TW408855U - Chip scale package with die pad - Google Patents

Chip scale package with die pad

Info

Publication number
TW408855U
TW408855U TW88202421U TW88202421U TW408855U TW 408855 U TW408855 U TW 408855U TW 88202421 U TW88202421 U TW 88202421U TW 88202421 U TW88202421 U TW 88202421U TW 408855 U TW408855 U TW 408855U
Authority
TW
Taiwan
Prior art keywords
die pad
chip scale
scale package
package
chip
Prior art date
Application number
TW88202421U
Other languages
Chinese (zh)
Inventor
Rung-Jen Juang
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88202421U priority Critical patent/TW408855U/en
Publication of TW408855U publication Critical patent/TW408855U/en

Links

TW88202421U 1999-02-11 1999-02-11 Chip scale package with die pad TW408855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88202421U TW408855U (en) 1999-02-11 1999-02-11 Chip scale package with die pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88202421U TW408855U (en) 1999-02-11 1999-02-11 Chip scale package with die pad

Publications (1)

Publication Number Publication Date
TW408855U true TW408855U (en) 2000-10-11

Family

ID=21644983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88202421U TW408855U (en) 1999-02-11 1999-02-11 Chip scale package with die pad

Country Status (1)

Country Link
TW (1) TW408855U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package
US8748227B2 (en) 2001-03-30 2014-06-10 Megit Acquisition Corp. Method of fabricating chip package
US8912666B2 (en) 2001-03-30 2014-12-16 Qualcomm Incorporated Structure and manufacturing method of chip scale package
US9018774B2 (en) 2001-03-30 2015-04-28 Qualcomm Incorporated Chip package

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees