TW312891B - - Google Patents

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Publication number
TW312891B
TW312891B TW084112896A TW84112896A TW312891B TW 312891 B TW312891 B TW 312891B TW 084112896 A TW084112896 A TW 084112896A TW 84112896 A TW84112896 A TW 84112896A TW 312891 B TW312891 B TW 312891B
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Taiwan
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contact
conductive
conductive particles
electrical
patent application
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TW084112896A
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English (en)
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Augat Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/06Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/60Auxiliary means structurally associated with the switch for cleaning or lubricating contact-making surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/023Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1168Graft-polymerization
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/1344Spraying small metal particles or droplets of molten metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/931Conductive coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

經濟部中央標準局員工消費合作社印装 A7 __B7 7五、發明説明(1 ) · 發明領城 本發明係關於在導電性表面之間提供電氣連接的電氣接 點。 發明背景 電氣接點表面經常遭遇到由接點表面上之氧化物形成, 或者由聚積於接點表面上之塵埃、碎屑或其他冷染物所造 成的污染。結果,氡化物或其他污染物阻 面間的良好電氣接觸,造成接觸阻抗的必然増:;及增加: 熱量的連帶產生。因而形成之不良電氣連接在諸如積體電 路構裝或其他電子構裝所使用的小面積電氣接點中,於其 處要將,很多的電氣引線或接點區域提供於相當小的區域中 ,尤其成爲問題。 發明摘述 本發明包含在接點表面上具有固相均質之導電性顆粒的 電氣接點。顆粒具有比接點材料更大的硬度以造成接點材 料變形並導致氧化物或其他污染層的破裂或破壞,或者穿 透污染層。以造成顆粒直接地接合於接點表面的技術將顆 粒施加至接點表面,通常成爲一層顆粒層》這種顆粒施加 的較佳技術·疋特高速氧巧氣.喷覆(hypervej|〇city 〇xy spraymg ’下文簡稱只兄〇1〇或電漿嘖覆,藉其將顆粒埋置 於接K表面上以在施加顆粒和接點材料之間提供幾乎永久 性的粒間接合。 於其上提供顆粒層的接點表面可以是單層或多層電氣接 觸結構的最外層表面。接點表面可以是自身提供於支撑結 -1! 1—-i III·二二—-1 n^— - —II -- -- - ·- (請先閱讀背面之注意事項I填寫本頁> •--I. m .Γ ..... 訂 k — 4 - 3號專利申請案 中文説明書修正頁(85年12月) 五、發明説明(2) 構上之電鍍或其他接點層的最外層表面,二者擇一。例如 ,接點表面可以是在積體電路或其他電子裝置或構裝、電
