US5215244A - Method of mounting silicon wafers on metallic mounting surfaces - Google Patents

Method of mounting silicon wafers on metallic mounting surfaces Download PDF

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US5215244A
US5215244A US07/840,327 US84032792A US5215244A US 5215244 A US5215244 A US 5215244A US 84032792 A US84032792 A US 84032792A US 5215244 A US5215244 A US 5215244A
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valve body
wafer
intermediate element
major surface
applying
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US07/840,327
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Juergen Buchholz
Hans-Peter Trah
Wolfgang Klucken
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00—Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16—Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/166—Selection of particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00—Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16—Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/168—Assembling; Disassembling; Manufacturing; Adjusting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M61/00—Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
    • F02M61/16—Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
    • F02M61/18—Injection nozzles, e.g. having valve seats; Details of valve member seated ends, not otherwise provided for
    • F02M61/1853—Orifice plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0073—Fabrication methods specifically adapted for microvalves
    • F16K2099/0074—Fabrication methods specifically adapted for microvalves using photolithography, e.g. etching
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0082—Microvalves adapted for a particular use
    • F16K2099/0096—Fuel injection devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0133—Ternary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Definitions

  • the present invention relates generally to methods of mounting semiconductor wafers on a metallic surface and, more particularly, to an improved method of securing silicon wafers used in making valves, such as those used in fuel injection.
  • FIGS. 12 and 15 of this disclosure indicate that the silicon wafers 81, 152 are clamped against the valve body.
  • the method of the present invention for mounting of silicon wafers on metallic mounting surfaces represents an advantageous possibility for coupling of micromechanical silicon structures, e.g. aperture plates or valves, to valve bodies made according to classical precision mechanical manufacturing methods.
  • a semiconductor e.g. silicon
  • a metal element such as a valve body
  • a metal coating is first applied to the silicon, and the metal coating is then soldered to the metal valve body, which results in a more permanent solder bond.
  • Another advantageous feature is the use of an intermediate element, through which the silicon wafer is secured to the valve body. It is desirable to select, as the material for the intermediate element, one whose thermal coefficient of expansion is compatible with the coefficients of the silicon wafer and of the valve body.
  • the intermediate element can thus "buffer" any differences in the coefficients of the silicon and of the metal.
  • a particularly tension-free or stress-free assembly can be achieved using a deep-drawn or otherwise curved element which serves to clamp the silicon wafer against the valve body.
  • the silicon wafer is preferably soldered to the intermediate element, and the element is subsequently secured to the valve body in a region surrounding the silicon wafer.
  • the resulting arrangement is that the silicon wafer is fixed with respect to the valve body, yet not directly connected. This can, for example, keep an aperture in the wafer aligned with the center of a passage or conduit formed in the valve.
  • FIGS. 1 and 2 illustrate silicon wafers directly connected to a valve body
  • FIGS. 3 and 4 illustrate alternative implementations of assembly of silicon wafers to a valve body using an intermediate element.
  • valve body 20 is formed with a central bore 21.
  • This valve body is conventionally made from metal by precision mechanical methods, but may also be made from another material, for example plastic.
  • the significant feature is that valve body 20 has a metallic mounting surface, onto which a silicon wafer 10 is to be secured.
  • silicon wafer 10 is structured, and serves as aperture plate in the valve structure.
  • the method of the invention is, however, also usable for silicon wafers with other structures and functions.
  • Silicon wafer 10 has, on its major surface adjacent valve body 20, a metal coating or layer 11. This metal coating 11 can be, for example, chromium, nickel, or gold, applied by any of several conventional methods, such as vapor deposition.
  • This metallized major surface of wafer 10 is soldered to the metallic mounting surface of the valve body.
  • a solder layer 15 is thereby created between silicon wafer 10 and valve body 20.
  • a solder frame 17 is placed on the surface of valve body 20. This solder frame 17 serves as a positioning aid for silicon wafer 10, which is justified with valve body 20 before connection, in order that the aperture of silicon wafer 10 and bore 21 in valve body 20 will be centrally aligned with respect to each other.
  • FIG. 2 represents a valve structure as in FIG. 1, but with an additional positioning aid, consisting of a casing 27 of valve body 20.
  • Casing 27 projects outward from the mounting surface of valve body 20, so that solder frame 17 can be simply fitted or applied inside the perimeter defined by casing 27.
  • Casing 27 can be, for example, a small aluminum tube.
  • silicon wafer 10 was initially soldered, with its metallized major surface, against the metallic mounting surface of an intermediate element 25.
  • a solder frame 17, for positioning of silicon wafer 10, is applied to intermediate carrier or element 25. Thereafter, intermediate element 25 is secured to valve body 20, which can be accomplished by, for example, laser welding of local areas.
  • the material of intermediate element 25 is so chosen that, in the event of temperature fluctuations, element 25 mediates any differences in thermal expansion/contraction coefficients of silicon wafer 10 and valve body 20, and thus minimizes mechanical stresses between silicon wafer 10 and valve body 20.
  • a suitable "buffer" or intermediate element 25 is the material sold under the trademark KOVAR (U.S. TM Reg. No. 337,962 of Carpenter Technology Corp., Reading, Pa., for an alloy containing about 54% iron, 28% nickel and 18% cobalt).
  • FIG. 4 also has an intermediate element 25' but, in contrast to the planar intermediate element 25 of FIG. 3, this element 25' is domed or bowed over the valve body.
  • the metallized major surface of silicon wafer 10 faces away from valve body 20, and the metallized surface is soldered to the undersurface of element 25', that is, to another portion of the same surface of element 25' which faces valve body 20.
  • Element 25' is then connected to valve body 20 in a region surrounding silicon wafer 10.
  • silicon wafer 10 is arranged between valve body 20 and intermediate element 25', and is secured to element 25' but not directly to valve body 20. Due to the connection of element 25' to valve body 20, the position of silicon wafer 10 and its aperture, with respect to valve body 20 and its bore 31, is fixed. This structure is particularly stress-free, since no direct, fixed connection exists between silicon wafer 10 and valve body 20, but rather only an indirect connection via element 25'. No harm arises if a steel valve body expands more, in response to a temperature rise, than silicon wafer 20 expands.
  • solder connection between silicon wafer 10 and the metallic mounting surface can be either over the entire surface or in localized areas, as appropriate.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Theoretical Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Valve Housings (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
  • Magnetically Actuated Valves (AREA)
  • Sliding Valves (AREA)

