaning device for simultaneously brush-cleaning the upper and lower surfaces of a disk-shaped work, and rotates with its axis extending vertically. A drive roller that is freely arranged and has an engaging portion that engages with the peripheral portion of the work, a first drive means that rotationally drives the drive roller, and the drive roller. -A lower roll brush in contact with the lower surface of the work and an upper roll brush in contact with the upper surface of which the peripheral portion is engaged with the engaging portion of the roller; the lower roll brush and the upper roll brush; Second drive means for rotationally driving the cylinder in the direction of being pressed against the drive roller.

According to a second aspect of the present invention, there is provided a cleaning device for simultaneously cleaning the upper and lower surfaces of a disk-shaped work with a brush.
A plurality of driving rollers are provided rotatably with their axis lined up and down along the periphery of the work, and are provided at one end of the work in a predetermined radial direction. And first driving means for rotating the driving roller.
The warper having a peripheral portion engaged with an engaging portion of the drive roller.
A lower roll brush in contact with the lower surface of the roll, an upper roll brush in contact with the upper surface, the lower roll brush and the upper roll.
A second drive means for rotating the brush in a direction in which the work is pressed against the drive roller; a second drive means rotatable along an up-down direction and a predetermined radial direction of the work; A regulating roll disposed at the other end for preventing the work from moving in the radial direction and coming off the engaging portion of the drive shaft;
It is characterized by having a la.

According to a third aspect of the present invention, in the first or second aspect of the invention, the upper roll brush is disposed closer to the drive roller than the lower roll brush. And

According to the first aspect of the present invention, the lower roll brush and the upper roll brush are rotationally driven by the second drive means, so that the work is pressed against the drive roller. Since the drive roller is rotationally driven by the first rotary drive means, the rotation is transmitted to the work. Therefore, since the work is brush-washed by the pair of upper and lower roll brushes while rotating, the upper and lower surfaces are uniformly washed over the entire surface.

According to the second aspect of the present invention, the work is cleaned by the pair of upper and lower roll brushes while being rotated by the drive roller, and is restricted from being displaced in the radial direction by the restriction roller. Therefore, it can be surely prevented from being disengaged from the engaging portion of the drive roller while being cleaned by the roll brush.

According to the third aspect of the present invention, since the upper roll brush presses the work against the engaging portion of the drive roller by the pressing force applied to the work, the drive roller is used. The work can be reliably rotated.

[0013]

An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 2, the cleaning apparatus of the present invention includes a cleaning tank 1. The cleaning tank 1 has an inlet 3 formed therein. An uncleaned semiconductor wafer 2 as a work is introduced from the inlet 3 by a transfer robot (not shown). An outlet 4 is formed on a side wall adjacent to the one side wall of the cleaning tank 1 so as to carry out the cleaned semiconductor wafer 2 by a transfer robot (not shown). The inlet 3 and the outlet 4 can be opened and closed by shutters 3a and 4a.

A unit case 5 is provided in the cleaning tank 1. Inside the unit case 5, three drive rollers 6 are disposed at one end in a direction orthogonal to the center line C in the introduction direction of the semiconductor wafer 2, and two drive rollers 6 are disposed at the other end.
A regulating roller 7 for books is provided. Each roller 6, 7
Are arranged rotatably with their axes perpendicular to each other, and at predetermined intervals along the circumferential direction of the semiconductor wafer 2.

The arrangement of the rollers 6 and 7 will be described in more detail. That is, as shown in FIG.
The inner bottom portion of the space 5 is separated by a partition plate 8, and a support plate 9 is disposed below the partition plate 8. The above driving row
The roller 6 and the regulating roller 7 pass through a through hole 8 a formed in the partition plate 8. The lower end of the drive roller 6 is rotatably supported by a first bearing body 11 erected on the support plate 9 so as not to slide in the thrust direction.

The lower end portion of the regulation roller 7 is supported by a second bearing body 12 so as to be rotatable and non-slidable in the thrust direction. The second bearing body 12 is slidably provided on the support plate 9 and is driven by a drive cylinder 13 in a direction in which it comes in contact with and separates from the drive roller 6, as shown by an arrow in FIG. It is like this.

A large diameter portion 6a is provided above the drive roller 6, and the upper surface of the large diameter portion 6a is the semiconductor wafer 2 described above.
Are engaged with each other. Engagement part 6
Although a is a horizontal surface, it may be an inclined surface that inclines toward the outside in the radial direction.

The upper portion of the regulation roller 7 is formed into a small diameter portion 7a, and the small diameter portion 7a contacts the peripheral portion of the semiconductor wafer 2 so that the semiconductor wafer 2 engaged and held by the engaging portion 15 is held. It is designed to regulate the movement in the radial direction.

A labyrinth structure 16 is formed at a portion where the drive roller 6 and the regulation roller 7 penetrate through the through hole 8a of the partition plate 8. Thereby, the cleaning liquid for cleaning the semiconductor wafer 2 is prevented from flowing out of the unit case through the through hole 8a.

The drive roller 6 is rotatably driven by the first drive mechanism 17. This first drive mechanism 17 has a motor 18 arranged below the support plate 9 as shown in FIG. A driving pulley 19a is fitted on a rotating shaft 18a of the motor 18. A belt 20 is tensioned between the drive pulley 19a and the three driven pulleys 19b fitted to the lower ends of the drive rollers 6 with tension adjusted by a tension roller (not shown). It is set up. Therefore, when the motor 18 operates, the respective drive rollers 6 can be driven to rotate via the belt 20.

In the unit case 5, a lower roll brush 21 and an upper roll brush 22 have axes O1 and O2 parallel to the center line C of the unit case 5 and orthogonal to the center line C thereof. It is arranged so as to be offset with respect to the direction in which it is formed. That is, the axis O1 of the lower roll brush 21 is located closer to the regulation roller 7 than the center line C, and the axis O2 of the upper roll brush 22 is biased toward the drive roller 6.

The lower roll brush 21 and the upper roll brush 22 are both rotationally driven by a second drive mechanism 20A and vertically driven by a vertical drive mechanism 20B.

That is, the roll shafts 21b and 22 provided with the brush bristles 21a and 22a of the roll brushes 21 and 22, respectively.
One end of b protrudes from one side wall of the unit case 5, as shown in FIG.
4 is provided.

The roller shafts 21b and 22b are rotatably supported by the bearing member 23 of each drive unit 25, and the rotating shaft (not shown) of the motor 24 is provided inside the bearing member 23. ) Is linked to. The lower roll brush 21 and the upper roll brush 22 are each provided with a motor 24.
As shown by arrows in FIG. 1, the semiconductor wafer 2 supplied between the roll brushes 21 and 22 is rotated in a direction in which the semiconductor wafer 2 is pressed against the outer peripheral surface of the drive roller 6 by its rotational force. It is supposed to be.

As shown in FIGS. 2 and 3, one end of an arm 26 is fixed to each of the pair of drive units 25. The other end of each arm 26 is introduced into a vertically long through hole 28 formed in one side wall of a housing 27 arranged near the unit case 5. A mounting plate 29 is attached to the other end of each arm 26, and a slider 31 is provided on each mounting plate 29. Each slider 3
Reference numeral 1 is slidably engaged with and held by a linear guide 32 provided along the vertical direction on the inner surface of the other side of the housing 27.

At the other end of the pair of arms 26, the nut body 3 is attached.
3 are provided. Each nut body 33 has a ball
Screw 34 is screwed. The upper and lower ends of each of the ball screws 34 are rotatably supported by bearings 35 provided on the upper and lower inner surfaces of the housing 27, respectively.

The lower end of the ball screw 34 projects from the lower end of the housing 27, and the driven pulley 36 is attached to the projecting end.
Is fitted. A motor 37 is provided in the vicinity of each driven pulley 36, and is provided between a driven pulley 38 fitted on a rotating shaft 37a of the motor 37 and the driven pulley 36. A belt 39 is stretched.

Therefore, when the motor 37 operates, the ball screw 34 is rotationally driven. Thereby,
Through the nut body 33 screwed to the ball screw 34,
The arm 26 is driven up and down along the linear guide 32. That is, if the lower roll brush 21 and the upper roll brush 22 can be driven in the vertical direction, the respective roll brushes 21 and 22 are brought into contact with the lower surface and the upper surface of the semiconductor wafer 2 with a predetermined contact force. be able to.

As mentioned above, the upper roll brush 2
2 is a driving roll for driving the axis O2 as compared with the lower roll brush 21.
It is biased to La 6 side. Therefore, the peripheral portion of the semiconductor wafer 2 located on the drive roller 6 side is pressed against the engaging portion 15 by the pressing force received from the upper roll brush 22.

Therefore, the semiconductor wafer 2 is rotated by the pair of roll brushes 21 and 22 and the upper roll brush 2 is rotated.
Since it is pressed against the drive roller 6 by the pressing force of 2, the rotational force of the drive roller 6 is transmitted to the semiconductor wafer 2.

