NL190131C - SIGNAL PROCESSING SYSTEM CARD. - Google Patents

SIGNAL PROCESSING SYSTEM CARD.

Info

Publication number
NL190131C
NL190131C NL7614637A NL7614637A NL190131C NL 190131 C NL190131 C NL 190131C NL 7614637 A NL7614637 A NL 7614637A NL 7614637 A NL7614637 A NL 7614637A NL 190131 C NL190131 C NL 190131C
Authority
NL
Netherlands
Prior art keywords
signal processing
processing system
system card
card
signal
Prior art date
Application number
NL7614637A
Other languages
Dutch (nl)
Other versions
NL7614637A (en
NL190131B (en
Original Assignee
Bull Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull Sa filed Critical Bull Sa
Publication of NL7614637A publication Critical patent/NL7614637A/en
Publication of NL190131B publication Critical patent/NL190131B/en
Application granted granted Critical
Publication of NL190131C publication Critical patent/NL190131C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Audible And Visible Signals (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Handling Of Sheets (AREA)
NL7614637A 1975-12-31 1976-12-31 SIGNAL PROCESSING SYSTEM CARD. NL190131C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Publications (3)

Publication Number Publication Date
NL7614637A NL7614637A (en) 1977-07-04
NL190131B NL190131B (en) 1993-06-01
NL190131C true NL190131C (en) 1993-11-01

Family

ID=9164418

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7614637A NL190131C (en) 1975-12-31 1976-12-31 SIGNAL PROCESSING SYSTEM CARD.

Country Status (11)

Country Link
JP (2) JPS5283132A (en)
BR (1) BR7608831A (en)
CA (1) CA1083714A (en)
CH (1) CH619310A5 (en)
DE (1) DE2659573C2 (en)
ES (1) ES454567A1 (en)
FR (1) FR2337381A1 (en)
GB (1) GB1567784A (en)
IT (1) IT1124741B (en)
NL (1) NL190131C (en)
SE (1) SE415304B (en)

Families Citing this family (89)

