JPS5780724A - Positioning device - Google Patents

Positioning device

Info

Publication number
JPS5780724A
JPS5780724A JP55156575A JP15657580A JPS5780724A JP S5780724 A JPS5780724 A JP S5780724A JP 55156575 A JP55156575 A JP 55156575A JP 15657580 A JP15657580 A JP 15657580A JP S5780724 A JPS5780724 A JP S5780724A
Authority
JP
Japan
Prior art keywords
chip
base
point
coordinates
marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55156575A
Other languages
Japanese (ja)
Other versions
JPH0140492B2 (en
Inventor
Kiwao Nakazawa
Shoichi Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to JP55156575A priority Critical patent/JPS5780724A/en
Priority to US06/225,049 priority patent/US4385838A/en
Publication of JPS5780724A publication Critical patent/JPS5780724A/en
Publication of JPH0140492B2 publication Critical patent/JPH0140492B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Projection-Type Copiers In General (AREA)

Abstract

PURPOSE:To accurately perform the step and repeat in exposure by detecting the same marks Y on reticles as the marks Y at both right and left ends on a wafer, thereby removing the error due to the influences of a projecting lens and the error at the times of producing the leticles and matching them. CONSTITUTION:The array of each chip pattern of a wafer W2 is indicated by a orthogonal coordinates xsi-eta, and an origin P is determined at the crossing point of the extending lines of the marks Y and X 6 in the chip 11 at the center. A wafer placing base is moved along the orthogonal axes xy (parallel to the coordinate axes xsieta), the distance x0, y0 between the point P and the center of the lens 8 and the rotation delta are obtained, and the coordinates xsieta of the point P' equal to that on an arbitrary chip 13 is converted to the coordinates x1, y1 of the reference of the point P. The chip is indicated by addresses m, n and the magnitudes DELTAx, DELTAy, and is moved by nDELTAx, mDELTAy at the base for exposure. Further, a mark theta 4 is detected next to the mark Y 3 by an optical system WY, the base is moved elevationally up or down to focus it, the gradient alpha of the system WY, the movement L of the base, the elevational movement DELTAw are corrected by DELTAL=alpha.DELTAw. According to this structure, it can be exposed by extremely highly accurate matching.
JP55156575A 1980-01-19 1980-11-07 Positioning device Granted JPS5780724A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP55156575A JPS5780724A (en) 1980-11-07 1980-11-07 Positioning device
US06/225,049 US4385838A (en) 1980-01-19 1981-01-14 Alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55156575A JPS5780724A (en) 1980-11-07 1980-11-07 Positioning device

Publications (2)

Publication Number Publication Date
JPS5780724A true JPS5780724A (en) 1982-05-20
JPH0140492B2 JPH0140492B2 (en) 1989-08-29

Family

ID=15630753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55156575A Granted JPS5780724A (en) 1980-01-19 1980-11-07 Positioning device

Country Status (1)

Country Link
JP (1) JPS5780724A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58176934A (en) * 1982-04-09 1983-10-17 Oki Electric Ind Co Ltd Wafer alignment method
JPS5954225A (en) * 1982-09-21 1984-03-29 Hitachi Ltd Projection exposure method
JPS60130742A (en) * 1983-12-19 1985-07-12 Nippon Kogaku Kk <Nikon> Positioning device
JPS60175051A (en) * 1984-02-21 1985-09-09 Canon Inc Semiconductor printer
JPS60179745A (en) * 1984-02-28 1985-09-13 Nippon Kogaku Kk <Nikon> Method and mask for pattern transfer
JPS60245134A (en) * 1984-05-18 1985-12-04 Nippon Kogaku Kk <Nikon> Positioning device
JPS6254434A (en) * 1985-09-03 1987-03-10 Nippon Kogaku Kk <Nikon> Exposure device
JPS6266631A (en) * 1985-09-19 1987-03-26 Nippon Kogaku Kk <Nikon> Step and repeat exposure apparatus
JPS63132425A (en) * 1986-07-14 1988-06-04 Oki Electric Ind Co Ltd Correction of reduction aligner
JPH01161832A (en) * 1987-12-18 1989-06-26 Nikon Corp Projection aligner
JPH038319A (en) * 1990-02-14 1991-01-16 Nikon Corp Aligner of exposure device
JPH06283419A (en) * 1993-08-23 1994-10-07 Nikon Corp Positioning device
JPH07183213A (en) * 1994-09-30 1995-07-21 Hitachi Ltd Projection exposure method
US8064730B2 (en) 2003-09-22 2011-11-22 Asml Netherlands B.V. Device manufacturing method, orientation determination method and lithographic apparatus
US8646153B2 (en) 2010-06-07 2014-02-11 Mitsubishi Electric Corporation Hinge mechanism, and monitor opening and closing mechanism

