SE7804535L - TENN-NICKEL ALLOY - Google Patents

TENN-NICKEL ALLOY

Info

Publication number
SE7804535L
SE7804535L SE7804535A SE7804535A SE7804535L SE 7804535 L SE7804535 L SE 7804535L SE 7804535 A SE7804535 A SE 7804535A SE 7804535 A SE7804535 A SE 7804535A SE 7804535 L SE7804535 L SE 7804535L
Authority
SE
Sweden
Prior art keywords
tenn
nickel alloy
nickel
alloy
Prior art date
Application number
SE7804535A
Other languages
Swedish (sv)
Inventor
M H Pollack
Original Assignee
Nasglo Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nasglo Int Corp filed Critical Nasglo Int Corp
Publication of SE7804535L publication Critical patent/SE7804535L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7804535A 1973-08-20 1978-04-20 TENN-NICKEL ALLOY SE7804535L (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38957973A 1973-08-20 1973-08-20
US48227974A 1974-06-24 1974-06-24

Publications (1)

Publication Number Publication Date
SE7804535L true SE7804535L (en) 1978-04-20

Family

ID=27012758

Family Applications (2)

Application Number Title Priority Date Filing Date
SE7410531A SE413910B (en) 1973-08-20 1974-08-19 SET AND BATH FOR ELECTROLYTIC DEPOSITION OF A ALLOY OF NICKEL AND TIN
SE7804535A SE7804535L (en) 1973-08-20 1978-04-20 TENN-NICKEL ALLOY

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE7410531A SE413910B (en) 1973-08-20 1974-08-19 SET AND BATH FOR ELECTROLYTIC DEPOSITION OF A ALLOY OF NICKEL AND TIN

Country Status (10)

Country Link
JP (1) JPS5072838A (en)
CA (1) CA1045577A (en)
CH (1) CH592167A5 (en)
DE (1) DE2439656C2 (en)
FR (1) FR2241632B1 (en)
GB (1) GB1484575A (en)
IL (1) IL45382A (en)
IT (1) IT1057888B (en)
NL (1) NL7411119A (en)
SE (2) SE413910B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189310C (en) * 1984-05-18 1993-03-01 Toyo Kohan Co Ltd COATED STEEL SHEET WITH IMPROVED WELDABILITY AND METHOD FOR MANUFACTURING.
EP2233611A1 (en) * 2009-03-24 2010-09-29 MTV Metallveredlung GmbH & Co. KG Layer system with improved corrosion resistance
WO2016098669A1 (en) * 2014-12-15 2016-06-23 千住金属工業株式会社 Solder alloy for plating and electronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2141940C2 (en) * 1971-08-21 1977-02-10 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten GALVANIC BATH FOR DEPOSITING TIN / NICKEL, TIN / COBALT OR TIN / NICKEL / COBALT COATINGS AND THE RELATED GALVANIZING PROCESS

Also Published As

Publication number Publication date
FR2241632B1 (en) 1979-08-03
NL7411119A (en) 1975-02-24
DE2439656A1 (en) 1975-03-06
JPS5072838A (en) 1975-06-16
SE413910B (en) 1980-06-30
DE2439656C2 (en) 1983-06-16
GB1484575A (en) 1977-09-01
IL45382A0 (en) 1974-11-29
CA1045577A (en) 1979-01-02
CH592167A5 (en) 1977-10-14
IT1057888B (en) 1982-03-30
FR2241632A1 (en) 1975-03-21
IL45382A (en) 1976-09-30
SE7410531L (en) 1975-02-21

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