路板或諸如開關'鍵盤之類之其他型式電子裝置的接點S 或接點區域上。接點表面也可能在彈力基板或諸如顯示於 共同審理中之申請案,美國申請序號第08/294,370號, 1.994年8月23日提出申請(AUG_c_549χχ),内的元件上。顆 粒也可提供於電氣屏蔽軍 '接地平面或墊圏的導電性表面 上。 固相均質之導電性顆粒可由諸如金、銀' 鉑及鈀的貴金 屬’諸如銅、鎳及鐵的其他金屬,或者諸如碳化鎢或.碳化 鉻的導電性化合物组成。諸如鈷、铜或銀钓金屬填充劑可 添加至碳化物以增加導電度。顆粒尺寸可以自約2〇〇微英 吋變化至約1微英吋或更小。顆粒尺寸應比氧化物或其他 染覆蓋層的厚度更大㈣合下方的接點表面。氧化物厚 度會相當程度地變動,且典型會是在约1〇〇埃至約〗密耳的 範固中。顆粒的硬度典型是在約100-7000努普單位的範圍 中。不同尺寸的顆粒可一起使用且任意地施加至接點表面 。顆粒可能以連續性層或以非連續性層位於接點表面上。 經濟部中央標準局員工消費合作社印製 囉合粒狀表面之相匹配的接點表面可本身即爲類似的粒 狀表面或者是非顆粒覆蓋的接點表面。 導雷性顆粒可施加至導電性以及非料性基板。就與非 導電性基板並用兩言’顆粒可作爲唯一的導電層,或者導 電性顆粒可提供於自身位於非導電性基板上之中間導電性 電鍍或其他層上。 A7 B7 7五、發明説明(3 ) — •里^説明 圖1敘述用於接觸插人之末端接腳之具體實施本發 輪狀環; 圖2敘迆*有具體實施本發明之接點的板對板連接器; 圖2a是圖2之連接器之另—種接點結構的部分正視圖; .圖3顯示具有根據本發明之㈣區域㈣卡端緣連接器 , 圖4a至4d顯示具體實施本發明之末端接腳互連器 個視圖; 圖5敘述具有具體實施本發<彈力接點尖端的測試探針 圖6a及6b敘述具體實施本發明的彈力互^器;及 圖7d7e敘述具亦根據本發明之接點區域的電氣開 裝置。 · 關 訂 nn· I^K It— n ·κ m 11 f襞 (請先閲讀背面之注意事項t填寫本頁)
Du —HI— I- 經濟部中央揉準局員工消費合作社印製 蔓細説明 參考圖1,其處顯示連接於印刷.電路板34之一條或多 電路線32的輪狀環30。該„繞著穿透電路板的孔洞排η 且於其中插入有電氣或電子裝置的引腳35。該環由諸如發 橡膠之材料-製成的彈力環心組成,在環的表面上具有柔 的導電性塗覆或層。穿透輪狀環的開口比要插人其中之 氣引腳或接腳的直徑稍小,如此在插入之引腳和環繞之 之間提供壓縮力量以使引腳保持於定位。 柔勒的導電性層較好以化學接枝技術提供,藉其在環 表面上提供金屬化。導電性塗覆也可藉由諸如含浸、噴 列 勒 電 環 的 ·· Q ·· .水.紙張尺度適用中 • 1 K nff 312891 R: A7 B7 發明説明( 經濟部中央標準局員工消費合作.社印製 印刷、滾筒塗俾、網版印刷、或 其技術本身在該技藝中爲人所知。將而施加’ 雷ίΗ: Μ、 、 將粒狀層提供於環的導 個例子:ν在導電性層的諸接點部分之上,在這 "且成=二圓周壁36。粒狀由導電及均質的堅硬顆 :組成,其具有比相匹配之接點表面或諸表面之硬度更大 :硬度。在—個具體實施例中,顆粒是含有分散於其中之 諸如銅或銀之金屬的碳切。典型在约跡7嶋努普單位 之範圍中的硬度是合適的。較好,將顆粒電漿射出到 性塗覆上。 導電性塗覆足夠地柔韌和有彈力而不會妨礙環心材料的 彈回。當與相匹配之電氣引腳接觸時,環會恩縮,且當離 開ES配之接觸時,會膨脹,而不會有環表面上之導電性塗 覆的脱落或裂開。 - 有彈力的互連環可藉由將環心材料模製成須要的形狀而 加以製造。