JPS6246930A - Apparatus for dividing glass plate - Google Patents
Apparatus for dividing glass plateInfo
- Publication number
- JPS6246930A JPS6246930A JP60184447A JP18444785A JPS6246930A JP S6246930 A JPS6246930 A JP S6246930A JP 60184447 A JP60184447 A JP 60184447A JP 18444785 A JP18444785 A JP 18444785A JP S6246930 A JPS6246930 A JP S6246930A
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- laser
- cutting
- laser beam
- work table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、予め、超硬ホイール等の切断カッターにより
、ガラス板に切すじを付け、このガラス板の切すじに、
レーザビームを照射して、熱応力による割目にュウ)を
進行させ、ガラス板を割断する装置に関する。さて、
一般に、ガラス板の切断において、切断カッターによる
切すじを付けたガラス板を切すじの通り、自動的に折り
割りする動作が最も難しい工程である。DETAILED DESCRIPTION OF THE INVENTION According to the present invention, cutting lines are formed on a glass plate in advance using a cutting cutter such as a carbide wheel, and on the cutting lines of the glass plate,
The present invention relates to a device for cleaving a glass plate by irradiating a laser beam to advance the cracks caused by thermal stress. Generally speaking, the most difficult process in cutting a glass plate is to automatically break the glass plate with cut lines along the cut lines using a cutting cutter.
特に、自動車のサイドウィンドガラスのように、凹凸に
異形変形したガラスにおいて、特に自動折り割りが難し
い。In particular, it is difficult to automatically break glass that is irregularly deformed into uneven shapes, such as side window glass for automobiles.
従来の機械による折り割りは、
(1)切切すじを付けたガラス板内側部を吸盤等により
、吸着側の状態で切すじから外側、つまり割り落し予定
部へ、ガスバーナ等による火炎を吹き付ける広範囲な加
熱による方法。また、(2切すじ外側の割り落し予定部
をハンドルチャックによりつかみ、曲げ折りする方法が
ある。Breaking using a conventional machine is as follows: (1) Using a suction cup, etc., on the inside of the glass plate with cutting lines, the flame from a gas burner, etc. is sprayed over a wide range from the cutting lines to the outside, that is, to the area to be split. Method by heating. Alternatively, there is a method of grasping the part to be split on the outside of the two-cut line with a handle chuck and bending it.
しかし、
これら従来の折り割り方法によれば、しばしば不完全な
折り割りが発生して、生産歩留りが悪く、また、しばし
ば切断エッチが斜めに反れ不良な切断面が生じる。However, according to these conventional folding methods, incomplete folding often occurs, resulting in a poor production yield, and often the cutting edges are warped diagonally, resulting in a defective cut surface.
そこで本発明は、これら従来の折り割り方法の欠点を除
去した折り割り方法を提供しようとしたものである。ま
た、
本発明は、自動車のサイドウィンドガラス等、自動車用
ガラスの自動切断、自動折り割りラインに適するガラス
板の割断装置を提供するにある。Therefore, the present invention aims to provide a folding method that eliminates the drawbacks of these conventional folding methods. Another object of the present invention is to provide a glass sheet cutting device suitable for automatic cutting of automobile glass such as side window glass of automobiles, and automatic folding line.
以下、本発明の一実施例を図面により説明する。An embodiment of the present invention will be described below with reference to the drawings.
第1図に本発明の一実施例のラインが示しである。1は
切断機、2はレーザ割断装置、3はコンベアで、切断機
1で切すじを付けたガラス板をレーザ割断装置2へ搬送
するもの、4は搬送ベルト。FIG. 1 shows the lines of one embodiment of the present invention. 1 is a cutting machine, 2 is a laser cutting device, 3 is a conveyor which conveys the glass plate with cutting lines made by the cutting machine 1 to the laser cutting device 2, and 4 is a conveyor belt.
さて、
切断機1は、従来のものと同じで、ガラス板5を固定す
るテーブル6と、このテーブル6上を移動してガラス板
に切すじ7を入れる切断カッター8と、この切断カッタ
ー8を保持し、この切断カッター8をテーブル6上でX
−Y軸方向に移動させるX−Yキャリッジ装[9とを主
に備える。Now, the cutting machine 1 is the same as the conventional one, and consists of a table 6 for fixing a glass plate 5, a cutting cutter 8 that moves on this table 6 and cuts a cutting line 7 on the glass plate, and a cutting machine 8. hold this cutting cutter 8 on the table 6
- It mainly includes an X-Y carriage device [9] that moves in the Y-axis direction.
この切断機1は、コンベア3により、次のレーザ割断装
置2と連結され、切断$111により切すじを付けたガ
ラス板5をレーザ割断装e2のワークテーブル10へ搬
送する。コンベア3は、普通に、上下に昇降する構造と
なり、切断[1で切断〈切すじ付け)の終ったガラス板
を持上げ状態で走行し、レーザ割断装置2へ、ガラス板
が搬送されると、走行停止で降下する。This cutting machine 1 is connected to the next laser cutting device 2 by a conveyor 3, and conveys the glass plate 5 with cut lines formed by cutting $111 to the work table 10 of the laser cutting device e2. The conveyor 3 normally has a structure that moves up and down, and travels while lifting the glass plate that has been cut (cut (streaked) in step 1), and when the glass plate is conveyed to the laser cutting device 2, It descends when it stops running.
さて、レーザ割断装置2は、ワークテーブル10へ搬入
されたガラス板5の切すじ7へ、レーザビームを照射し
てガラス板を割断する装置である。Now, the laser cutting device 2 is a device that cuts the glass plate by irradiating a laser beam onto the cutting lines 7 of the glass plate 5 carried into the work table 10.
この割断装置2は、第1図から第4図に示すように、ガ
ラス板を支持固定するワークテーブル10と、このワー
クテーブル10上を移動して切すじ7上に、又はその近
傍にレーザビームを照射するレーザ照射部11と、レー
ザー“を発生させるレーザー装置12を備える。As shown in FIGS. 1 to 4, this cutting device 2 includes a work table 10 that supports and fixes a glass plate, and a laser beam that moves on the work table 10 and directs the laser beam onto or near the cutting line 7. The device includes a laser irradiation unit 11 that irradiates a laser beam, and a laser device 12 that generates a laser beam.
このレーザ割断He2は、ガラス板5及び、ワークテー
ブル10を固定し、レーザー照射部11を移動させる方
式(第1図から第3図)のほか、もちろんレーザ照射部
11を固定し、ガラス板5及びワークテーブル10を移
動させる方式(第4図)としてもよい。This laser cutting He2 can be performed by fixing the glass plate 5 and the work table 10 and moving the laser irradiation unit 11 (see FIGS. 1 to 3), or of course by fixing the laser irradiation unit 11 and moving the laser irradiation unit 11. Alternatively, the work table 10 may be moved (see FIG. 4).
まず、レーザ照射部11を移動させる第1図から第3図
に示すレーザ割断装置から説明する。First, the laser cutting device shown in FIGS. 1 to 3, which moves the laser irradiation unit 11, will be explained.
レーザ装置12からレーザ照射部11ヘレーザ光をファ
イバケーブル13により導き、レーザ照射部11はX−
Yテーブル14に保持され、ワークテーブル10上に固
定のガラス板5の切すじ7上を走査し、この切すじ7へ
又は、切すじ7の近傍へパルスレーザを照射する。Laser light is guided from the laser device 12 to the laser irradiation section 11 through the fiber cable 13, and the laser irradiation section 11 is connected to the X-
A pulsed laser beam is scanned over the cut line 7 of the glass plate 5 held on the Y table 14 and fixed on the work table 10, and irradiates the cut line 7 or the vicinity of the cut line 7.
レーザ装置12は、炭酸ガスレーザ、YAGレーザ等を
使用し、また出力とし、普通には、20W〜2KWを使
用する。The laser device 12 uses a carbon dioxide laser, a YAG laser, etc., and has an output of usually 20W to 2KW.