Abstract

A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.

Description

CROSS-REFERENCE TO RELATED PATENT AND APPLICATION, THE DISCLOSURES OF WHICH ARE HEREBY INCORPORATED BY REFERENCE
U.S. Pat. No. 4,647,013, GIACHINO & KRESS/FORD, Mar. 3, 1987, entitled SILICON VALVE;
U.S. Ser. No. 07/756,490, GERSTNER et al./BOSCH, Sep. 9, 1991.
FIELD OF THE INVENTION
The present invention relates generally to methods of mounting semiconductor wafers on a metallic surface and, more particularly, to an improved method of securing silicon wafers used in making valves, such as those used in fuel injection.
BACKGROUND
From U.S. Pat. No. 4,647,013, it is known to use, in combination with a macromechanical valve body, structured silicon wafers which are components of a micromechanical valve. FIGS. 12 and 15 of this disclosure indicate that the silicon wafers 81, 152 are clamped against the valve body.
The method of the present invention for mounting of silicon wafers on metallic mounting surfaces represents an advantageous possibility for coupling of micromechanical silicon structures, e.g. aperture plates or valves, to valve bodies made according to classical precision mechanical manufacturing methods.
THE INVENTION
It is an object of the present invention to secure a semiconductor, e.g. silicon, element to a metal element, such as a valve body, preferably in a way that facilitates proper alignment and minimizes problems arising from differing thermal coefficients of expansion. Soldering is more secure than clamping, but sometimes solder does not stick to silicon well.
Accordingly, in the method of the present invention, a metal coating is first applied to the silicon, and the metal coating is then soldered to the metal valve body, which results in a more permanent solder bond.
Another advantageous feature is the use of an intermediate element, through which the silicon wafer is secured to the valve body. It is desirable to select, as the material for the intermediate element, one whose thermal coefficient of expansion is compatible with the coefficients of the silicon wafer and of the valve body. The intermediate element can thus "buffer" any differences in the coefficients of the silicon and of the metal. A particularly tension-free or stress-free assembly can be achieved using a deep-drawn or otherwise curved element which serves to clamp the silicon wafer against the valve body. The silicon wafer is preferably soldered to the intermediate element, and the element is subsequently secured to the valve body in a region surrounding the silicon wafer. The resulting arrangement is that the silicon wafer is fixed with respect to the valve body, yet not directly connected. This can, for example, keep an aperture in the wafer aligned with the center of a passage or conduit formed in the valve.
DRAWINGS
FIGS. 1 and 2 illustrate silicon wafers directly connected to a valve body; and
FIGS. 3 and 4 illustrate alternative implementations of assembly of silicon wafers to a valve body using an intermediate element.
DETAILED DESCRIPTION
In FIG. 1, a valve body 20 is formed with a central bore 21. This valve body is conventionally made from metal by precision mechanical methods, but may also be made from another material, for example plastic. The significant feature is that valve body 20 has a metallic mounting surface, onto which a silicon wafer 10 is to be secured. In this and all following examples, silicon wafer 10 is structured, and serves as aperture plate in the valve structure. The method of the invention is, however, also usable for silicon wafers with other structures and functions. Silicon wafer 10 has, on its major surface adjacent valve body 20, a metal coating or layer 11. This metal coating 11 can be, for example, chromium, nickel, or gold, applied by any of several conventional methods, such as vapor deposition. This metallized major surface of wafer 10 is soldered to the metallic mounting surface of the valve body. A solder layer 15 is thereby created between silicon wafer 10 and valve body 20. In the example shown in FIG. 1, a solder frame 17 is placed on the surface of valve body 20. This solder frame 17 serves as a positioning aid for silicon wafer 10, which is justified with valve body 20 before connection, in order that the aperture of silicon wafer 10 and bore 21 in valve body 20 will be centrally aligned with respect to each other.
FIG. 2 represents a valve structure as in FIG. 1, but with an additional positioning aid, consisting of a casing 27 of valve body 20. Casing 27 projects outward from the mounting surface of valve body 20, so that solder frame 17 can be simply fitted or applied inside the perimeter defined by casing 27. Casing 27 can be, for example, a small aluminum tube.