As shown in FIG. 1, a pair of pipe-shaped lower nozzles 41 and upper nozzles 42 are arranged near the lower roll brush 21 and the upper roll brush 22, respectively. A cleaning liquid is supplied from the nozzles 41 and 42 when the upper and lower surfaces of the semiconductor wafer 2 are cleaned by the pair of brushes 21 and 22.

Next, the operation of cleaning the semiconductor wafer 2 by the cleaning apparatus having the above-mentioned structure will be described. First, the pair of regulating rollers 7 is retracted by the drive cylinder 13 in the direction away from the drive roller 6 as shown by the chain line in FIG. 4, the lower roll brush 21 is lowered, and the upper roll brush 22. Is raised to separate the roll brushes 21 and 22 from each other at a predetermined interval as shown by a chain line in FIG.

In that state, a pair of roll brushes 21, 22
In the meantime, the uncleaned semiconductor wafer 2 is supplied by a transfer robot (not shown) such that one end in the radial direction of the peripheral portion is engaged with the engaging portions 15 of the three drive rollers 6. After the supply, the lower roll brush 21 is raised and brought into contact with the lower surface of the semiconductor wafer 2, the semiconductor wafer 2 is supported substantially horizontally by the engaging portion 15, and the upper roll brush 22 is lowered to lower the semiconductor wafer. 2 is brought into contact with the upper surface at a predetermined pressure.

When the pair of roll brushes 21 and 22 are positioned at a predetermined height, the drive cylinder 13 is actuated to move the pair of regulating rollers 7 so that the small diameter portion 7a of the regulating roller 7 is located in the radial direction of the semiconductor wafer 2 or the like. It drives in the forward direction until it comes into contact with the outer peripheral surface of the end side, that is, the portion on the opposite side in the radial direction from the portion engaged with the engaging portion 15, or until they come close to each other with a slight gap.

After holding the semiconductor wafer 2 in this way, the transfer robot is retracted, and the lower roll brush 21, the upper roll brush 22 and the three-drive roller 6 are held.
To rotate.

By rotating the pair of roll brushes 21 and 22, the upper and lower surfaces of the semiconductor wafer 2 are brush-cleaned, and the rotational force of the roll brushes 21 and 22 causes one end side of the outer peripheral surface in the radial direction to move. It is pressed against the drive roller 6.

Further, since the upper roll brush 22 is biased closer to the drive roller 6 side than the lower roll brush 21, the semiconductor wafer 2 has a rotation moment in a direction indicated by an arrow M in FIG. Occurs. Therefore, the peripheral portion of the semiconductor wafer 2 on the drive roller 6 side is pressed against the engaging portion 15 by the moment M.

By pressing the semiconductor wafer 2 against the drive roller 6 in this manner, the rotational force of the drive roller 6 is transmitted to the semiconductor wafer 2. As a result, the semiconductor wafer 2 is rotated by the drive roller 6 against the contact force with the pair of roll brushes 21 and 22.

That is, the semiconductor wafer 2 is rotated by the drive roller 6 when the upper and lower surfaces of the semiconductor wafer 2 are brush-cleaned by the pair of roll brushes 21 and 22 along the radial direction. Therefore, the pair of upper and lower roll brushes 21, 22
In addition to slidingly contacting the upper and lower surfaces of the semiconductor wafer 2, the area of sliding contact is not restricted.

For example, a pair of roll brushes 21, 22
If the semiconductor wafer 2 is only conveyed in a straight line between them, only one end side in the axial direction of the roll brushes 21 and 22 is slidably contacted with one end side in the radial direction orthogonal to the conveying direction of the semiconductor wafer 2 and It means that only the other end side in the axial direction is in sliding contact with the other end side in the direction. In that case, each roll brush 2
If the wear state of the brush bristles 21a and 22a of Nos. 1 and 22 is non-uniform in the axial direction, or the axis of the roll shafts 21b and 22b is inclined with respect to the horizontal line, the above-mentioned condition is applied to the entire surface of the semiconductor wafer 2. Since the brush bristles 21a and 22a do not come into contact with each other with a uniform contact force, the cleaning state becomes uneven.

However, when not only the roll brushes 21 and 22 are rotated, but also the semiconductor wafer 2 is rotated, a pair of roll brushes 21 and 21 with respect to the semiconductor wafer 2 are rotated.
Since the contact portion of 22 is not restricted, that is, only a predetermined portion of the roll brushes 21 and 22 comes into contact with a predetermined portion of the semiconductor wafer 2, the brush bristles 21a and 22a of the roll brushes 21 and 22 are prevented. Even if the wear state is not uniform or the axis is inclined, the entire surface of the semiconductor wafer 2 can be cleaned almost uniformly.