金屬化較好藉由化學接枝施加至環表面,然後 將粒狀層施加至金屬化層的表面。銅或其他金屬可選擇性 地在粒狀層的施加之前加以無電電鍍至金屬化層上。 另一個具體實施例敘述於圖2中,其顯示出一個直角式 板對板連接器,其包括由諸如Fr_4、鐵氟龍(pTFE)或酚樹 脂之合適介電材料形成的連接器本體8〇,其在第一平面 上具有以預定之圖樣排列的很多導電性接點區域84,且其 經_導電線86電氣連接至提供於本禮之正交平面9,〇上的相 對應接點區域88。在使用上,接點區域84匹配於印刷電路 板100的相對應接點區域,且接點區域88匹配於印刷電路 (請先閲讀背面之注意事項再填寫本頁) •裝——
UK .m nn- D 訂-- 本-紙張尺度適用中_國家杯準(CNS ) △々洗格(2. 10X297公麓) • ml it n m n
五、發明説明(5 A7 B7 經濟部中央揉準局貝工消費合作社印製 =02的相對應接點區域。由兩塊電路板和連接器本體組 色的五連組件以合適的機構(未顯示)予以維持且該機構自 身在連接器領域中爲人所知。 接點區域S4及88具有提供於其中之接路表面上的粒狀層 。於其上形成接點區域84及88的本體表面可具有高起的底 座區域且底座區域可具有彈力層,在彈力層上提供有導 電性接點層。參考圖2a,其處顯示具有高起之底座81之連 接器本體8〇之-個表面的一部分。彈力層们提供於底座的 外側表面上,且在彈力層之上提供具有根據本發明埋置其 上(顆粒的導電性層85。或者,連接器本體80可本身即由 有彈力或彈性體的材料製成,其在接點區域與相關電路板 的嚷合期間受到壓縮以提供接點壓力。 參考圖3,顯示出插卡端緣連接器,其包含彈性體材料' 製成的本體H0,具有很多高起的為條112,於其每一條上 提供導體m。導體,如圖示,向下延伸過本體的各個側 面並穿過本體之底部部分中的開口並從此沿著本體的底部 表面。粒狀層提供於導體114的至少諸接點部分u5上。 具有對應於連接器接點區域之接點區域的電路板或電路卡 插入,進人-連接器本體中,用於與連接器之各個接點部 U5的嚆合》所敘述的插卡端緣連接器在相對側面上具 接點以嗡合雙面電路板或卡的相對接點區域列。將可乂 到,,單側連接器也可提供以嚅合並接觸單面電路卡。辨 其他的連接器構造也預期可適應各種的電氣不各 用及構造。 分有
Λ 1 I -I -I -m. ml ‘丨!- .- -11 s J·— -·1 .......--- 1 c (請先閲讀背面之注意事項再填寫本頁j ....... 1 — 1 I ------ 訂—
·:1 ....... -H I -8 本紙張尺農適用中國國家摞準(C.NS ) Μ規格 第8射利申請案 中文説明書修正頁(85年12月) 五、發明説明(6) 另外一個具體實施例敘述於圖乜到4d,於其中將導電性 粒狀塗覆提供於母插或互連器120的開口之内。互連器本 體120具有很多穿透本體的孔洞122,每一個孔洞具有導電 性表面,表面帶有粒狀塗覆124,用於匹配之連接器12 8 之相對應電氣接脚126的電氣接觸。每一個互連開口的導 電性表面中止於背侧表面上,形成輪狀接點區域13〇,用 於與適當的電路板或其他互連器匹配。每一個連接器開口 可具有向外開展的入口斷面132,其同樣具有導電性塗覆 »粒狀塗覆124也可提供於區域130的接點表面上。 .參考圖5,其處顯示出具有探針本髏140和固定於一端端 點處之彈性體圓球形探針尖端142的電氣剛試探針。尖端 是一種具有導電性表面及粒狀覆的彈性體球。探針本體具 有導電性表面或者可能由諸如金屬的導電性材料製成。探 針本體留置於合適的固定物之内以使尖端定位於接點區域 之上並壓縮尖端於接點區域上,用於與接點區域的電氣嚷 合0 經濟部中央梯準局貝工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) f 帶有導電性粒狀表面的彈性體球也可埋置於如圖6&及6b 中所顯示的互連裝置中。球150留置於插入具有導電塾154 之印刷電路板152和也具有導電墊158之電子裝置156之間 的合適外軍(未顯示)之内。