For the structure shown in FIG. 3, silicon wafer 10 was initially soldered, with its metallized major surface, against the metallic mounting surface of an intermediate element 25.
A solder frame 17, for positioning of silicon wafer 10, is applied to intermediate carrier or element 25. Thereafter, intermediate element 25 is secured to valve body 20, which can be accomplished by, for example, laser welding of local areas. Preferably, the material of intermediate element 25 is so chosen that, in the event of temperature fluctuations, element 25 mediates any differences in thermal expansion/contraction coefficients of silicon wafer 10 and valve body 20, and thus minimizes mechanical stresses between silicon wafer 10 and valve body 20. For example, if valve body 20 is steel, a suitable "buffer" or intermediate element 25 is the material sold under the trademark KOVAR (U.S. TM Reg. No. 337,962 of Carpenter Technology Corp., Reading, Pa., for an alloy containing about 54% iron, 28% nickel and 18% cobalt).
The structure shown in FIG. 4 also has an intermediate element 25' but, in contrast to the planar intermediate element 25 of FIG. 3, this element 25' is domed or bowed over the valve body. The metallized major surface of silicon wafer 10 faces away from valve body 20, and the metallized surface is soldered to the undersurface of element 25', that is, to another portion of the same surface of element 25' which faces valve body 20.
Element 25' is then connected to valve body 20 in a region surrounding silicon wafer 10. Thus, silicon wafer 10 is arranged between valve body 20 and intermediate element 25', and is secured to element 25' but not directly to valve body 20. Due to the connection of element 25' to valve body 20, the position of silicon wafer 10 and its aperture, with respect to valve body 20 and its bore 31, is fixed. This structure is particularly stress-free, since no direct, fixed connection exists between silicon wafer 10 and valve body 20, but rather only an indirect connection via element 25'. No harm arises if a steel valve body expands more, in response to a temperature rise, than silicon wafer 20 expands.
In all the above-described examples, the solder connection between silicon wafer 10 and the metallic mounting surface can be either over the entire surface or in localized areas, as appropriate.

Claims (8)

We claim:
1. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),
comprising the steps of
applying a metallization (11) to at least one major surface of said semiconductor wafer (10); and
soldering the thus-metallized major surface directly to said metallic mounting surface of said valve body (20).
2. Method according to claim 1,
wherein said applying step comprises applying a metal selected from the group consisting of chromium, nickel and gold.
3. Method according to claim 1, further comprising
prior to said soldering step,
applying a positioning aid (17, 27) to said metallic mounting surface, and
using said positioning aid to align an aperture formed in said silicon wafer with respect to an aperture formed in said metallic mounting surface of said body.
4. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),
comprising the steps of
applying a metallization (11) to at least one major surface of said semiconductor wafer (10);
soldering the thus-metallized major surface to a mounting surface of an intermediate element (25'); and
securing said intermediate element (25') to said valve body (20).
5. Method according to claim 4, wherein said intermediate element (25') is secured by laser welding to said valve body.
6. Method according to claim 4, wherein said intermediate element (25) is generally planar and forms a layer intermediate said valve body (20) and said wafer (10).
7. Method according to claim 4, wherein
said intermediate element (25') has first and second major surfaces, and is both soldered to said wafer (10) by said first major surface and secured to said valve body (20) by said first major surface, thereby securing said wafer (10) in position between said element (25') and said valve body (20) without directly connecting said wafer to said valve body.
8. Method according to claim 5, wherein said applying step comprises applying a metal selected from the group consisting of chromium, nickel and gold.
US07/840,327 1991-03-09 1992-02-24 Method of mounting silicon wafers on metallic mounting surfaces Expired - Fee Related US5215244A (en)

