GB2163907A - Making printed circuit boards - Google Patents

Making printed circuit boards Download PDF

Info

Publication number
GB2163907A
GB2163907A GB08519675A GB8519675A GB2163907A GB 2163907 A GB2163907 A GB 2163907A GB 08519675 A GB08519675 A GB 08519675A GB 8519675 A GB8519675 A GB 8519675A GB 2163907 A GB2163907 A GB 2163907A
Authority
GB
United Kingdom
Prior art keywords
foil
conductor paths
perforations
printed
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08519675A
Other versions
GB8519675D0 (en
Inventor
Gunter Warnecke
Siegfried Laborge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Germany GmbH
Original Assignee
Krone GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone GmbH filed Critical Krone GmbH
Publication of GB8519675D0 publication Critical patent/GB8519675D0/en
Publication of GB2163907A publication Critical patent/GB2163907A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method of application of conductor paths (2, 3) to both sides of a plastics foil (1). The foil (1) has, at pre-determined places, perforations (5) the walls (4) of which are plated in one operation with the printing of the conductor paths to provide an electrical connection (8) between the conductor paths (2, 3) on opposite sides (6, 7) of the foil. <IMAGE>

Description

1 GB 2 163 907 A 1
SPECIFICATION
Foil with conductor paths printed on both sides The present invention relates to a method of pro- 70 the foil.
ducing a foil onto both sides of which electrically conducting paths are printed, in which the foils are CLAIMS provided with perforations at predetermined loca tions, and the conductor paths on both sides of the foil are conductively connected together through the perforations. The invention also relates to a foil intended to receive printed-on conductor paths, and perforations disposed at predetermined loca tions.
Such foils, an example of which is disclosed in 80 German Offen legu ngssch rift No. 22 41 333, are used, for example, in push-button c ' ontrol units of telephone instruments, for the purpose that the conductor paths printed on one side of the foil may cross the conductor paths printed on the other side of the foil, without interfering contacts being effected. In such a construction it is difficult to produce through-connections, i.e. the electri cally-conductive connections from the upper side of the foil to the underside of the foil through the 90 perforations. In the known method the perforations are first filled out or netted by hand, and dried, and then the foils are printed with the conductor paths in a second process step.
An object of the present invention is to provide a 95 simple method by means of which a foil may be printed on both sides with conductor paths which are in contact together at pre-determined places, as.well as to produce a foil which is suitable for the carrying out of the method.
In the method of the present invention the conductor paths and the netting of the walls of the perforations constituting an electrical ly- conductive connection between the upper side of the foil and the underside of the foil are produced in one printing process. A foil suitable for the production of conductor paths according to this method advantageously has a thickness of 0.05 to 0.15 mm, and preferably of 0.1 mm.
The invention will now be described by way of example with reference to the accompanying drawing.
A plastics foil 1 represented in cross-section in the drawing has a thickness of material of approxi- mately 0.05 to 0.15 mm preferably O.lmm. Conductor paths 2 are printed on the upper side 6. Similarly, conductor paths 3 are printed on the underside 7. The foil 1 is provided at pre-determined places with perforations 5, the perforation walls 4 of which each have a coating 8 of conductor material. The coating 8 constitutes an electrical ly-conductive connection between the upper conductor path 2 and the lower conductor path 3. The remaining area of the perforations 5 affords free pas- sage.
The conductor paths 2 and 3, as well as the nettings 8, are applied in a single printing process. The plastic foil 1, which is represented considerably enlarged in the drawing, is only about 0.1 mm thick. Thereby, the walls of the perforations 4 are wetted at the same time as the printing and, by means of a simple, quickly-performed process a reliable electrically-conducting connection is effected between the upper side 2 and the underside 3 of 1. A method of producing a foil onto both sides of which electrically-conducting paths are printed, in which the foils are provided with perforations at predetermined locations, and the conductor paths on both sides of the foil are conductively connected together, wherein the conductor paths and the plating or wetting of the walls of the perforations constituting electrical ly-conductive connections between the upper side of the foil and the underside of the foil are produced in one printing process.
2. A foil intended to receive printed-on conductor paths and perforations placed at predetermined locations, wherein the foil has a thickness in the range 0.05 to 0.15 mm, preferably 0.1 mm.
3. A method of manufacturing a double sided printed circuit foil or film having perforations at predetermined locations at which electrical connections are formed between conductor paths on opposite sides of the element wherein the walls of the perforations are plated with an electrically conductive material at the same time as the paths are printed.
4. A double sided printed circuit foil having electrically conductive paths printed on both sides thereof and perforatons at predetermined locations, wherein the walls of the perforations have an electrically conductive coating which is applied simultaneously with the printing of the conductor paths.
5. A method of producting a printed circuit foil substantially as herein described with reference to the drawing.
Printed in the UK for HMSO, D8818935, 1186, 7102. Published by The Patent Office, 25 Southampton Buildings, London, WC2A lAY, from which copies may be obtained.
GB08519675A 1984-08-08 1985-08-06 Making printed circuit boards Withdrawn GB2163907A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843429236 DE3429236A1 (en) 1984-08-08 1984-08-08 FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE

Publications (2)