また、レーザー照射により、発生する熱歪を照射内に限
定するため、上記レーザ装置はパルスレーザを使用する
。Further, in order to limit the thermal strain generated by laser irradiation within the irradiation area, the laser device uses a pulsed laser.
切すじ7内に熱歪を発生させ、垂直割目にュウ)を進行
させ、切すじ1に沿って割断させる。Thermal strain is generated in the cutting line 7 to cause the vertical cracks to advance and break along the cutting line 1.
第4図に示すレーザ割断装置の説明。Explanation of the laser cutting device shown in FIG. 4.
ガラス板をX−Y軸方向に移動するX−Yワークテーブ
ル10上に固定し、このワークテーブル10にレーザ装
置に連結のビームベンダ15を装置し、上記X−Yワー
クテーブル10を移動させて、このテーブル上のガラス
板5に付けた切すじ7へ、レーザビームを照射するよう
にしたものである。A glass plate is fixed on an X-Y work table 10 that moves in the X-Y axis direction, a beam bender 15 connected to a laser device is installed on this work table 10, and the X-Y work table 10 is moved. A laser beam is irradiated onto the cut lines 7 made on the glass plate 5 on the table.
もらろん、レーザ照射部11と上記ビームベンダ15と
は同じことである。Of course, the laser irradiation unit 11 and the beam bender 15 are the same.
上記のようになる本発明によると、
レーザビームは非常に小さいスポットに高温を集中でき
るため、極部的に熱歪を起こすことができる。これを切
りじ7上に起こさせることに、照射方向に向った割目に
ュウ)の進行が効果的に行われ、切すじに沿った良好な
割断が1qられる。According to the present invention as described above, since the laser beam can concentrate high temperature in a very small spot, it is possible to cause thermal distortion in a very localized area. By causing this to occur on the kerf 7, the progress of the slit in the irradiation direction is effectively carried out, and good cleavage along the kerf 1q is achieved.
【図面の簡単な説明】
図面は本発明の一実施例を示し、
第1図はライン平面図、第2図はレーザ割rS装置の正
面図、第3図は第2図に示すレーザ割断装置の平面図、
第4図は構造を変化したレーザー割断装置の正面図。
1・・・切断機、
2・・・レーザ割断装置、
3・・・コンベア、
5・・・ガラス板、
6・・・テーブル、
7・・・切すじ、
8・・・切断カッター、
9・・・X−Yキャリッヂ装置
10・・・ワークテーブル、
11・・・レーザ照射装置、
12・・・レーザ装置、
13・・・ファイバーケーブル、
14・・・X−Yテーブル、
15・・・ビームベンダ、[BRIEF DESCRIPTION OF THE DRAWINGS] The drawings show one embodiment of the present invention, FIG. 1 is a line plan view, FIG. 2 is a front view of the laser cutting rS device, and FIG. 3 is the laser cutting device shown in FIG. 2. plan view of
Figure 4 is a front view of a laser cutting device with a changed structure. DESCRIPTION OF SYMBOLS 1... Cutting machine, 2... Laser cutting device, 3... Conveyor, 5... Glass plate, 6... Table, 7... Cutting line, 8... Cutting cutter, 9. ...X-Y carriage device 10... Work table, 11... Laser irradiation device, 12... Laser device, 13... Fiber cable, 14... X-Y table, 15... Beam vendor,
Claims (1)
と、この切断機により切すじをつけたガラス板を割断す
るレーザ割断装置との組み合せからなり、このレーザ割
断装置は、ガラス板を固定するワークテーブルと、この
ワークテーブルの上方に装置したレーザ照射部を備え、
このワークテーブルとレーザ照射部とを、互に相対移動
させて、上記ガラス板の切すじ上へ、又はこの近傍にレ
ーザビームを照射するようにしたガラス板の割断装置。It consists of a cutting machine that creates cutting lines on a glass plate using a cutting cutter, and a laser cutting device that cuts the glass plate with the cutting lines made using this cutting machine. Equipped with a table and a laser irradiation unit installed above the work table,
A glass plate cutting device in which the work table and the laser irradiation unit are moved relative to each other to irradiate a laser beam onto or near the cutting line of the glass plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60184447A JPS6246930A (en) | 1985-08-21 | 1985-08-21 | Apparatus for dividing glass plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60184447A JPS6246930A (en) | 1985-08-21 | 1985-08-21 | Apparatus for dividing glass plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6246930A true JPS6246930A (en) | 1987-02-28 |
Family
ID=16153304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60184447A Pending JPS6246930A (en) | 1985-08-21 | 1985-08-21 | Apparatus for dividing glass plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6246930A (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5398857A (en) * | 1992-06-30 | 1995-03-21 | Fuji Xerox Co., Ltd. | Method and apparatus for cutting plate-shaped brittle material |
EP1439149A2 (en) * | 2003-01-17 | 2004-07-21 | Murakami Corporation | Method for manufacturing a glass blank |
US6894249B1 (en) * | 1999-11-20 | 2005-05-17 | Schott Spezialglas Gmbh | Method and device for cutting a flat workpiece that consists of a brittle material |
JP2005247603A (en) * | 2004-03-02 | 2005-09-15 | Okamoto Glass Co Ltd | Method for processing glass article or crystallized glass article and method for producing the article |
EP1591427A1 (en) * | 2004-04-30 | 2005-11-02 | BIESSE S.p.A. | A workstation for machining plates of glass, marble or the like with an automatic system for loading the plates |
US8110776B2 (en) * | 2007-11-23 | 2012-02-07 | Samsung Corning Precision Materials Co., Ltd. | Glass substrate cutting apparatus and glass substrate cutting system using the same |
WO2018085285A1 (en) * | 2016-11-01 | 2018-05-11 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
-
1985
- 1985-08-21 JP JP60184447A patent/JPS6246930A/en active Pending
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5465892A (en) * | 1992-06-30 | 1995-11-14 | Fuji Xerox Co., Ltd. | Method and apparatus for cutting plate-shaped brittle material |
US5551618A (en) * | 1992-06-30 | 1996-09-03 | Fuji Xerox Co., Ltd. | Apparatus for cutting plate-shaped brittle material |
US5398857A (en) * | 1992-06-30 | 1995-03-21 | Fuji Xerox Co., Ltd. | Method and apparatus for cutting plate-shaped brittle material |
US6894249B1 (en) * | 1999-11-20 | 2005-05-17 | Schott Spezialglas Gmbh | Method and device for cutting a flat workpiece that consists of a brittle material |
EP1439149A2 (en) * | 2003-01-17 | 2004-07-21 | Murakami Corporation | Method for manufacturing a glass blank |
EP1439149A3 (en) * | 2003-01-17 | 2006-08-02 | Murakami Corporation | Method for manufacturing a glass blank |
JP2005247603A (en) * | 2004-03-02 | 2005-09-15 | Okamoto Glass Co Ltd | Method for processing glass article or crystallized glass article and method for producing the article |
EP1591427A1 (en) * | 2004-04-30 | 2005-11-02 | BIESSE S.p.A. | A workstation for machining plates of glass, marble or the like with an automatic system for loading the plates |
US8110776B2 (en) * | 2007-11-23 | 2012-02-07 | Samsung Corning Precision Materials Co., Ltd. | Glass substrate cutting apparatus and glass substrate cutting system using the same |
US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
JP2020500808A (en) * | 2016-11-01 | 2020-01-16 | コーニング インコーポレイテッド | Glass plate moving device for cutting glass-like glass substrates based on laser |
CN109923051A (en) * | 2016-11-01 | 2019-06-21 | 康宁股份有限公司 | For carrying out the sheet glass transmission equipment of the machining based on laser to foliated glass substrate |
WO2018085285A1 (en) * | 2016-11-01 | 2018-05-11 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
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