TW273034B - - Google Patents

Info

Publication number: TW273034B
Authority: TW; Taiwan

Application number

TW084105037A

Original Assignee

Hitachi Seisakusyo Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-05-20

Filing date

1995-05-20

Publication date

1996-03-21

1995-05-20 Application filed by Hitachi Seisakusyo Kk filed Critical Hitachi Seisakusyo Kk

1996-03-21 Application granted granted Critical

1996-03-21 Publication of TW273034B publication Critical patent/TW273034B/zh

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Physical Vapour Deposition (AREA)

TW084105037A 1994-05-20 1995-05-20 TW273034B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP6106444A JPH07321176A (ja)	1994-05-20	1994-05-20	基板搬送方法

Publications (1)

Publication Number	Publication Date
TW273034B true TW273034B (zh)	1996-03-21

Family

ID=14433799

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW084105037A TW273034B (zh)	1994-05-20	1995-05-20

Country Status (5)

Country	Link
US (1)	US5697751A (zh)
EP (1)	EP0683506A1 (zh)
JP (1)	JPH07321176A (zh)
KR (1)	KR100283295B1 (zh)
TW (1)	TW273034B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3208029B2 (ja) *	1994-11-22	2001-09-10	株式会社巴川製紙所	静電チャック装置およびその作製方法
US5975740A (en)	1996-05-28	1999-11-02	Applied Materials, Inc.	Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6457929B2 (en)	1998-11-03	2002-10-01	Seh America, Inc.	Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
JP2001155980A (ja) *	1999-11-25	2001-06-08	Nec Corp	検査補修システム、製品製造システム、部材検査装置、データ処理装置、部材補修装置、情報記憶媒体
US7059475B2 (en)	2001-10-04	2006-06-13	Entegris, Inc.	System for cushioning wafer in wafer carrier
KR20040110391A (ko) *	2003-06-19	2004-12-31	삼성전자주식회사	기판 처리 장치
JP4766156B2 (ja) *	2009-06-11	2011-09-07	日新イオン機器株式会社	イオン注入装置
JP5750328B2 (ja) *	2011-07-20	2015-07-22	株式会社ニューフレアテクノロジー	気相成長方法及び気相成長装置
JP2016539489A (ja) *	2013-09-20	2016-12-15	アプライドマテリアルズインコーポレイテッドＡｐｐｌｉｅｄＭａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ	集積静電チャックを備えた基板キャリア
US10199256B2 (en)	2013-09-28	2019-02-05	Applied Materials, Inc.	Methods and systems for improved mask processing
US20170194181A1 (en) *	2016-01-04	2017-07-06	Micron Technology, Inc.	Overhead traveling vehicle, transportation system with the same, and method of operating the same
US11121019B2 (en)	2018-06-19	2021-09-14	Kla Corporation	Slotted electrostatic chuck

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4743570A (en)	1979-12-21	1988-05-10	Varian Associates, Inc.	Method of thermal treatment of a wafer in an evacuated environment
JPS58123734A (ja) *	1982-01-18	1983-07-23	Fujitsu Ltd	ワイヤボンデイング装置
US4449885A (en) *	1982-05-24	1984-05-22	Varian Associates, Inc.	Wafer transfer system
JPS5929435A (ja) *	1982-08-11	1984-02-16	Hitachi Ltd	試料支持装置
JPS59195839A (ja) *	1983-04-21	1984-11-07	Toshiba Corp	半導体ウエハ−の自動移し替え装置
JPS6060060A (ja)	1983-09-12	1985-04-06	株式会社日立製作所	鉄道車両の扉開閉装置
JPS61140148A (ja) *	1984-12-12	1986-06-27	Nanbu Denki Seisakusho:Kk	物品の移載装置
DE3681799D1 (de) *	1985-01-22	1991-11-14	Applied Materials Inc	Halbleiter-bearbeitungseinrichtung.
JPS62274739A (ja) *	1986-05-16	1987-11-28	バリアン・アソシエイツ・インコ−ポレイテッド	ウエファ方向づけ装置および方法
DE3702775A1 (de) *	1987-01-30	1988-08-11	Leybold Ag	Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
JPH01161846A (ja) *	1987-12-18	1989-06-26	Hitachi Ltd	移載装置
JP2622978B2 (ja) *	1988-01-14	1997-06-25	浜松ホトニクス株式会社	空間光変調装置およびそれを用いた画像再構成装置
JP2528962B2 (ja)	1989-02-27	1996-08-28	株式会社日立製作所	試料処理方法及び装置
US4962441A (en) *	1989-04-10	1990-10-09	Applied Materials, Inc.	Isolated electrostatic wafer blade clamp
JPH02278721A (ja) *	1989-04-19	1990-11-15	Nec Corp	ボート搬送装置
JPH03106721A (ja) *	1989-09-21	1991-05-07	Mitsubishi Electric Corp	縦型ウエーハ搬送装置
JPH03187240A (ja) *	1989-12-18	1991-08-15	Nikon Corp	静電チヤツク
US4999507A (en) *	1990-05-10	1991-03-12	At&T Bell Laboratories	Apparatus comprising an electrostatic wafer cassette
JP2884522B2 (ja) *	1990-06-29	1999-04-19	沖電気工業株式会社	ウエハ移し換え装置
JP3064409B2 (ja) *	1990-11-30	2000-07-12	株式会社日立製作所	保持装置およびそれを用いた半導体製造装置
JPH05190653A (ja) *	1992-01-08	1993-07-30	Hitachi Ltd	試料保持装置
US5315473A (en) *	1992-01-21	1994-05-24	Applied Materials, Inc.	Isolated electrostatic chuck and excitation method

1994
- 1994-05-20 JP JP6106444A patent/JPH07321176A/ja active Pending
1995
- 1995-05-19 EP EP95107734A patent/EP0683506A1/en not_active Withdrawn
- 1995-05-20 TW TW084105037A patent/TW273034B/zh active
- 1995-05-20 KR KR1019950012888A patent/KR100283295B1/ko not_active IP Right Cessation
- 1995-05-22 US US08/445,863 patent/US5697751A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
KR950034663A (ko)	1995-12-28
KR100283295B1 (ko)	2001-04-02
EP0683506A1 (en)	1995-11-22
US5697751A (en)	1997-12-16
JPH07321176A (ja)	1995-12-08

Publication	Publication Date	Title
DK105996A (zh)	1996-11-14
DK0677466T3 (zh)	1997-02-24
BRPI9507160A (zh)	1997-09-09
EP0669187A3 (zh)	1995-10-11
EP0665261A3 (zh)	1995-09-13
TW273034B (zh)	1996-03-21
DE69535748D1 (zh)	2008-06-19
DK0685247T3 (zh)	1997-02-24
BY1704C1 (zh)	1997-09-30
ECSDI940213S (zh)	1995-02-27
ECSDI940198S (zh)	1994-11-16
CU22450A3 (zh)	1996-10-05
ECSMU940035U (zh)	1994-11-16
ECSMU940033U (zh)	1994-09-16
ECSDI940203S (zh)	1995-01-16
ECSDI940180S (zh)	1994-07-19
ECSDI940183S (zh)	1994-07-19
ECSDI940184S (zh)	1994-07-19
ECSDI940190S (zh)	1994-11-16
ECSDI940192S (zh)	1994-11-16
ECSDI940193S (zh)	1994-11-16
ECSDI940194S (zh)	1994-11-16
EP0665582A3 (zh)	1995-08-16
EP0666636A3 (zh)	1995-09-13
EP0668514A3 (zh)	1995-09-27