Further, during cleaning, the semiconductor wafer 2 is restricted from being displaced in the radial direction by the regulation roller 7. Therefore, the peripheral portion of the semiconductor wafer 2 is prevented from being disengaged from the engaging portion 15 of the drive roller 6, so that the rotation of the drive roller 6 can be reliably transmitted to the semiconductor wafer 2. Therefore, the holding state of the semiconductor wafer 2 is not damaged.

In the above embodiment, the drive roller is set to 3
However, the number is not limited and may be two or less or four or more. Even if the number of drive rollers is one, the semiconductor wafer can be rotated and held by the lower roll brush, but the stability is improved when two or more drive rollers are used.

Further, although two regulation rollers are provided to regulate the radial displacement of the semiconductor wafer, the semiconductor wafer has a rotation force of a pair of roll brushes and a pressing force of the upper roll brush. Since it is pressed against the drive roller by means of, it is possible to wash the semiconductor wafer while holding it in a predetermined state without the regulation roller. Further, the work may be other than the semiconductor wafer, as long as it is disk-shaped and needs to be cleaned on the upper and lower surfaces.

[0045]

As described above, according to the first aspect of the present invention, when the upper and lower surfaces of the work are washed by the pair of roll brushes, the work is circumferentially moved by the drive roller. I made it rotate.

Therefore, unlike the case where the work is conveyed linearly between the pair of roll brushes, the contact area between the work and the brush is not restricted, and the brush bristles of the roll brush are not restricted. Even if the wear state is non-uniform or the roll brush arrangement is inclined, the upper and lower surfaces of the work can be uniformly brush-cleaned.

According to the second aspect of the present invention, since the work is rotated by the drive roller, not only the upper and lower surfaces of the work can be uniformly cleaned but also the work can be performed by the regulation roller. Is restricted from moving in the radial direction, the work is disengaged from the engagement part of the drive roller, the holding state becomes uncertain, and the rotation of the drive roller becomes difficult to be transmitted. Will disappear.

According to the third aspect of the present invention, since the upper roll brush is biased toward the drive roller side with respect to the lower roll brush, the work roll is driven by the pressing force of the upper roll brush. It is possible to surely engage the engagement portion of the la.

[Brief description of drawings]

FIG. 1 is a longitudinal sectional view of a unit case showing an entire configuration of an embodiment of the present invention.

FIG. 2 is a transverse sectional view of the cleaning tank.

FIG. 3 is a side view of a mechanism for vertically driving a pair of roll brushes.

FIG. 4 is a perspective view showing the arrangement of a driving roller, a driven roller, and a pair of roller brushes.

[Explanation of symbols]

2 ... Semiconductor wafer (work), 6 ... Driving roller, 7 ... Followed roller, 15 ... Engaging portion, 17 ... First driving mechanism (driving means), 18 ... First driving mechanism Motor, 21 ... Upper roll brush, 22 ... Lower roll brush, 22A ... Second drive mechanism, 24 ... Motor of second drive mechanism, 25 ... Second
Drive mechanism (driving means).

Claims (3)

[Claims] 1. A cleaning apparatus for brush-cleaning the upper and lower surfaces of a disk-shaped work at the same time, wherein the apparatus is rotatably disposed along an axis in a vertical direction and engages with a peripheral portion of the work. A driving roller having an engaging portion formed thereon, first driving means for driving the driving roller to rotate, and a wire having a peripheral portion engaged with the engaging portion of the driving roller.
A lower roll brush in contact with the lower surface of the roll and an upper roll brush in contact with the upper surface; and the lower roll brush and the upper roll brush.
And a second drive means for rotationally driving the cylinder in the direction in which it is pressed against the drive roller. 2. A cleaning apparatus for brush-cleaning the upper and lower surfaces of a disk-shaped work at the same time, wherein an engagement portion is formed for engaging the periphery of the work, and the work is rotatable along an axis in a vertical direction. A plurality of drive rollers disposed at one end of the work in a predetermined radial direction; first drive means for rotating the drive roller; and a drive roller. The above-mentioned wire in which the peripheral portion is engaged with the engaging portion of
A lower roll brush in contact with the lower surface of the roll and an upper roll brush in contact with the upper surface; and the lower roll brush and the upper roll brush.
Second drive means for rotationally driving the work in the direction in which the work is pressed against the drive roller; And a regulating roller for preventing the work from moving in the radial direction to be disengaged from the engaging portion of the drive shaft. 3. The upper roll brush is the lower roll.
The cleaning device according to claim 1 or 2, wherein the cleaning device is arranged closer to the drive roller than the rubrush.