JPS504979A - - Google Patents
Info
- Publication number
- JPS504979A JPS504979A JP47110309A JP11030972A JPS504979A JP S504979 A JPS504979 A JP S504979A JP 47110309 A JP47110309 A JP 47110309A JP 11030972 A JP11030972 A JP 11030972A JP S504979 A JPS504979 A JP S504979A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47110309A JPS504979A (en) | 1972-11-06 | 1972-11-06 | |
| JP47117689A JPS5135804B2 (en) | 1972-11-06 | 1972-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47110309A JPS504979A (en) | 1972-11-06 | 1972-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS504979A true JPS504979A (en) | 1975-01-20 |
Family
ID=14532427
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47110309A Pending JPS504979A (en) | 1972-11-06 | 1972-11-06 | |
| JP47117689A Expired JPS5135804B2 (en) | 1972-11-06 | 1972-11-25 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47117689A Expired JPS5135804B2 (en) | 1972-11-06 | 1972-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPS504979A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53147968A (en) * | 1977-05-30 | 1978-12-23 | Hitachi Ltd | Thick film circuit board |
| WO1991016726A1 (en) * | 1990-04-23 | 1991-10-31 | Nippon Mektron, Ltd. | Multilayer circuit board for mounting ic and manufacture thereof |
-
1972
- 1972-11-06 JP JP47110309A patent/JPS504979A/ja active Pending
- 1972-11-25 JP JP47117689A patent/JPS5135804B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53147968A (en) * | 1977-05-30 | 1978-12-23 | Hitachi Ltd | Thick film circuit board |
| WO1991016726A1 (en) * | 1990-04-23 | 1991-10-31 | Nippon Mektron, Ltd. | Multilayer circuit board for mounting ic and manufacture thereof |
| JPH045844A (en) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Multilayer circuit board for mounting ic and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4970572A (en) | 1974-07-08 |
| JPS5135804B2 (en) | 1976-10-05 |