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53105376A (en) * 1977-02-25 1978-09-13 Hitachi Ltd Positioning unit
JPS541553A (en) * 1977-06-07 1979-01-08 Toshiba Corp Group management control method of elevator
JPS5541739A (en) * 1978-09-20 1980-03-24 Hitachi Ltd Micro-projection type mask alignment device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53105376A (en) * 1977-02-25 1978-09-13 Hitachi Ltd Positioning unit
JPS541553A (en) * 1977-06-07 1979-01-08 Toshiba Corp Group management control method of elevator
JPS5541739A (en) * 1978-09-20 1980-03-24 Hitachi Ltd Micro-projection type mask alignment device

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58176934A (en) * 1982-04-09 1983-10-17 Oki Electric Ind Co Ltd Wafer alignment method
JPH0474854B2 (en) * 1982-09-21 1992-11-27
JPS5954225A (en) * 1982-09-21 1984-03-29 Hitachi Ltd Projection exposure method
JPS60130742A (en) * 1983-12-19 1985-07-12 Nippon Kogaku Kk <Nikon> Positioning device
JPH0616478B2 (en) * 1983-12-19 1994-03-02 株式会社ニコン Projection aligner alignment device
JPS60175051A (en) * 1984-02-21 1985-09-09 Canon Inc Semiconductor printer
JPH0542807B2 (en) * 1984-02-21 1993-06-29 Canon Kk
JPS60179745A (en) * 1984-02-28 1985-09-13 Nippon Kogaku Kk <Nikon> Method and mask for pattern transfer
JPH0630332B2 (en) * 1984-05-18 1994-04-20 株式会社ニコン Positioning device and substrate positioning method using the device
JPS60245134A (en) * 1984-05-18 1985-12-04 Nippon Kogaku Kk <Nikon> Positioning device
JPS6254434A (en) * 1985-09-03 1987-03-10 Nippon Kogaku Kk <Nikon> Exposure device
JPS6266631A (en) * 1985-09-19 1987-03-26 Nippon Kogaku Kk <Nikon> Step and repeat exposure apparatus
JPS63132425A (en) * 1986-07-14 1988-06-04 Oki Electric Ind Co Ltd Correction of reduction aligner
JPH01161832A (en) * 1987-12-18 1989-06-26 Nikon Corp Projection aligner
JPH038319A (en) * 1990-02-14 1991-01-16 Nikon Corp Aligner of exposure device
JPH0455523B2 (en) * 1990-02-14 1992-09-03 Nippon Kogaku Kk
JPH06283419A (en) * 1993-08-23 1994-10-07 Nikon Corp Positioning device
JPH07183213A (en) * 1994-09-30 1995-07-21 Hitachi Ltd Projection exposure method
US8064730B2 (en) 2003-09-22 2011-11-22 Asml Netherlands B.V. Device manufacturing method, orientation determination method and lithographic apparatus
US8646153B2 (en) 2010-06-07 2014-02-11 Mitsubishi Electric Corporation Hinge mechanism, and monitor opening and closing mechanism

Also Published As

Publication number Publication date
JPH0140492B2 (en) 1989-08-29

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