裝置受力向印刷電路板施力致 使彈性體球偏斜,因此裝置和電路板的導電墊區域藉由置 入其間的導電性球而互相連接。裝置藉由合適的插座機構 (未顯示)與電路板保持接觸囉合。 本發明也可方便地使用於電氣開關的製造中,諸如圖7& -9 - 本紙張^度適用中國國家標準(CNS ) A4规格(210X29?公釐) B7 .五、發明説明( 到7c中所顯示。在這些開關的每一個中,將一個或多個導 電性粒狀接點區域159施加至開關起動器161。一種按鈕開 關顯示於圖7a中,於其中導電性粒狀接點區域159提供於 起動器上。當起動器手動按壓時’接點區域噶合開關末端 的相面對接點區域163。將可認知到,各種的開關構造可 用以提供預期的間關操作。一種滑移式開關顯示於圖%中 ’於其中可滑移的起動器165在各個.端點上包括粒狀接點 區域167。一種捺跳開關描繪於圖.7c中,於其中捺跳機構 17〇包括粒狀接點區域172。開關末端的接點區域174也可 具有能與起動器之粒狀層匹配的粒狀層。 本發明不受限於所已經特別加以顧示及說明者,因爲變 化及另的外的施行方法對具有此技藝者而言,將可在不偏離 本發明A眞正範疇之下出現。 本紙張錢適用中_家標单( CNS ) A4雜(210X297^7

Claims (1)

  1. 第S4112896號專利申請案 - 中文申請專利範圍修正本(86年4月) JV-.A π‘11 8 8 8« ABCD 六、申請專利範圍 經濟部中央標準局貝工消費合作社印裂 1. —種電氣接點,包含: 具有接點表面的基板; 永久性地施加很多固相均質導電性顆粒至接點表面以 提供導電性接點區域,其中該導電性顆粒之硬度範固约 在100〜7000努普單位之間,其尺寸可以自約2〇〇微英 吋至约1微英吋或更小,且顆粒尺寸應比氧化物或其他 污染覆蓋層的厚度更大以嚙合下方之接點表面。 2. 根據申請專利範圍第i項之電氣接點,於其中導電性顆粒 以特高速氧燃氣噴覆接合於接點表面。 3. 根據申請專利範圍第i項之電氣接點 以電漿噴覆接合於接點表面。 4·根據申請專利範圏第1項之電氣接點 .”, 具有以努普單位量測而比接點材料更大的硬度 5. 根據申請專利範圍第!項之電氣接點,於其中導電性顆粒 是由含有分散於其中之導電性材料的碳化矽所组成。 6. 根據申請專利範園第!項之電氣接點,於其中導電性顆粒 是由貴金屬所组成。 7·根據申請專利範圍第1項之雷盏垃 . , 岡矛i 本點,於其中導電性顆粒 疋由導電性化合物所组成。 、 —種電路板,包含: ·, 具有表面的絕緣性基板;_ 在表面上的很多電氣接點區域; 永久性地施加很多固相均質導電性 银.站h域,该顆粒具有以努普 早彳量測而比電氣接點 '於其中導雷i生顆粒 於其中導電性顆粒 n n m I— i - i I J— n I— n HI I ^ -1 n (请先閲讀背面之注項再填寫本頁) 8. 氣 區 42022.DOC
    312891 Α8 Β8 C8 D8 六、申請專利範圍 域之接點材料硬度更大的硬度;其中該導電性顆粒之硬 度範菌約在100〜7 000努普單位之間,其尺寸可以自約 200微英叶至约i微英对或更小,且顆粒尺寸應比氧化 物或其他污染覆蓋層的厚度更大以嚙合下方之接點表 面。 9. 根據中請專利範圍第8項之電路板,於其中基板是剛性的 且更包括在基板表面和電乳接點區域之間的彈力層。 10. —種電氣裝置,包含: 電氣絕緣性材料製成的基板; 在基板之至少一部分上的電氣接點材料; 永久性地施加很多固相均質導電性顆粒至電氣接點材 料以提供導電性粒狀接點區域,其中該導電性顆粒之硬 度範園约在100〜7000努普單位之間,其尺寸可以自约 200微英叶至约ί微英忖或更小,且顆粒尺寸應比氧化 物或其他污染覆蓋層的厚度更大以嚙合下方之接點表 面0 (請先閲讀背面之注意事項再填寫本頁) 1 n . 訂-- A 經濟部中央揉準局員工消費合作社印製 2 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
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