Publication Number Publication Date
GB8519675D0 GB8519675D0 (en) 1985-09-11
GB2163907A true GB2163907A (en) 1986-03-05

Family

ID=6242632

Family Applications (2)

Application Number Title Priority Date Filing Date
GB08504311A Withdrawn GB2163007A (en) 1984-08-08 1985-02-20 Sheet with printed conductors on both sides and method of forming interconnections between the conductors
GB08519675A Withdrawn GB2163907A (en) 1984-08-08 1985-08-06 Making printed circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB08504311A Withdrawn GB2163007A (en) 1984-08-08 1985-02-20 Sheet with printed conductors on both sides and method of forming interconnections between the conductors

Country Status (3)

Country Link
JP (1) JPS6148997A (en)
DE (1) DE3429236A1 (en)
GB (2) GB2163007A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2146560A1 (en) * 2008-07-16 2010-01-20 Samsung Electronics Co., Ltd. Method for Fabricating Printed Circuit Board

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754872B2 (en) * 1987-06-22 1995-06-07 古河電気工業株式会社 Method for manufacturing double-layer printed circuit sheet
JPH031876U (en) * 1989-05-27 1991-01-10
JPH0635499Y2 (en) * 1989-08-09 1994-09-14 ファイン電子株式会社 Double sided printed circuit board
FR2654296B1 (en) * 1989-11-03 1992-01-10 Horlogerie Photograph Fse TWO - SIDED PRINTED CIRCUIT, AND METHOD FOR THE PRODUCTION THEREOF.
DE59309575D1 (en) * 1992-06-15 1999-06-17 Heinze Dyconex Patente METHOD FOR PRODUCING CIRCUIT BOARDS USING A SEMI-FINISHED PRODUCT WITH EXTREMELY TIGHT WIRING FOR THE SIGNALING
DE19539181C2 (en) * 1995-10-20 1998-05-14 Ods Gmbh & Co Kg Chip card module and corresponding manufacturing process
DE10122414A1 (en) * 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Through connection of flexible printed circuit boards
JP4308716B2 (en) * 2004-06-09 2009-08-05 新光電気工業株式会社 Manufacturing method of semiconductor package
EP1814447A2 (en) * 2004-11-23 2007-08-08 Nessler Medizintechnik GmbH Process for through hole plating an electrically insulating substrate material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29784E (en) * 1968-11-01 1978-09-26 International Electronics Research Corp. Thermal dissipating metal core printed circuit board
EP0000673A1 (en) * 1977-07-28 1979-02-07 Societe Anonyme De Telecommunications (S.A.T.) Process for manufacturing printed circuits with metallised holes starting from isolated substrates having a synthetic glass-resin multilayer structure
GB2086139A (en) * 1980-03-04 1982-05-06 Kollmorgen Tech Corp Method of producing printed circuit boards with holes having metallized walls
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
WO1983003040A1 (en) * 1982-02-26 1983-09-01 Serras Paulet Edouard Printed electric circuit
WO1985001415A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2241333A1 (en) * 1972-08-23 1974-03-21 Philips Patentverwaltung METHOD FOR ESTABLISHING AN ELECTRICALLY CONDUCTIVE CONNECTION BETWEEN TWO PARTS OF CURRENT PATHS OF THE SAME CONDUCTOR TRACK LAYING ON A CARRIER PLATE
DE2311736A1 (en) * 1973-03-06 1975-03-27 Berthold Ulrich METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS
DD112576A1 (en) * 1974-06-17 1975-04-12
DE2548258A1 (en) * 1975-10-28 1977-05-05 Siemens Ag METHOD FOR MANUFACTURING MULTI-LAYER MICROWIRINGS
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector
JPS5612797A (en) * 1979-07-12 1981-02-07 Matsushita Electric Ind Co Ltd Multilayer printed circuit board and method of manufacturing same
DE3245458A1 (en) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Method for producing through-plated contacts in thick-film technology

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29784E (en) * 1968-11-01 1978-09-26 International Electronics Research Corp. Thermal dissipating metal core printed circuit board
EP0000673A1 (en) * 1977-07-28 1979-02-07 Societe Anonyme De Telecommunications (S.A.T.) Process for manufacturing printed circuits with metallised holes starting from isolated substrates having a synthetic glass-resin multilayer structure
GB2086139A (en) * 1980-03-04 1982-05-06 Kollmorgen Tech Corp Method of producing printed circuit boards with holes having metallized walls
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
WO1983003040A1 (en) * 1982-02-26 1983-09-01 Serras Paulet Edouard Printed electric circuit
WO1985001415A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2146560A1 (en) * 2008-07-16 2010-01-20 Samsung Electronics Co., Ltd. Method for Fabricating Printed Circuit Board
US8474135B2 (en) 2008-07-16 2013-07-02 Samsung Electronics Co., Ltd Method for fabricating printed circuit board

Also Published As

Publication number Publication date
DE3429236A1 (en) 1986-02-13
GB2163007A (en) 1986-02-12
GB8504311D0 (en) 1985-03-20
GB8519675D0 (en) 1985-09-11
JPS6148997A (en) 1986-03-10

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)