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DE4107660A DE4107660C2 (en) 1991-03-09 1991-03-09 Process for mounting silicon wafers on metallic mounting surfaces

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Cited By (32)

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US5377900A (en) * 1993-12-29 1995-01-03 At&T Corp. Method of precisely positioning and mating two workpieces
US5657358A (en) 1985-03-20 1997-08-12 Interdigital Technology Corporation Subscriber RF telephone system for providing multiple speech and/or data signals simultaneously over either a single or plurality of RF channels
US5678304A (en) * 1996-07-24 1997-10-21 Eastman Kodak Company Method for manufacturing double-sided circuit assemblies
US5842137A (en) * 1986-08-07 1998-11-24 Interdigital Technology Corporation Subscriber unit for wireless digital telephone system
US5852604A (en) 1993-09-30 1998-12-22 Interdigital Technology Corporation Modularly clustered radiotelephone system
US6505811B1 (en) 2000-06-27 2003-01-14 Kelsey-Hayes Company High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
US6523560B1 (en) 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
US6761420B2 (en) 1998-09-03 2004-07-13 Ge Novasensor Proportional micromechanical device
US20050121090A1 (en) * 2000-03-22 2005-06-09 Hunnicutt Harry A. Thermally actuated microvalve device
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US20060022160A1 (en) * 2004-07-27 2006-02-02 Fuller Edward N Method of controlling microvalve actuator
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US20080042084A1 (en) * 2004-02-27 2008-02-21 Edward Nelson Fuller Hybrid Micro/Macro Plate Valve
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US7156365B2 (en) 2004-07-27 2007-01-02 Kelsey-Hayes Company Method of controlling microvalve actuator
US20060022160A1 (en) * 2004-07-27 2006-02-02 Fuller Edward N Method of controlling microvalve actuator
US20090123300A1 (en) * 2005-01-14 2009-05-14 Alumina Micro Llc System and method for controlling a variable displacement compressor
US20060200988A1 (en) * 2005-03-11 2006-09-14 Siemens Vdo Automotive Corporation Sandwich orifice disc
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US8393344B2 (en) 2007-03-30 2013-03-12 Dunan Microstaq, Inc. Microvalve device with pilot operated spool valve and pilot microvalve
US8387659B2 (en) 2007-03-31 2013-03-05 Dunan Microstaq, Inc. Pilot operated spool valve
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US20110127455A1 (en) * 2008-08-09 2011-06-02 Microstaq, Inc. Improved Microvalve Device
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US8540207B2 (en) 2008-12-06 2013-09-24 Dunan Microstaq, Inc. Fluid flow control assembly
US8593811B2 (en) 2009-04-05 2013-11-26 Dunan Microstaq, Inc. Method and structure for optimizing heat exchanger performance
US9702481B2 (en) 2009-08-17 2017-07-11 Dunan Microstaq, Inc. Pilot-operated spool valve
US8956884B2 (en) 2010-01-28 2015-02-17 Dunan Microstaq, Inc. Process for reconditioning semiconductor surface to facilitate bonding
US9006844B2 (en) 2010-01-28 2015-04-14 Dunan Microstaq, Inc. Process and structure for high temperature selective fusion bonding
US8996141B1 (en) 2010-08-26 2015-03-31 Dunan Microstaq, Inc. Adaptive predictive functional controller
US8925793B2 (en) 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
US9404815B2 (en) 2012-03-16 2016-08-02 Zhejiang Dunan Hetian Metal Co., Ltd. Superheat sensor having external temperature sensor
US9140613B2 (en) 2012-03-16 2015-09-22 Zhejiang Dunan Hetian Metal Co., Ltd. Superheat sensor
US9772235B2 (en) 2012-03-16 2017-09-26 Zhejiang Dunan Hetian Metal Co., Ltd. Method of sensing superheat
US9188375B2 (en) 2013-12-04 2015-11-17 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly

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JPH0599347A (en) 1993-04-20
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DE4107660C2 (en) 1995-05-04
GB9204961D0 (en) 1992-04-22
DE4107660A1 (en) 1992-09-17

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