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FR2379949A1 (en) * 1977-02-07 1978-09-01 Cii Honeywell Bull DEVICE FOR CONTROLLING A CONTACT INSERTED BETWEEN A TRANSMITTER CIRCUIT AND A RECEIVER CIRCUIT FOR THE TRANSMISSION OF ELECTRIC SIGNALS
FR2415378A1 (en) * 1978-01-24 1979-08-17 Moreno Roland METHOD AND DEVICE FOR ELECTRICALLY CONNECTING A REMOVABLE OBJECT, IN PARTICULAR A PORTABLE ELECTRONIC CARD
FR2439478A1 (en) * 1978-10-19 1980-05-16 Cii Honeywell Bull FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS
JPS5562591A (en) * 1978-10-30 1980-05-12 Fujitsu Ltd Memory card
DE2919649A1 (en) * 1979-05-16 1980-11-20 Bbc Brown Boveri & Cie SECURITY PAPER
DE2920012C2 (en) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Identification card with IC component and method for producing such an identification card
DE2926867C2 (en) * 1979-07-03 1986-01-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Circuit unit
FR2477303B1 (en) * 1980-02-28 1986-09-26 Dassault Electronique ELECTRONIC CARD READING DEVICE
FR2480008A1 (en) * 1980-04-04 1981-10-09 Flonic Sa IMPROVEMENTS TO MEMORY CARDS
DE3019207A1 (en) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC CHIP
DE3019206A1 (en) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München METHOD FOR CONTACTING GALVANIC CONTACTS OF AN ID CARD WITH EMBEDDED IC COMPONENT
FR2486685B1 (en) * 1980-07-09 1985-10-31 Labo Electronique Physique ELECTRONIC PAYMENT CARD AND REALIZATION METHOD
DE3051195C2 (en) * 1980-08-05 1997-08-28 Gao Ges Automation Org Package for integrated circuit incorporated in identity cards
DE3029939A1 (en) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION
DE3033881A1 (en) * 1980-09-09 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Free-standing circuit module - with modules and conductors on two sides connected to two groups of connector pins
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
JPS57123555U (en) * 1981-01-26 1982-08-02
JPS57123556U (en) * 1981-01-26 1982-08-02
NL191959B (en) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identification card with IC module and carrier element for an IC module.
DE3111516A1 (en) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Identity card with IC chip
DE3131216C3 (en) * 1981-04-14 1994-09-01 Gao Ges Automation Org ID card with IC module
JPS57209578A (en) * 1981-06-19 1982-12-22 Fujitsu Ltd Card
DE3130324A1 (en) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
FR2511544A1 (en) * 1981-08-14 1983-02-18 Dassault Electronique ELECTRONIC MODULE FOR AUTOMATIC TRANSACTION CARD AND CARD COMPRISING SUCH A MODULE
JPS5888892A (en) * 1981-11-20 1983-05-27 Hitachi Ltd Bubble memory cassette
JPS5892597A (en) * 1981-11-28 1983-06-01 大日本印刷株式会社 Manufacture of identification card
DE3151408C1 (en) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID card with an IC module
JPS58110474U (en) * 1982-01-22 1983-07-27 凸版印刷株式会社 card
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
FR2523335A1 (en) * 1982-03-10 1983-09-16 Flonic Sa Contact building method for card-borne integrated circuits - uses conductive pad welded onto foil used as contact to integrated circuit, creating more durable contact
JPS58187858U (en) * 1982-06-08 1983-12-13 セイコーインスツルメンツ株式会社 IC card
JPS58221478A (en) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ic card
JPS5944067U (en) * 1982-09-16 1984-03-23 大日本印刷株式会社 IC card
DE3235650A1 (en) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg INFORMATION CARD AND METHOD FOR THEIR PRODUCTION
JPS5958949U (en) * 1982-10-08 1984-04-17 凸版印刷株式会社 Card with built-in IC, etc.
DE3313414A1 (en) * 1983-04-13 1984-10-18 Hubert 8958 Füssen Schweiger Use of a programmable read-only memory chip, integrated in an identity card, for storing information for a microprocessor-controlled reader
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
FR2555780B1 (en) * 1983-11-29 1986-04-11 Flonic Sa METHOD FOR MANUFACTURING MEMORY CARDS AND CARDS OBTAINED ACCORDING TO THIS PROCESS
FR2548409B1 (en) * 1983-06-29 1985-11-15 Sligos PROCESS FOR THE MANUFACTURE OF MEMORY CARDS, INSTALLATION AND MEMORY CARDS OBTAINED
FR2548857B1 (en) * 1983-07-04 1987-11-27 Cortaillod Cables Sa PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD
JPS6084686A (en) * 1983-10-17 1985-05-14 Toshiba Corp Recording system of information recording medium
DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
FR2554275B1 (en) * 1983-10-26 1986-09-05 Radiotechnique Compelec CONNECTION DEVICE FOR A POWER SEMICONDUCTOR
JPS59108580A (en) * 1983-11-17 1984-06-23 株式会社ソフイア Infarmation recording card of card type pinball machine
JPS59108581A (en) * 1983-11-17 1984-06-23 株式会社ソフイア Card type pinball game
FR2557715B1 (en) * 1983-12-30 1987-07-17 Bull Sa METHOD AND SYSTEM FOR CONFIDENTIALLY PROCESSING INFORMATION STORED ON AN OPTICALLY READING RECORD OF A PORTABLE MEDIUM
JPS60126864U (en) * 1984-01-30 1985-08-26 共同印刷株式会社 IC card
JPS60126863U (en) * 1984-01-30 1985-08-26 共同印刷株式会社 IC card
FR2575566B1 (en) * 1984-12-28 1990-06-22 Bull Sa METHOD FOR CUSTOMIZING PORTABLE MEDIA SUCH AS CARDS
FR2581480A1 (en) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa ELECTRONIC UNIT, IN PARTICULAR FOR A MICROCIRCUIT BOARD AND CARD COMPRISING SUCH A UNIT
JPS61248184A (en) * 1985-04-26 1986-11-05 Kyodo Printing Co Ltd Ic module
JPS61188871U (en) * 1985-05-16 1986-11-25
FR2584235B1 (en) * 1985-06-26 1988-04-22 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
FR2584236B1 (en) * 1985-06-26 1988-04-29 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
FR2584862B1 (en) * 1985-07-12 1988-05-20 Eurotechnique Sa PROCESS FOR THE CONTINUOUS MANUFACTURE OF MICROMODULES FOR CARDS CONTAINING COMPONENTS, CONTINUOUS BAND OF MICROMODULES AND MICROMODULES CARRIED OUT BY SUCH A PROCESS
DE3689094T2 (en) * 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC card.
FR2590051B1 (en) * 1985-11-08 1991-05-17 Eurotechnique Sa CARD COMPRISING A COMPONENT AND MICROMODULE WITH SIDING CONTACTS
FR2590052B1 (en) * 1985-11-08 1991-03-01 Eurotechnique Sa METHOD FOR RECYCLING A CARD COMPRISING A COMPONENT, CARD PROVIDED FOR RECYCLE
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
FR2599165A1 (en) * 1986-05-21 1987-11-27 Michot Gerard OBJECT ASSOCIATED WITH ELECTRONIC ELEMENT AND METHOD OF OBTAINING
JPS63185688A (en) * 1987-01-29 1988-08-01 大日本印刷株式会社 Manufacture of ic card
DE3723547C2 (en) * 1987-07-16 1996-09-26 Gao Ges Automation Org Carrier element for installation in ID cards
US4931623A (en) * 1987-11-14 1990-06-05 Kabushiki Kaisha Toshiba Portable storage medium
JPH01152098A (en) * 1988-09-08 1989-06-14 Dainippon Printing Co Ltd Card base material for ic card
DE3924439A1 (en) * 1989-07-24 1991-04-18 Edgar Schneider CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS
JP2543235B2 (en) * 1990-06-29 1996-10-16 松下電器産業株式会社 IC card adapter
DE9100665U1 (en) * 1991-01-21 1992-07-16 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Carrier element for integrated semiconductor circuits, especially for installation in chip cards
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DE4209184C1 (en) * 1992-03-21 1993-05-19 Orga Kartensysteme Gmbh, 6072 Dreieich, De
JPH07164787A (en) * 1992-03-26 1995-06-27 Dainippon Printing Co Ltd Manufacture of ic card
US5497140A (en) * 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
DE4345610B4 (en) * 1992-06-17 2013-01-03 Micron Technology Inc. Method for producing a radio-frequency identification device (HFID)
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
USRE42773E1 (en) 1992-06-17 2011-10-04 Round Rock Research, Llc Method of manufacturing an enclosed transceiver
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
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US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
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US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
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Family Cites Families (4)

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US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
FR2299724A1 (en) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind IMPROVEMENTS TO PACKAGING MEDIA FOR INTEGRATED CIRCUIT BOARDS
FR2311406A1 (en) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS
JPS591463B2 (en) * 1976-07-01 1984-01-12 鐘淵化学工業株式会社 Foaming composition

Also Published As

Publication number Publication date
BR7608831A (en) 1977-10-25
CH619310A5 (en) 1980-09-15
JPS5283132A (en) 1977-07-11
DE2659573C2 (en) 1986-02-27
FR2337381B1 (en) 1979-07-06
FR2337381A1 (en) 1977-07-29
IT1124741B (en) 1986-05-14
GB1567784A (en) 1980-05-21
ES454567A1 (en) 1977-12-16
NL7614637A (en) 1977-07-04
JPS6313840B2 (en) 1988-03-28
NL190131B (en) 1993-06-01
JPS625894A (en) 1987-01-12
JPS6130315B2 (en) 1986-07-12
DE2659573A1 (en) 1977-07-14
CA1083714A (en) 1980-08-12
SE7614622L (en) 1977-07-02
SE415304B (en) 1980-09-22

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