USD933726S1 - Deposition ring for a semiconductor processing chamber - Google Patents

Deposition ring for a semiconductor processing chamber Download PDF

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Publication number
USD933726S1
USD933726S1 US29/744,882 US202029744882F USD933726S US D933726 S1 USD933726 S1 US D933726S1 US 202029744882 F US202029744882 F US 202029744882F US D933726 S USD933726 S US D933726S
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United States
Prior art keywords
processing chamber
semiconductor processing
deposition ring
view
deposition
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US29/744,882
Inventor
Kirankumar Neelasandra Savandaiah
Jiao Song
David Gunther
Irena H. Wysok
Anthony Chih-Tung Chan
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/744,882 priority Critical patent/USD933726S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WYSOK, IRENA H., CHAN, ANTHONY CHIH-TUNG, GUNTHER, David, SAVANDAIAH, KIRANKUMAR NEELASANDRA
Priority to TW110300413F priority patent/TWD217572S/en
Priority to TW110304099F priority patent/TWD217686S/en
Priority to JP2021002209F priority patent/JP1704604S/en
Priority to JP2021022122F priority patent/JP1708687S/en
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Publication of USD933726S1 publication Critical patent/USD933726S1/en
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FIG. 1 is an enlarged top isometric view of a deposition ring for a semiconductor processing chamber, according to the first embodiment of the novel design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a back elevation view thereof.
FIG. 4 is a right elevation view thereof.
FIG. 5 is a left elevation view thereof.
FIG. 6 is a top plan view thereof.
FIG. 7 is a bottom plan view thereof.
FIG. 8 is an enlarged cross-sectional view thereof, taken along line 6-6 of FIG. 6.
FIG. 9 is an enlarged top isometric view of a deposition ring for a semiconductor processing chamber, according to the second embodiment of the novel design.
FIG. 10 is a front elevation view thereof.
FIG. 11 is a back elevation view thereof.
FIG. 12 is a right elevation view thereof.
FIG. 13 is a left elevation view thereof.
FIG. 14 is a top plan view thereof.
FIG. 15 is a bottom plan view thereof.
FIG. 16 is an enlarged cross-sectional view thereof, taken along line 16-16 of FIG. 14; and,
FIG. 17 is an enlarged cross-sectional view thereof, taken along line 17-17 of FIG. 14.
The dashed lines in FIGS. 1-9 represent unclaimed environment forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a deposition ring for a semiconductor processing chamber, as shown and described.
US29/744,882 2020-07-31 2020-07-31 Deposition ring for a semiconductor processing chamber Active USD933726S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/744,882 USD933726S1 (en) 2020-07-31 2020-07-31 Deposition ring for a semiconductor processing chamber
TW110300413F TWD217572S (en) 2020-07-31 2021-01-25 Deposition ring for a semiconductor processing chamber
TW110304099F TWD217686S (en) 2020-07-31 2021-01-25 Deposition ring for a semiconductor processing chamber
JP2021002209F JP1704604S (en) 2020-07-31 2021-02-01 Sedimentation ring for semiconductor processing chamber
JP2021022122F JP1708687S (en) 2020-07-31 2021-02-01 Sedimentation ring for semiconductor processing chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/744,882 USD933726S1 (en) 2020-07-31 2020-07-31 Deposition ring for a semiconductor processing chamber

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USD933726S1 true USD933726S1 (en) 2021-10-19

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US29/744,882 Active USD933726S1 (en) 2020-07-31 2020-07-31 Deposition ring for a semiconductor processing chamber

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US (1) USD933726S1 (en)
JP (2) JP1708687S (en)
TW (2) TWD217686S (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
TWD228600S (en) 2022-04-04 2023-11-11 美商應用材料股份有限公司 Baffle for anti-rotation process kit for substrate processing chamber
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1025312S1 (en) * 2022-01-31 2024-04-30 Hamilton Kent Inc. Gasket
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1034491S1 (en) * 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1049067S1 (en) 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1059312S1 (en) * 2022-08-04 2025-01-28 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing

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US20100108500A1 (en) * 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
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USD649986S1 (en) * 2010-08-17 2011-12-06 Ebara Corporation Sealing ring
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US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD694340S1 (en) * 2012-01-31 2013-11-26 Laporte Holding Target
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USD738451S1 (en) * 2014-11-11 2015-09-08 Mary Olson Golf ball target for chipping and putting
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
US20160002788A1 (en) * 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
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TWD182534S (en) 2015-05-29 2017-04-21 應用材料股份有限公司 Portion of retaining ring
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20190267220A1 (en) 2005-10-31 2019-08-29 Applied Materials, Inc. Shield for a substrate processing chamber
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20200090915A1 (en) * 2017-06-01 2020-03-19 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber

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US5803977A (en) 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD403337S (en) * 1997-08-05 1998-12-29 Applied Materials, Inc. High conductance low wall deposition upper shield
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
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USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20190267220A1 (en) 2005-10-31 2019-08-29 Applied Materials, Inc. Shield for a substrate processing chamber
US20080308416A1 (en) * 2007-06-18 2008-12-18 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US20100108500A1 (en) * 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
US20110209985A1 (en) * 2010-02-26 2011-09-01 Youming Li Physical Vapor Deposition With Heat Diffuser
USD649986S1 (en) * 2010-08-17 2011-12-06 Ebara Corporation Sealing ring
USD659175S1 (en) * 2010-08-17 2012-05-08 Ebara Corporation Sealing ring
US20150190835A1 (en) 2010-08-20 2015-07-09 Applied Materials, Inc. Extended life deposition ring
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD694340S1 (en) * 2012-01-31 2013-11-26 Laporte Holding Target
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US20160002788A1 (en) * 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
USD705280S1 (en) * 2013-07-11 2014-05-20 Ebara Corporation Sealing ring
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USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
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USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber

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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1034491S1 (en) * 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1025312S1 (en) * 2022-01-31 2024-04-30 Hamilton Kent Inc. Gasket
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
TWD228601S (en) 2022-04-04 2023-11-11 美商應用材料股份有限公司 Baffle for anti-rotation process kit for substrate processing chamber
USD1049067S1 (en) 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
TWD228600S (en) 2022-04-04 2023-11-11 美商應用材料股份有限公司 Baffle for anti-rotation process kit for substrate processing chamber
USD1059312S1 (en) * 2022-08-04 2025-01-28 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
TWD217686S (en) 2022-03-11
JP1704604S (en) 2022-01-13
TWD217572S (en) 2022-03-11
JP1708687S (en) 2022-03-01

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