SE322579B - - Google Patents
Info
- Publication number
- SE322579B SE322579B SE17363/67A SE1736367A SE322579B SE 322579 B SE322579 B SE 322579B SE 17363/67 A SE17363/67 A SE 17363/67A SE 1736367 A SE1736367 A SE 1736367A SE 322579 B SE322579 B SE 322579B
- Authority
- SE
- Sweden
- Prior art keywords
- region
- contact
- gate
- main region
- anode
- Prior art date
Links
- 239000004411 aluminium Substances 0.000 abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- KAPYVWKEUSXLKC-UHFFFAOYSA-N [Sb].[Au] Chemical compound [Sb].[Au] KAPYVWKEUSXLKC-UHFFFAOYSA-N 0.000 abstract 1
- 239000005030 aluminium foil Substances 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 230000001960 triggered effect Effects 0.000 abstract 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 239000010937 tungsten Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D18/00—Thyristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60283766A | 1966-12-19 | 1966-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE322579B true SE322579B (xx) | 1970-04-13 |
Family
ID=24412992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE17363/67A SE322579B (xx) | 1966-12-19 | 1967-12-18 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3489962A (xx) |
BE (1) | BE708190A (xx) |
CH (1) | CH478460A (xx) |
ES (1) | ES348224A1 (xx) |
GB (1) | GB1211745A (xx) |
SE (1) | SE322579B (xx) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3577042A (en) * | 1967-06-19 | 1971-05-04 | Int Rectifier Corp | Gate connection for controlled rectifiers |
CH460957A (de) * | 1967-08-03 | 1968-08-15 | Bbc Brown Boveri & Cie | Schaltungsanordnung mit mehreren Halbleiterelementen |
SE320729B (xx) * | 1968-06-05 | 1970-02-16 | Asea Ab | |
JPS508315B1 (xx) * | 1970-02-20 | 1975-04-03 | ||
US3740584A (en) * | 1971-06-08 | 1973-06-19 | Gen Electric | High arrangement frequency scr gating |
US3967308A (en) * | 1971-10-01 | 1976-06-29 | Hitachi, Ltd. | Semiconductor controlled rectifier |
US3914783A (en) * | 1971-10-01 | 1975-10-21 | Hitachi Ltd | Multi-layer semiconductor device |
DE2237086C3 (de) * | 1972-07-28 | 1979-01-18 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Steuerbares Halbleitergleichrichterbauelement |
US4028721A (en) * | 1973-08-01 | 1977-06-07 | Hitachi, Ltd. | Semiconductor controlled rectifier device |
US4063278A (en) * | 1975-01-06 | 1977-12-13 | Hutson Jearld L | Semiconductor switch having sensitive gate characteristics at high temperatures |
DE2538549C2 (de) * | 1975-08-29 | 1985-06-13 | Siemens AG, 1000 Berlin und 8000 München | Mit Licht steuerbarer Thyristor |
US4047219A (en) * | 1975-11-03 | 1977-09-06 | General Electric Company | Radiation sensitive thyristor structure with isolated detector |
US4092703A (en) * | 1977-03-15 | 1978-05-30 | Kabushiki Kaisha Meidensha | Gate controlled semiconductor device |
US4219833A (en) * | 1978-05-22 | 1980-08-26 | Electric Power Research Institute, Inc. | Multigate light fired thyristor and method |
US4207583A (en) * | 1978-07-27 | 1980-06-10 | Electric Power Research Institute, Inc. | Multiple gated light fired thyristor with non-critical light pipe coupling |
US4305084A (en) * | 1979-11-16 | 1981-12-08 | General Electric Company | Semiconductor switching device capable of turn-on only at low applied voltages using self pinch-off means |
JPS6188563A (ja) * | 1984-10-08 | 1986-05-06 | Toshiba Corp | 半導体スイツチ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3044147A (en) * | 1959-04-21 | 1962-07-17 | Pacific Semiconductors Inc | Semiconductor technology method of contacting a body |
US3176147A (en) * | 1959-11-17 | 1965-03-30 | Ibm | Parallel connected two-terminal semiconductor devices of different negative resistance characteristics |
NL265766A (xx) * | 1960-06-10 | |||
FR1324783A (fr) * | 1961-06-05 | 1963-04-19 | Gen Electric | Perfectionnements aux dispositifs à semi-conducteurs et procédés de leur fabrication |
US3296502A (en) * | 1962-11-28 | 1967-01-03 | Gen Instrument Corp | Variable photosensitive semiconductor device having a graduatingly different operable surface area |
US3391310A (en) * | 1964-01-13 | 1968-07-02 | Gen Electric | Semiconductor switch |
US3328584A (en) * | 1964-01-17 | 1967-06-27 | Int Rectifier Corp | Five-layer light switch |
GB1095469A (xx) * | 1964-03-21 | |||
US3401320A (en) * | 1966-05-12 | 1968-09-10 | Int Rectifier Corp | Positive pulse turn-off controlled rectifier |
-
1966
- 1966-12-19 US US602837A patent/US3489962A/en not_active Expired - Lifetime
-
1967
- 1967-11-27 GB GB53971/67A patent/GB1211745A/en not_active Expired
- 1967-12-13 ES ES348224A patent/ES348224A1/es not_active Expired
- 1967-12-14 CH CH1751467A patent/CH478460A/de not_active IP Right Cessation
- 1967-12-18 SE SE17363/67A patent/SE322579B/xx unknown
- 1967-12-19 BE BE708190D patent/BE708190A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
ES348224A1 (es) | 1969-03-01 |
US3489962A (en) | 1970-01-13 |
GB1211745A (en) | 1970-11-11 |
BE708190A (xx) | 1968-06-19 |
CH478460A (de) | 1969-09-15 |
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